FQH8N100C 1000V N-Channel MOSFET

Similar documents
FQA11N90C_F V N-Channel MOSFET

FQB7N65C 650V N-Channel MOSFET

FDP V N-Channel PowerTrench MOSFET

Description. Symbol Parameter Ratings Units V DSS Drain to Source Voltage 60 V V GSS Gate to Source Voltage ±20 V

FDP V N-Channel PowerTrench MOSFET

FDP150N10 N-Channel PowerTrench MOSFET 100V, 57A, 15mΩ Features

FQPF12N60CT 600V N-Channel MOSFET

FDP047N10 N-Channel PowerTrench MOSFET 100V, 164A, 4.7mΩ Description

FDP75N08A 75V N-Channel MOSFET

FQA11N90 900V N-Channel MOSFET

FDP79N15 / FDPF79N15 150V N-Channel MOSFET

Package Marking and Ordering Information T C = 25 o C unless otherwise noted Device Marking Device Package Reel Size Tape Width Quantity FDP2N50 FDP2N

Features. Q1: N-Channel 7.0A, 30V. R DS(on) Q2: P-Channel. -5A, -30V R DS(on) = 25 C unless otherwise noted. Symbol Parameter Q1 Q2 Units

FQD2N60C/FQU2N60C 600V N-Channel MOSFET

Description TO-220F. Symbol Parameter FCP11N60F FCPF11N60F Units

UniFET TM. FDP18N50 / FDPF18N50 500V N-Channel MOSFET. FDP18N50 / FDPF18N50 500V N-Channel MOSFET. Description. Features. Absolute Maximum Ratings

Description. TO-3P FDA Series. Symbol Parameter FDA70N20 Unit. Maximum Lead Temperature for Soldering Purpose, 300 C 1/8 from Case for 5 Seconds

January 2009 QFET FQD2N100/FQU2N100. Features D D. I-PAK FQU Series

FQA8N100C 1000V N-Channel MOSFET

FQD13N10L / FQU13N10L

Features. I-PAK FQU Series

FDD8447L 40V N-Channel PowerTrench MOSFET 40V, 50A, 8.5mΩ Features

Features. I 2 -PAK FQI Series

Description. TO-220 FCP Series. Symbol Parameter FDP61N20 Unit. Maximum Lead Temperature for Soldering Purpose, 300 C 1/8 from Case for 5 Seconds

Description. Symbol Parameter FDAF69N25 Unit. (Note 2) Maximum Lead Temperature for Soldering Purpose, 300 C 1/8 from Case for 5 Seconds

Features. TO-220F IRFS Series

FQB30N06L / FQI30N06L

N-Channel QFET MOSFET 150 V, 50 A, 42 mω

Description. TO-220F FDPF Series. Symbol Parameter FDP20N50 FDPF20N50 Unit

QFET FQE10N20LC. Features. TO-126 FQE Series

FQP10N60C / FQPF10N60C 600V N-Channel MOSFET

QFET FQP9N25C/FQPF9N25C

FQA11N90C FQA11N90C. 900V N-Channel MOSFET. Absolute Maximum Ratings T C = 25 C unless otherwise noted. Thermal Characteristics.

QFET FQA36P15. Features

Features. TO-3P IRFP Series

QFET TM FQL40N50. Features. TO-264 FQL Series

FDL100N50F N-Channel MOSFET,FRFET 500V, 100A, 0.055Ω Features

Description TO-3PN. Symbol Parameter Ratings Units V DSS Drain to Source Voltage 600 V V GSS Gate-Soure voltage ±30 V

QFET TM FQP13N50C/FQPF13N50C

Features. TO-3P FQA Series

Features G G SOT-223. Symbol Parameter FQT1N60C Unit V DSS Drain to Source Voltage 600 V V GSS Gate to Source Voltage ±30 V

Features. TO-220F SSS Series

Features. TO-220F IRFS Series

FQP3N80C/FQPF3N80C 800V N-Channel MOSFET General Description These N-Channel enhancement mode power field effect transistors are

QFET TM FQP4N90C/FQPF4N90C

Features. TO-3PN IRFP Series

QFET TM FQP13N06. Features G D. TO-220 FQP Series

QFET TM FQP17P10. Features. TO-220 FQP Series

Features. TO-220F SSS Series

Features. 8.8 A, 250 V, R DS(on) =430 GS =10 V, I D =4.4 A Low Gate Charge (Typ nc) Low C rss (Typ pf) 100% Avalanche Tested

FQD12P10TM_F085. FQD12P10TM_F085 P-Channel MOSFET. 100V P-Channel MOSFET. Absolute Maximum Ratings T C = 25 C unless otherwise noted

Features. TO-3P FQA Series

FDMJ1032C. Dual N & P-Channel PowerTrench MOSFET N-Channel: 20V, 3.2A, 90mΩ P-Channel: -20V, -2.5A, 160mΩ

Features. TO-220F IRFS Series

FQPF22P10 P-Channel QFET MOSFET -100 V, A, 125 mω

QFET TM FQA65N20. Features. TO-3P FQA Series

QFET TM FQT4N20L. Features. SOT-223 FQT Series

Features. TO-220 FQP Series

FQT7N10L N-Channel QFET MOSFET 100 V, 1.7 A, 350 mω

Description G D TO-220. Symbol Parameter FDP7N50 Unit. Maximum Lead Temperature for Soldering Purpose, 300 C 1/8 from Case for 5 Seconds

QFET TM FQP20N06. Features G D. TO-220 FQP Series

Features D D. I-PAK FQU Series

Features. TO-220F FQPF Series

Applications. Symbol Parameter Ratings Units V DS Drain to Source Voltage 100 V V GS Gate to Source Voltage ±20 V

Features. I 2 -PAK FQI Series

FDT3N40 N-Channel UniFET TM MOSFET 400 V, 2.0 A, 3.4 Features

Features. TO-220F FQPF Series

FQPF47P06 / FQPF47P06YDTU P-Channel QFET MOSFET -60 V, -30 A, 26 mω

Features. TO-220 FQP Series

Features G D TO-220. Symbol Parameter FQP50N06L Unit V DSS Drain-Source Voltage 60 V I D Drain Current - Continuous (T C = 25 C) 52.

QFET TM FQD18N20V2 / FQU18N20V2

onlinecomponents.com

Features G D. TO-220 FQP Series

FQA9P25 P-Channel QFET MOSFET

Description TO-220F. Symbol Parameter FDPF7N50U Unit. Maximum Lead Temperature for Soldering Purpose, 300 C 1/8 from Case for 5 Seconds

Features. I-PAK FQU Series

QFET TM FQP13N06L. Features G D. TO-220 FQP Series

FDP032N08 N-Channel PowerTrench MOSFET 75V, 235A, 3.2mΩ Features

Features. I-PAK FQU Series

QFET TM FQP85N06. Features G D. TO-220 FQP Series

Description. TO-220F FDPF Series. Symbol Parameter FDP15N40 FDPF15N40 Units V DSS Drain to Source Voltage 400 V V GSS Gate to Source Voltage ±30 V

Features G D. TO-220 FQP Series

Description G D TO-220. Symbol Parameter FDP61N20 Unit. Maximum Lead Temperature for Soldering Purpose, 300 C 1/8 from Case for 5 Seconds

FDB V N-Channel PowerTrench MOSFET

FDP18N50 / FDPF18N50 / FDPF18N50T

FQD5P10 P-Channel QFET MOSFET

2N7002DW N-Channel Enhancement Mode Field Effect Transistor. Symbol Parameter Value Units. Symbol Parameter Value Units

FCP36N60N N-Channel MOSFET 600V, 36A, 90mΩ Features

P-Channel QFET MOSFET -60 V, A, 175 mω

FQPF9N50CF N-Channel QFET FRFET MOSFET

IRFS650B IRFS650B. 200V N-Channel MOSFET. Absolute Maximum Ratings T C = 25 C unless otherwise noted. Thermal Characteristics. November 2001.

FQD3P50TM_F V P-Channel MOSFET

Features G D. TO-220 FQP Series

Features. Symbol Parameter FQPF15P12 Unit V DSS Drain-Source Voltage -120 V I D Drain Current - Continuous (T C = 25 C) -15 * A

FQD12N20LTM_F V Logic Level N-Channel MOSFET

FDZ2554P. FDZ2554P Monolithic Common Drain P-Channel 2.5V Specified Power PowerTrench BGA MOSFET

FQPF12N60C N-Channel QFET MOSFET

FDA69N25 N-Channel UniFET TM MOSFET 250 V, 69 A, 41 mω Features

FQP30N06L N-Channel QFET MOSFET 60 V, 32 A, 35 m

FDZ V N-Channel PowerTrench BGA MOSFET

Transcription:

FQH8N100C 1000V N-Channel MOSFET Features 8A, 1000V, R DS(on) = 1.45Ω @ = 10 V Low gate charge (typical 53nC) Low C rss (typical 16pF) Fast switching 100% avalanche tested Improved dv/dt capability RoHS compliant Description March 2008 QFET These N-Channel enhancement mode power field effect transistors are produced using Fairchild s proprietary, planar stripe, DMOS technology. This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for high efficient switched mode power supplies, active power factor correction, electronic lamp ballast based on half bridge topology. D G G D S TO-247 FQH Series S Absolute Maximum Ratings Symbol Parameter FQH8N100C Units S Drain-Source Voltage 1000 V Drain Current - Continuous (T C = 25 C) 8.0 A Thermal Characteristics - Continuous (T C = 100 C) 5.0 A M Drain Current - Pulsed (Note 1) 32 A S Gate-Source Voltage ± 30 V E AS Single Pulsed Avalanche Energy (Note 2) 850 mj I AR Avalanche Current (Note 1) 8.0 A E AR Repetitive Avalanche Energy (Note 1) 22 mj dv/dt Peak Diode Recovery dv/dt (Note 3) 4.0 V/ns P D Power Dissipation (T C = 25 C) 225 W - Derate above 25 C 1.79 W/ C T J, T STG Operating and Storage Temperature Range -55 to +150 C T L Maximum lead temperature for soldering purposes, 1/8 from case for 5 seconds 300 C Symbol Parameter Typ Max Units R θjc Thermal Resistance, Junction-to-Case -- 0.56 C/W R θcs Thermal Resistance, Case-to-Sink 0.24 -- C/W R θja Thermal Resistance, Junction-to-Ambient -- 40 C/W 2008 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com

Package Marking and Ordering Information Device Marking Device Package Reel Size Tape Width Quantity FQH8N100C FQH8N100C TO-247 -- -- 30 Electrical Characteristics T C = 25 C unless otherwise noted Symbol Parameter Test Conditions Min Typ Max Units Off Characteristics BS Drain-Source Breakdown Voltage = 0 V, = 250 µa 1000 -- -- V BS / T J Breakdown Voltage Temperature Coefficient = 250 µa, Referenced to 25 C -- 1.4 -- V/ C SS Zero Gate Voltage Drain Current = 1000 V, = 0 V -- -- 10 µa = 800 V, T C = 125 C -- -- 100 µa I GSSF Gate-Body Leakage Current, Forward = 30 V, = 0 V -- -- 100 na I GSSR Gate-Body Leakage Current, Reverse = -30 V, = 0 V -- -- -100 na On Characteristics (th) Gate Threshold Voltage =, = 250 µa 3.0 -- 5.0 V R DS(on) Static Drain-Source On-Resistance = 10 V, = 4.0A -- 1.2 1.45 Ω g FS Forward Transconductance = 50 V, = 4.0 A (Note 4) -- 8.0 -- S Dynamic Characteristics C iss Input Capacitance = 25 V, = 0 V, -- 2475 3220 pf C oss Output Capacitance f = 1.0 MHz -- 195 255 pf C rss Reverse Transfer Capacitance -- 16 21 pf Switching Characteristics t d(on) Turn-On Delay Time V DD = 500 V, = 8.0A, -- 50 110 ns t r Turn-On Rise Time R G = 25 Ω -- 95 200 ns t d(off) Turn-Off Delay Time -- 122 254 ns (Note 4, 5) t f Turn-Off Fall Time -- 80 170 ns Q g Total Gate Charge = 800 V, = 8.0A, -- 53 70 nc Q gs Gate-Source Charge = 10 V -- 13 -- nc Q gd Gate-Drain Charge (Note 4, 5) -- 23 -- nc Drain-Source Diode Characteristics and Maximum Ratings I S Maximum Continuous Drain-Source Diode Forward Current -- -- 8.0 A I SM Maximum Pulsed Drain-Source Diode Forward Current -- -- 32.0 A V SD Drain-Source Diode Forward Voltage = 0 V, I S = 8.0 A -- -- 1.4 V t rr Reverse Recovery Time = 0 V, I S = 8.0 A, -- 620 -- ns Q rr Reverse Recovery Charge di F / dt = 100 A/µs (Note 4) -- 5.2 -- µc NOTES: 1. Repetitive Rating : Pulse width limited by maximum junction temperature 2. L = 25mH, I AS =8.0A, V DD = 50V, R G = 25 Ω, Starting T J = 25 C 3. I SD 8.0A, di/dt 200A/µs, V DD BS, Starting T J = 25 C 4. Pulse Test : Pulse width 300µs, Duty cycle 2% 5. Essentially independent of operating temperature 2 www.fairchildsemi.com

Typical Performance Characteristics Figure 1. On-Region Characteristics 10 1 Top : 15.0 V 10.0 V 8.0 V 7.0 V 6.5 V 6.0 V Bottom : 5.5 V 10 1, Drain-Source Voltage [V] Notes : 1. 250µ s Pulse Test 2. T C = 25 Figure 3. On-Resistance Variation vs. Drain Current and Gate Voltage Figure 2. Transfer Characteristics 10 1 150 o C 25 o C -55 o C 1. = 50V 2. 250µ s Pulse Test 2 4 6 8 10, Gate-Source Voltage [V] Figure 4. Body Diode Forward Voltage Variation vs. Source Current and Temperatue 3.0 R DS(ON) [Ω ], Drain-Source On-Resistance 2.5 2.0 1.5 1.0 = 10V = 20V Note : T = 25 J R, Reverse Drain Current [A] 10 1 150 25 1. = 0V 2. 250µ s Pulse Test 0.5 0 5 10 15 20 25 0.2 0.4 0.6 0.8 1.0 1.2 1.4 V SD, Source-Drain voltage [V] Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics Capacitance [pf] 4000 3500 3000 2500 2000 1500 1000 500 C iss C oss C rss 0 10 1, Drain-Source Voltage [V] C iss = C gs + C gd (C ds = shorted) C oss = C ds + C gd C rss = C gd 1. = 0 V 2. f = 1 MHz, Gate-Source Voltage [V] 12 10 8 6 4 2 = 500V = 800V = 200V 0 0 10 20 30 40 50 60 70 Q G, Total Gate Charge [nc] Note : I = 8A D 3 www.fairchildsemi.com

Typical Performance Characteristics (Continued) Figure 7. Breakdown Voltage Variation vs. Temperature BS, (Normalized) Drain-Source Breakdown Voltage 1.2 1.1 1.0 0.9 1. = 0 V 2. = 250 µ A 0.8-100 -50 0 50 100 150 200 T J, Junction Temperature [ o C] Figure 8. On-Resistance Variation vs. Temperature R DS(ON), (Normalized) Drain-Source On-Resistance 3.0 2.5 2.0 1.5 1.0 0.5 1. = 10 V 2. = 4 A 0.0-100 -50 0 50 100 150 200 T J, Junction Temperature [ o C] Figure 9. Maximum Safe Operating Area Figure 10. Maximum Drain Current vs. Case Temperature 10 2 Operation in This Area is Limited by R DS(on) 8 10 1 1 ms 10 ms DC 10 µs 100 µs 6 4 1. T C = 25 o C 2. T J = 150 o C 3. Single Pulse 2 10-2 10 1 10 2 10 3, Drain-Source Voltage [V] 0 25 50 75 100 125 150 T C, Case Temperature [ ] Figure 11. Transient Thermal Response Curve Z θ JC (t), Thermal Response 10-2 D=0.5 0.2 0.1 0.05 0.02 0.01 single pulse N otes : 1. Z θ JC (t) = 0.56 /W M ax. 2. D uty Factor, D =t 1 /t 2 3. T JM - T C = P DM * Z θ JC (t) P DM t 1 t 2 10-5 10-4 10-3 10-2 10 1 t 1, Square Wave Pulse Duration [sec] 4 www.fairchildsemi.com

Gate Charge Test Circuit & Waveform Resistive Switching Test Circuit & Waveforms Unclamped Inductive Switching Test Circuit & Waveforms 5 www.fairchildsemi.com

Peak Diode Recovery dv/dt Test Circuit & Waveforms 6 www.fairchildsemi.com

7 www.fairchildsemi.com

TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. ACEx Build it Now CorePLUS CorePOWER CROSSVOLT CTL Current Transfer Logic EcoSPARK EfficentMax EZSWITCH * Fairchild Fairchild Semiconductor FACT Quiet Series FACT FAST FastvCore FlashWriter * FPS F-PFS FRFET Global Power Resource SM Green FPS Green FPS e-series GTO IntelliMAX ISOPLANAR MegaBuck MICROCOUPLER MicroFET MicroPak MillerDrive MotionMax Motion-SPM OPTOLOGIC OPTOPLANAR PDP SPM Power-SPM PowerTrench Programmable Active Droop QFET QS Quiet Series RapidConfigure Saving our world, 1mW at a time SmartMax SMART START SPM STEALTH SuperFET SuperSOT -3 SuperSOT -6 SuperSOT -8 SupreMOS SyncFET The Power Franchise TinyBoost TinyBuck TinyLogic TINYOPTO TinyPower TinyPWM TinyWire μserdes UHC Ultra FRFET UniFET VCX VisualMax * EZSWITCH and FlashWriter are trademarks of System General Corporation, used under license by Fairchild Semiconductor. DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative / In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary No Identification Needed Obsolete First Production Full Production Not In Production This datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design. This datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only. Rev. I34 2008 Fairchild Semiconductor Corporation www.fairchildsemi.com