Data Sheet ACPL-K9T Wide Operating Temperature Automotive R Coupler 0-kBd Digital Optocoupler Configurable as Low-Power, Low-Leakage Phototransistor Description The ACPL-K9T is a single-channel, hightemperature, high CMR, 0-kBd digital optocoupler, configurable as a low-power, low-leakage phototransistor, specifically for use in automotive applications. The stretched SO- stretched package outline is designed to be compatible with standard surface mount processes. This digital optocoupler uses an insulating layer between the light emitting diode and an integrated photo detector to provide electrical insulation between input and output. Separate connections for the photodiode bias and output transistor collector increase the speed up to a hundred times over that of a conventional phototransistor coupler by reducing the base-collector capacitance. The R Coupler isolation product provides reinforced insulation and reliability that delivers safe signal isolation critical in automotive and high-temperature industrial applications. Features High-temperature and reliability low-speed digital interface for automotive application 0 kv/μs high common-mode rejection at V CM = 00V (typ) Low-power, low-leakage phototransistor in a -pin configuration Compact, auto-insertable stretched SO packages Qualified to AEC Q00 Grade test guidelines Wide temperature range: 0 C to + C Low LED drive current: ma (typ) Low propagation delay: 0 μs (max) Worldwide safety approval: UL approval, kv rms / min. CSA approval IEC/EN/DIN EN 0-- Applications Automotive low-speed digital signal isolation interface Inverter fault feedback signal isolation Switching power supplies feedback circuit CAUTION! It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD. The components featured in this data sheet are not to be used in military or aerospace applications or environments.. December, 0
Functional Diagram ANODE V CC ANODE CATHODE CATHODE NC NC NC NC NC GND NC GND NOTE: The connection of a 0.-μF bypass capacitor between pins and is recommended for -pin configuration. Pins and are externally shorted for -pin configuration. Truth Table LED ON OFF LOW HIGH Ordering Information Specify part number followed by option number (if desired). Part Number Option (RoHS Compliant) Package Surface Mount Tape and Reel UL 000 V rms / Minute Rating IEC/EN/DIN EN 0-- Quantity ACPL-K9T -000E Stretched X X 0 per tube -00E SO- X X X 0 per tube -00E X X X 000 per reel -0E X X X X 000 per reel To order, choose a part number from the part number column and combine with the desired option from the option column to form an order entry. Example : ACPL-K9T-0E to order product of SSO- Surface Mount package in Tape and Reel packaging with IEC/EN/DIN EN 0-- Safety Approval in RoHS compliant. Option data sheets are available. Contact your sales representative or authorized distributor for information.
Outline Drawing (Stretched SO) RECOMMENDED LAND PATTERN.0 ± 0. (0.0 ± 0.00) PART NUMBER DATE CODE.0 (0.9) RoHS-COMPLIANCE INDICATOR KXXT YWW EE.0 ± 0. (0. ± 0.00) EXTENDED DATECODE FOR LOT TRACKING.0 ± 0. (0. ± 0.00) 0.0 (0.0).90 (0.0) 0. (0.0).90 ± 0. (0.0 ± 0.00) 0. ± 0. (0.0 ± 0.00).0 (0.00) BSG 0.00 ± 0.00 (0.00 ± 0.00) 0.0 ± 0.0 (0.09 ± 0.00).0 ± 0.0 (0. ± 0.00) 0. ± 0.00 (0.00 ± 0.00) Dimensions in millimeters and (inches). Note: Lead coplanarity = 0. mm (0.00 inches). Floating lead protrusion = 0.mm (0mils) max. Recommended Pb-Free IR Reflow Profile Recommended reflow condition as per JEDEC Standard, J-STD-00 (latest revision). NOTE: Non-halide flux should be used. Regulatory Information The ACPL-K9T is approved by the following organizations: UL Approval under UL, component recognition program up to V ISO = kv rms. CSA Approval under CSA Component Acceptance Notice #. IEC/EN/DIN EN 0-- Approval under IEC/EN/DIN EN 0--.
Insulation and Safety Related Specifications Parameter Symbol ACPL- K9T Unit Conditions Minimum External Air Gap (Clearance) Minimum External Tracking (Creepage) Minimum Internal Plastic Gap (Internal Clearance) Tracking Resistance CTI V DIN IEC /VDE 00 Part. (Comparative Tracking Index) Isolation Group (DIN VDE009) IIIa Material Group (DIN VDE 009). L(0) mm Measured from input terminals to output terminals, shortest distance through air. L(0) mm Measured from input terminals to output terminals, shortest distance path along body. 0.0 mm Through insulation distance conductor to conductor, usually the straight line distance thickness between the emitter and detector. IEC/EN/DIN EN 0-- Insulation Related Characteristic (Option 00E and 0E) Description Symbol Characteristic Unit Installation classification per DIN VDE 00/.9, Table For rated mains voltage 0 V rms For rated mains voltage 00 V rms For rated mains voltage 0 V rms For rated mains voltage 00 V rms For rated mains voltage 000 V rms I-IV I-IV I-IV I-IV I-III Climatic Classification /00/ Pollution Degree (DIN VDE 00/.9) Maximum Working Insulation Voltage V IORM 0 V PEAK Input to Output Test Voltage, Method b V IORM x. = V PR, 00% Production Test with t m = sec Partial Discharge < pc V PR V PEAK Input to Output Test Voltage, Method a V IORM x. = V PR, Type and sample test, t m = 0 sec, Partial Discharge < pc V PR V PEAK Highest Allowable Overvoltage (Transient Overvoltage, t ini = 0 sec) V IOTM 000 V PEAK Safety Limiting Values (Maximum values allowed in the event of a failure) Case Temperature Input Current Output Power T S I S,INPUT P S,OUTPUT 0 00 C ma mw Insulation Resistance at T S, V IO = 00V R S 0 9 Ω
Absolute Maximum Ratings Parameter Symbol Min. Max. Unit Storage Temperature T S 0 C Operating Temperature T A 0 C Lead Soldering Cycle Temperature 0 C Time 0 s Average Forward Input Current I F(avg) 0 ma Peak Forward Input Current (0% duty cycle, -ms pulse width) I F(peak) 0 ma Peak Transient Input Current ( -μs pulse width, 00 ps) I F(trans) 00 ma Reversed Input Voltage V R V Input Power Dissipation P IN 0 mw Output Power Dissipation P O 00 mw Average Output Current I O ma Peak Output Current I o(pk) ma Supply Voltage V CC 0. 0 V Output Voltage 0. 0 V Recommended Operating Conditions Parameter Symbol Min. Max. Unit Supply Voltage V CC 0.0 V Operating Temperature T A 0 C
Electrical Specifications (DC) for -Pin Configuration Over recommended operating T A = 0 C to C, unless otherwise specified. Parameter Symbol Min. Typ. Max. Unit Conditions Fig. Note Current Transfer Ratio CTR 00 % T A = C V CC =.V, = 0.V, I F = 0 ma,, a 0 0 T A = C V CC =.V, = 0.V, I F = ma,, 0 0 Logic Low Output Voltage L 0. 0. V V CC =.V, I F = 0 ma, I o =. ma 0. 0. V CC =.V, I F = ma, I o =.0 ma Logic High Output I OH x 0 0. μa T A = C = V CC =.V I F = 0 ma Current x 0 = V CC = 0V Logic Low Supply Current I CCL 00 μa I F = ma, = open, V CC = 0V Logic High Supply I CCH 0.0 μa Current. μa T A = C I F = 0 ma, = open, V CC = 0V Input Forward Voltage V F... V T A = C I F = ma... V Input Reversed BV R V I R = 0 μa Breakdown Voltage Temperature Coefficient ΔV/ΔT A. mv/ C I F = 0 ma of Forward Voltage Input Capacitance C IN 90 pf F = MHz, V F = 0V a. Current Transfer Ratio in percent is defined as the ratio of output collector current, I O, to the forward LED input current, I F, times 00. Switching Specifications (AC) for -Pin Configuration Over recommended operating (T A = 0 C to C), V CC =.0V unless otherwise specified. Parameter Sym. Min. Typ. Max. Unit Conditions Fig. Note Propagation Delay Time to Logic Low at Output Propagation Delay Time to Logic High at Output Common Mode Transient Immunity at Logic High Output Common Mode Transient Immunity at Logic Low Output Common Mode Transient Immunity at Logic Low Output t PHL 0 μs Pulse: f = 0 khz, Duty cycle = 0%, I F = ma, V CC =.0V, R L =. kω, C L = pf, V THHL =.V t PLH 0 μs Pulse: f = 0 khz, Duty cycle = 0%, I F = ma, V CC =.0V, R L =. kω, C L = pf, V THLH =.0V CM H 0 kv/μs I F = 0 ma V CM = 00 V p-p, T A = C R L =.9 kω CM L 0 kv/μs I F = 0 ma CM L kv/μs I F = ma V CM = 00 V p-p, T A = C R L =. kω 9 9 0 a a. Common transient immunity in a Logic High level is the maximum tolerable (positive) dv CM /dt on the rising edge of the common mode pulse, V CM, to assure that the output will remain in a Logic High state (i.e., >.0V). Common mode transient immunity in a Logic Low level is the maximum tolerable (negative) dv CM /dt on the falling edge of the common mode pulse signal, V CM, to assure that the output will remain in a Logic Low state (i.e., < 0.V).
Electrical Specifications (DC) for -Pin Configuration Over recommended operating T A = 0 C to C, unless otherwise specified. Parameter Sym. Min. Typ. Max. Unit Conditions Fig. Note Current Transfer Ratio CTR 0 0 0 % T A = C, V CC = = V, I F = ma a Current Transfer Ratio CTR 0 I F = 0 ma V CC = = 0.V (Sat) 0 I F = ma Logic Low Output Voltage L 0. 0. V I F = 0 ma I O =. ma 0. 0. I F = ma I O =. ma Off-State Current I (CEO) x 0 μa = V CC = 0V, I F = 0 ma Input Forward Voltage V F... V T A = C I F = ma... V Input Reversed Breakdown BV R V I R = 0 μa Voltage Temperature Coefficient of Forward Voltage ΔV/ΔT A. mv/ C I F = 0 ma Input Capacitance C IN 90 pf F = MHz, V F = 0V Output Capacitance C CE pf F = MHz, V F = 0V, = V CC = 0V a. Current Transfer Ratio in percent is defined as the ratio of output collector current, I O, to the forward LED input current, I F, times 00. Switching Specifications (AC) for -Pin Configuration Over recommended operating (T A = 0 C to C), V CC =.0V unless otherwise specified. Parameter Sym. Min. Typ. Max. Unit Conditions Fig. Note Propagation Delay Time to Logic Low at Output Propagation Delay Time to Logic High at Output Common Mode Transient Immunity at Logic Low Output t PHL 00 μs Pulse: f = khz, Duty cycle = 0%, I F = ma, V CC =.0V, R L =. kω, C L = pf, V THHL =.V t PLH 9 00 μs Pulse: f = khz, Duty cycle = 0%, I F = ma, V CC =.0V, R L =. kω C L = pf, V THLH =.0V CM L 0 kv/μs I F = 0 ma V CM = 00 V p-p, T A = C R L =. kω 0 0 a Common Mode Transient Immunity at Logic Low Output CM L 0 kv/μs I F = ma V CM = 00 V p-p, T A = C R L =. kω a. Common transient immunity in a Logic High level is the maximum tolerable (positive) dv CM /dt on the rising edge of the common mode pulse, V CM, to assure that the output will remain in a Logic High state (i.e., >.0V). Common mode transient immunity in a Logic Low level is the maximum tolerable (negative) dv CM /dt on the falling edge of the common mode pulse signal, V CM, to assure that the output will remain in a Logic Low state (i.e., < 0.V).
Package Characteristics Input-Output Momentary Withstand Voltage a Parameter Symbol Min. Typ. Max. Unit Test Conditions Fig. Note V ISO 000 V rms RH 0%, t = min; T A = C Input-Output Resistance R I-O 0 Ω V I-O = 00 V dc b Input-Output Capacitance C I-O 0. pf f = MHz; V I-O = 0 V dc b a. The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous voltage rating. b. Device considered a two-terminal device: pins,, and shorted together, and pins,, and shorted together. c. In accordance with UL, each optocoupler is proof tested by applying an insulation test voltage >000 V rms for second. b, c
Figure : Current Transfer Ratio vs. Input Current NORMALIZED CURRENT TRANSFER RATIO.....0 0. 0. 0. 0. T A = C V CC = V = 0. V 0.0 0. 0 00 I F - INPUT CURRENT (ma) Figure : Normalized Current Transfer Ratio vs. Temperature NORMALIZED CURRENT TRANSFER RATIO. 0.9 0. I F = 0 ma I F = ma 0. V CC = V = 0. V 0. -0-0 0 00 T A - TEMPERATURE - C Figure : Typical Low-Level Output Current vs Output Voltage Figure : Output Current vs Output Voltage (-Pin Configuration) IOL - LOW LEVEL OUTPUT CURRENT - ma V CC = V, T A = C I F = 0 ma 0 I F = 0 ma I F = ma I F = ma 0 0.0 0. 0. 0. 0..0 L - LOW LEVEL OUTPUT VOLTAGE - V IO - OUTPUT CURRENT - ma 0 0 0 T A = C V CC = I F = 0 ma I F = ma I F = 0 ma I F = ma 0 0 - OUTPUT VOLTAGE - V Figure : Typical Low-Level Output Current vs Output Voltage (-Pin Configuration) IOL - LOW LEVEL OUTPUT CURRENT - ma 0 0 V CC =, T A = C I F = 0 ma I F = 0 ma I F = ma I F = ma 0.0 0. 0. 0. 0..0 L - LOW LEVEL OUTPUT VOLTAGE - V Figure : Typical Input Current vs Forward Voltage IF - FORWARD CURRENT - ma 0.0 T A = C T A = C T A = -0 C.0.0.0.0.0.0.0.0.90 V F - FORWARD VOLTAGE - V 9
Figure : Typical High-Level Output Current vs Temperature V CC = = V IOH - LOGIC HIGH OUTPUT CURRENT - A 0. 0.0 0.00 0.000 0 00 T A - TEMPERATURE - C Figure : Typical Off-State Current vs Temperature (-Pin Configuration) ICEO - OFF-STATE CURRENT - A 0. 0.0 0.00 0.000 V V V. V 0.0000 0 00 T A - TEMPERATURE - C Figure 9: Switching Test Circuit (-Pin Configuration) I F. V.0 V V Pulse Generator Z O = 0 Ω t r = ns 0% Duty Cycle /f < 00 s R L + V L I F Monitor t PHL t PLH 00 0. F C L = pf Figure 0: Switching Test Circuit (-Pin Configuration) I F. V.0 V V Pulse Generator Z O = 0 Ω t r = ns 0% Duty Cycle /f < 00 s R L + V L I F Monitor t PHL t PLH 00 C L = pf 0
Figure : Test Circuit for Transient Immunity and Typical Waveforms (-Pin Configuration) V CM 00 V 0% t r T r = t f = 0 ns 90% 90% 0% t f I F R L VCC Switch at I F = 0 ma Switch at I F = ma V L V FF + 0. F V CM Pulse Gen. Figure : Test Circuit for Transient Immunity and Typical Waveforms (-Pin Configuration) 00 V V 0% CM t r T r = t f = 0 ns 90% 90% 0% t f I F R L VCC Switch at I F = 0 ma Switch at I F = ma V L V FF + C L = pf V CM Pulse Gen.
Thermal Resistance Model for ACPL-K9T The diagram of ACPL-K9T for measurement is shown in Figure. Here, one die is heated first and the temperatures of all the dice are recorded after thermal equilibrium is reached. Then, the second die is heated and all the dice temperatures are recorded. With the known ambient temperature, the die junction temperature and power dissipation, the thermal resistance can be calculated. The thermal resistance calculation can be cast in matrix form. This yields a -by- matrix for our case of two heat sources. Figure : Diagram of ACPL-K9T for Measurement Die : LED Die : Detector R R P = ΔT R R P ΔT R : Thermal Resistance of Die due to heating of Die R : Thermal Resistance of Die due to heating of Die. R : Thermal Resistance of Die due to heating of Die. R : Thermal Resistance of Die due to heating of Die. P : Power dissipation of Die (W). P : Power dissipation of Die (W). T : Junction temperature of Die due to heat from all dice ( C). T : Junction temperature of Die due to heat from all dice. T a : Ambient temperature. ΔT : Temperature difference between Die junction and ambient ( C). ΔT : Temperature deference between Die junction and ambient ( C). T = (R x P + R x P ) + T a T = (R x P + R x P ) + T a Measurement data on a low K board: R = 0 C/W, R = R = C/W, R = C/W
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