SP400 Series.5pF, 30A Discrete TVS Diode RoHS Pb GREEN Description The SP400 components integrate low capacitance steering diodes with one or two avalanche breakdown diodes for unidirectional or bidirectional protection, respectively, to protect against ESD and lightning induced surge events. These devices can safely absorb up to 30A per IEC 6000-4-5 (tp=8/0μs) without performance degradation and a minimum ±30kV ESD per IEC 6000-4- International Standard. The low loading capacitance and high surge capability make it ideal for protecting telecommunication ports such as Ethernet and other high speed data interfaces. SP400 Pinout Features ESD, IEC 6000-4-, ±30kV contact, ±30kV air EFT, IEC 6000-4-4, 40A (5/50ns) Lightning, IEC 6000-4-5, nd Edition 30A (t P =8/0μs) Low capacitance of.5pf (@ V R =0V) Low leakage current of 0.μA at 3.3V Unidirectional and Bidirectional configuration Small SOD33 package fits 0805 footprints Moisture Sensitivity Level (MSL-) AEC-Q0 Qualified Halogen free, Lead free, and RoHS compliant Functional Block Diagram Applications 0/00/000 Ethernet T/E/T3/E3 USB./.0 USB 3.0/3. Power Ports Computers and Peripherals Instrumentation Medical Equipment Additional Information Unidirectional Bidirectional SP400-0FTG SP400-0FTG-C Datasheet Resources Samples Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated.
Absolute Maximum Ratings Symbol Parameter Value Units Peak Current (t p =8/0μs) 30 A P Pk Peak Pulse Power (t p =8/0μs) 750 W T OP Operating Temperature -40 to 5 C T STOR Storage Temperature -55 to 50 C Note: CAUTION: Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (T OP =5ºC) Parameter Symbol Test Conditions Min Typ Max Units Breakdown Voltage V BD I R =ua 3.5 V Reverse Standoff Voltage V RWM I R μa 3.3 V Leakage Current I LEAK V R =3.3V 0. 0.5 μa Clamp Voltage V C =0A, t p =8/0µs, Fwd 4. V I =A, t PP =8/0µs, Fwd p 6.6 V =4A, t P =8/0μs, Fwd.8 V Dynamic Resistance R DYN TLP, t P =00ns, I/O to GND 0.40 Ω ESD Withstand Voltage V ESD IEC 6000-4- (Contact Discharge) ±30 kv IEC 6000-4- (Air Discharge) ±30 kv Diode Capacitance C D Reverse Bias=0V, f=mhz.5 pf Note: Parameter is guaranteed by design and/or component characterization. Transmission Line Pulse (TLP) with 00ns width and 00ps rise time. Normalized Capacitance vs. Bias Voltage Non-Repetitive Peak Pulse Power vs. Pulse Time 0 Normalized Capacitance.4..0 0.8 0.6 0.4 SP400-0FTG-C SP400-0FTG Peak Pulse Power - P pk (kw) 0. 0. 0.0 0.0 0.3 0.6 0.9..5.8..4.7 3.0 3.3 Bias Voltage (V) 0.0 0. 0 00 000 Pulse Duration - t p (µs)
Positive Transmission Line Pulsing (TLP) Plot NegativeTransmission Line Pulsing (TLP) Plot SP400 Clamping Voltage vs. Pulse Waveform 30.0 5.0 0% 00% 90% Clamp Voltage (V C ) 0.0 5.0 0.0 5.0 Percent of 80% 70% 60% 50% 40% 30% 0% 0.0 0%.0 5.0 0.0 5.0 0.0 Peak Pulse Current- (A) 5.0 30.0 0% 0.0 5.0 0.0 5.0 0.0 5.0 30.0 Time (μs)
Temperature TVS Diode Arrays (SPA Diodes) Soldering Parameters Product Characteristics Reflow Condition Pre Heat Pb Free assembly - Temperature Min (T s(min) ) 50 C - Temperature Max (T s(max) ) 00 C - Time (min to max) (t s ) 60 80 secs Average ramp up rate (Liquidus) Temp (T L ) to peak 3 C/second max T S(max) to T L - Ramp-up Rate 3 C/second max - Temperature (T L ) (Liquidus) 7 C Reflow - Temperature (t L ) 60 50 seconds Peak Temperature (T P ) 60 +0/-5 C Time within 5 C of actual peak Temperature (t p ) 0 40 seconds Ramp-down Rate 6 C/second max Time 5 C to peak Temperature (T P ) 8 minutes Max. Do not exceed 60 C Lead Plating Lead Material Lead Coplanarity Substrate Material Body Material Flammability Matte Tin Copper Alloy 0.0004 inches (0.0mm) Silicon Molded Compound UL Recognized compound meeting flammability rating V-0 Notes :. All dimensions are in millimeters. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. T P T L T S(max) Preheat Ramp-up t P t L Critical Zone TL to TP Ramp-down T S(min) t S 5 time to peak temperature Time
c 0. D b TVS Diode Arrays (SPA Diodes) Part Marking System Part Numbering System SP400-0FTG 03 SP400-0FTG-C 3C TVS Diode Arrays (SPA Diodes) Series Number of Channels SP400 0 F T G C Ordering Information Blank= Unidirectional C= Bidirectional G= Green T= Tape & Reel Package F: SOD33 Part Number Package Marking Min. Order Qty. SP400-0FTG SOD33 03 3000 SP400 SP400-0FTG-C SOD33 3C 3000 Package Dimensions -SOD33 L E E L L 0.45 A A A Recommended Solder Pad 0.49.79.4.8.77 SOD33 Symbol Millimeters Inches Min Max Min Max A 0.8.4 0.03 0.045 A 0.00 0.0 0.000 0.004 A 0.80.04 0.03 0.04 b 0.5 0.35 0.00 0.04 c 0.08 0.5 0.003 0.006 D.5.45 0.045 0.057 E.60.90 0.063 0.075 E.44.75 0.096 0.08 L 0. 0.45 0.009 0.08 Unit: mm Embossed Carrier Tape & Reel Specification SOD33 Symbol Dimensions (mm) A0.46 +/ 0. B0.90 +/ 0. W 8.0 +0.3/ 0.0 D0.50 +0. D 0.45~.5 E.75 +/ 0.0 E F 3.50 +/ 0.0 P0 4.0 +/ 0.0 P 4.0 +/ 0.0 P.0 +/ 0.05 K0.4 +/ 0. T 0.54 +/ 0.0