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TGD N-Channel Enhancement Mode Power MOSFET Description The uses advanced trench technology and design to provide excellent R DS(ON) with low gate charge. It can be used in a wide variety of applications. General Features V DS =60V,I D =7A R DS(ON) < 30mΩ @ V GS =10V (Typ:22mΩ) R DS(ON) < 35mΩ @ V GS =4.5V (Typ:27mΩ) Schematic diagram High density cell design for ultra low Rdson Fully characterized avalanche voltage and current Low gate to drain charge to reduce switching losses Application Power switching application Hard switched and high frequency circuits Uninterruptible power supply pin assignment SOP-8 top view Package Marking and Ordering Information Device Marking Device Device Package Reel Size Tape width Quantity SOP-8 Ø330mm 12mm 2500 units Absolute Maximum Ratings (T A =25 unless otherwise noted) Parameter Symbol Limit Unit Drain-Source Voltage VDS 60 V Gate-Source Voltage VGS ±20 V Drain Current-Continuous I D 7 A Drain Current-Continuous(T C =100 ) I D (100 ) 5 A Pulsed Drain Current I DM 40 A Maximum Power Dissipation P D 2.1 W Operating Junction and Storage Temperature Range T J,T STG -55 To 150 Thermal Characteristic Thermal Resistance,Junction-to-Ambient (Note 2) R θja 60 /W

Electrical Characteristics (T A =25 unless otherwise noted) Off Characteristics Parameter Symbol Condition Min Typ Max Unit Drain-Source Breakdown Voltage BV DSS V GS =0V I D =250μA 60 69 - V Zero Gate Voltage Drain Current I DSS V DS =60V,V GS =0V - - 1 μa Gate-Body Leakage Current I GSS V GS =±20V,V DS =0V - - ±100 na (Note 3) On Characteristics Gate Threshold Voltage V GS(th) V DS =V GS,I D =250μA 1.0 1.4 2.0 V Drain-Source On-State Resistance R DS(ON) V GS =10V, I D =7A 22 30 mω V GS =4.5V, I D =6A 27 35 mω Forward Transconductance g FS V DS =5V,I D =7A 20 - S Dynamic Characteristics (Note4) Input Capacitance C lss 1920 PF V DS =25V,V GS =0V, Output Capacitance C oss 155 PF F=1.0MHz Reverse Transfer Capacitance 116 PF Switching Characteristics (Note 4) C rss Turn-on Delay Time t d(on) - 8 - ns Turn-on Rise Time t r V DS =30V, R L =4.7Ω - 5 - ns Turn-Off Delay Time t d(off) V GS =10V,R GEN =3Ω - 29 - ns Turn-Off Fall Time t f - 6 - ns Total Gate Charge Q g V DS =30V,I D =7A, - 50 - nc Gate-Source Charge Q gs V GS =10V - 8 - nc Gate-Drain Charge - 16 - nc Drain-Source Diode Characteristics Q gd Diode Forward Voltage (Note 3) V SD V GS =0V,I S =7A - - 1.2 V Diode Forward Current (Note 2) I S - - 7 A Reverse Recovery Time t rr TJ = 25 C, I F =7A - 35 - ns Reverse Recovery Charge Taiwan Goodark Technology Co.,Ltd Qrr di/dt = 100A/μs (Note3) - 43 - nc Forward Turn-On Time t on Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD) Notes: 1. Repetitive Rating: Pulse width limited by maximum junction temperature. 2. Surface Mounted on FR4 Board, t 10 sec. 3. Pulse Test: Pulse Width 300μs, Duty Cycle 2%. 4. Guaranteed by design, not subject to production

Test Circuit 1) E AS test Circuits 2) Gate charge test Circuit 3) Switch Time Test Circuit

Typical Electrical and Thermal Characteristics (Curves) Rdson On-Resistance(mΩ) ID- Drain Current (A) ID- Drain Current (A) Vds Drain-Source Voltage (V) Figure 1 Output Characteristics Vgs Gate-Source Voltage (V) Figure 2 Transfer Characteristics Normalized On-Resistance Vgs Gate-Source Voltage (V) Is- Reverse Drain Current (A) T J -Junction Temperature( ) Figure 4 Rdson-JunctionTemperature Qg Gate Charge (nc) Figure 5 Gate Charge I D - Drain Current (A) Figure 3 Rdson- Drain Current Vsd Source-Drain Voltage (V) Figure 6 Source- Drain Diode Forward

Vds Drain-Source Voltage (V) Figure 7 Capacitance vs Vds T J -Junction Temperature( ) Figure 9 Power De-rating ID- Drain Current (A) C Capacitance (pf) Vds Drain-Source Voltage (V) Figure 8 Safe Operation Area T J -Junction Temperature( ) Figure 10 Current De-rating r(t),normalized Effective Transient Thermal Impedance ID- Drain Current (A) Power Dissipation (W) Square Wave Pluse Duration(sec) Figure 11 Normalized Maximum Transient Thermal Impedance

SOP-8 Package Information Symbol Dimensions In Millimeters Dimensions In Inches Min. Max. Min. Max. A 1.350 1.750 0.053 0.069 A1 0.100 0.250 0.004 0.010 A2 1.350 1.550 0.053 0.061 b 0.330 0.510 0.013 0.020 c 0.170 0.250 0.006 0.010 D 4.700 5.100 0.185 0.200 E 3.800 4.000 0.150 0.157 E1 5.800 6.200 0.228 0.244 e 1.270(BSC) 0.050(BSC) L 0.400 1.270 0.016 0.050 θ 0 8 0 8