UDN2987x-6 DABIC-5 8-Channel Source Driver with Overcurrent Protection

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Features and Benefits 4.75 to 35 V driver supply voltage Output enable-disable (OE/R) 350 ma output source current Overcurrent protected Internal ground clamp diodes Output Breakdown Voltage 35 V minimum TTL, DTL, PMOS, or CMOS compatible inputs Internal Thermal Shutdown (TSD) Package: 20-pin SOICW (suffix LW) Not to scale Description Providing overcurrent protection for each of its eight sourcing outputs, the UDN2987LW-6 driver is used as an interface between standard low-level logic and relays, motors, solenoids, LEDs, and incandescent lamps. This device includes thermal shutdown and output transient protection/clamp diodes for use with sustaining voltages to 35 V. In this driver, each channel includes a latch to turn off that channel if the maximum channel current is exceeded. All channels are disabled if the thermal shutdown is activated. A common FAULT output is used to indicate either chip thermal shutdown or any overcurrent condition. All outputs are enabled by pulling the common OE/R input high. When OE/R is low, all outputs are inhibited and the eight latches are reset. The OE/R function can be especially important during power-up, in preventing floating inputs from turning on the outputs. Under normal operating conditions, each of eight outputs will source in excess of 100 ma continuously at an ambient temperature of 25 C and a supply of 35 V. The overcurrent fault circuit will protect the device from short-circuits to ground with supply voltages of up to 30 V. Continued on the next page Typical Application CPU IN1 IN2 IN3 IN4 IN5 IN6 2987 OUT1 OUT2 OUT3 OUT4 OUT5 OUT6 1 to 8 Load Components IN7 OUT7 IN8 OUT8 FAULT OE/R GND VS 4.75 to 35 V 29876-DS, Rev. 6

Description (continued) The inputs are compatible with 5 and 12 V logic systems: TTL, Schottky TTL, DTL, PMOS, and CMOS. In all cases, the output is switched ON by an active high input level. Compared to predecessor devices, the UDN2987LW-6 has a significantly faster T PHL (200 ns typical) and a lower driver supply voltage rating (4.75 V), which allows the use of 5 V logic. The UDN2987LW-6 is supplied in a 20-lead small-outline (SOIC-W) plastic package. All packages are lead (Pb) free, with 100% mattetin leadframe plating. Selection Guide Part Number Packing Package UDN2987LWTR-6-T 1000 pieces/13-in. reel 20-pin SOIC, wide body Absolute Maximum Ratings Parameter Symbol Notes Rating Units Supply Voltage V S 35 V Continuous Output Current* I OUT Outputs are disabled at approximately 500 ma 500 ma FAULT Output Voltage V CE 35 V FAULT Output Current I C 30 ma Input Voltage V IN 0.3 to 14 V Junction Temperature T J 150 C Storage Temperature Range T S Range N 55 to 150 C Operating Temperature Range T A 20 to 85 C *For input and output current specifications, negative current is defined as coming out of (sourcing) the specified device pin. 2

Functional Block Diagram VS Thermal Shut Down OE/R FAULT <1Ω R Q S + IN1 OUT1 Driver 1 of 8 drivers IN8 OUT8 GND Pin-Out Diagram IN1 1 20 OUT1 IN2 IN3 IN4 IN5 IN6 IN7 IN8 2 3 4 5 6 7 8 19 18 17 16 15 14 13 OUT2 OUT3 OUT4 OUT5 OUT6 OUT7 OUT8 FAULT 9 x8 OEN OE 12 GND OE/R 10 FF SENSEN 11 VS Dwg. PP-067 Terminal List Table Number Name Description 1 IN1 Logic input 1 2 IN2 Logic input 2 3 IN3 Logic input 3 4 IN4 Logic input 4 5 IN5 Logic input 5 6 IN6 Logic input 6 7 IN7 Logic input 7 8 IN8 Logic input 8 9 FAULT Fault output 10 OE/ R Logic input for Output Enable and Reset 11 VS Supply voltage 12 GND Supply ground 13 OUT8 Output 8 to load 14 OUT7 Output 7 to load 15 OUT6 Output 6 to load 16 OUT5 Output 5 to load 17 OUT4 Output 4 to load 18 OUT3 Output 3 to load 19 OUT2 Output 2 to load 20 OUT1 Output 1 to load 3

ELECTRICAL CHARACTERISTICS, valid at T A = 25 C, V OER = 2.4 V, V S = 35 V, unless otherwise noted Characteristic Symbol Test Conditions Min. Typ. 1 Max. Units Supply Voltage Functional Range V S 4.75 35 V Output Leakage Current 2 I OUTCEX V IN = 0.4 V, all inputs simultaneously 200 < 5.0 μa Output Sustaining Voltage V OUT(sus) I OUT = 350 ma, L = 2.0 mh 35 V Output Saturation Voltage V OUT(SAT) V IN = 2.4 V, I OUT = 225 ma 1.7 1.9 V V IN = 2.4 V, I OUT = 100 ma 1.6 1.8 V V IN = 2.4 V, I OUT = 350 ma 1.8 2.0 V Channel Shut Down Threshold 2 I M V IN = 2.4 V, V s = 30 V 500 370 ma FAULT Leakage Current I CEX V CC = 35 V <1.0 100 μa FAULT Saturation Voltage V CE(SAT) I C = 30 ma 0.3 0.8 V Input Voltage V IN(ON) 2.4 V V IN(OFF) 0.4 V I IN(ON) Input Current: INx, OE/R pins V IN = 5.0 V 600 μa V IN = 12 V 1000 μa V IN = 2.4 V 100 μa I IN(OFF) V IN = 0.4 V 15 μa Clamp Diode Leakage Current I R V R = 35 V, T A = 70 C 50 μa Clamp Diode Forward Voltage V F I F = 350 ma 1.5 1.8 V Supply Current I S(ON) V IN = 2.4 V, all inputs simultaneously; outputs open 7.0 18 ma I S(OFF) V IN = 0.4 V, all inputs simultaneously 6.0 12 ma Thermal Shut Down T JTSD 165 C Thermal Hysteresis T JTSDhys 15 C Reset Pulse Duration t RPD 1.0 μs t PLH V S = 35 V, R L = 100 Ω, C LOAD = 30 pf 100 600 ns Propagation Delay Time t PHL V S = 35 V, R L = 100 Ω, C LOAD = 30 pf 200 1000 ns Blank Time t BLANK 1.0 μs 1 Typical data are for initial design estimations only, and assume optimum manufacturing and application conditions. Performance may vary for individual units, within the specified maximum and minimum limits. 2 For input and output current specifications, negative current is defined as coming out of (sourcing) the specified device pin. 4

THERMAL CHARACTERISTICS Characteristics Symbol Test Conditions Rating Unit Package Thermal Resistance * R θja Package LW, on 4-layer board based on JEDEC standard 48 C/W * Additional thermal information is available on the Allegro Web site. 4.0 Power Dissipation versus Ambient Temperature 3.5 3.0 PD (W) 2.5 2.0 Package LW (R JA = 48 ºC/W) 1.5 1.0 0.5 0 25 50 75 100 125 150 T A ( C) 5

Characteristic Performance Output Current Waveshapes V IN(A) = V IN(B) OE/R t PLH t RTB t PHL Output (A) shorted I SH I OUT(A) t BLANK I M I OUT(B) Momentary fault or capacitive charging (<1μs) Allowable Output Current as a Function of Duty Cycle (Multiply by 78% for UDN2987LW-6) T A = 25 C, V S = 35 V T A = 50 C, V S = 35 V 400 350 Quantity of outputs conducting simultaneously 8 7 6 5 4 3 400 350 Quantity of outputs conducting simultaneously 8 7 6 5 4 3 2 Collector Current (ma) 300 250 200 150 100 Collector Current (ma) 300 250 200 150 100 50 50 0 0 10 20 30 40 50 60 70 80 90 100 0 0 10 20 30 40 50 60 70 80 90 100 Duty Cycle (%) Duty Cycle (%) 6

+ + + UDN2987x-6 Applications Information and Circuit Description As with all power integrated circuits, the UDN2987LW-6 has a maximum allowable output current rating. The 500 ma rating does not imply that operation at that value is permitted or even obtainable. The channel output current trip point is specified as 370 ma, minimum; therefore, attempted operation at current levels greater than 370 ma may cause a fault indication and channel shutdown. The device is tested at a maximum of 350 ma and that is the recommended maximum output current per driver. It provides protection for current overloads or shorted loads up to 30 V. All outputs are enabled by pulling the OE/R input high. When OE/R is low or allowed to float (internal pull-down), all outputs are inhibited and the latches are reset. Note that the reset pulse duration (OE/R low) should be at least 1 μs. This will ensure safe operation under attempted reset conditions with a shorted load. The latches are also reset during power-up, regardless of the state of the OE/R input. The load current causes a small voltage drop across the internal low-value sense resistor. This voltage is compared to the voltage drop across a reference resistor with a constant current. The two resistors are matched to eliminate errors due to manufacturing tolerances or temperature effects. Each channel includes a comparator and its own latch. An overcurrent fault (V SENSE > V REF ) will set the affected latch and shut down only that channel. All other channels will continue to operate normally. The latch includes a 1 μs blanking delay, t BLANK, to prevent unwanted triggering due to crossover currents generated when switching inductive loads. For an abrupt short circuit, the blanking and output switching times will allow a brief, permissible current in excess of the trip current before the output driver is turned off. A common thermal shutdown disables all outputs if the chip temperature exceeds 165 C. At thermal shutdown, all latches are reset. The outputs are disabled until the chip cools down to approximately 150 C (thermal hysteresis). In the event of an overcurrent condition on any channel, or chip thermal shutdown, the FAULT open-collector output is pulled low (turned on). Overcurrent Fault Sense Circuit V S V REF Matched V SENSE To Fault Latch SENSE REF I LOAD I REF 7

Package LW, 20-pin SOIC-W 12.80±0.20 20 4 ±4 0.27 +0.07 0.06 2.25 20 7.50±0.10 10.30±0.33 9.50 A 0.84 +0.44 0.43 1 2 0.25 1 2 0.65 1.27 20X 0.10 C SEATING PLANE C SEATING PLANE GAUGE PLANE B PCB Layout Reference View 0.41 ±0.10 1.27 0.20 ±0.10 2.65 MAX For Reference Only Dimensions in millimeters (Reference JEDEC MS-013 AC) Dimensions exclusive of mold flash, gate burrs, and dambar protrusions Exact case and lead configuration at supplier discretion within limits shown A Terminal #1 mark area B Reference pad layout (reference IPC SOIC127P1030X265-20M) All pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary to meet application process requirements and PCB layout tolerances 8

Revision History Revision Revision Date Description of Revision Rev. 6 April 30, 2012 Update product availability Copyright 2006-2013, reserves the right to make, from time to time, such de par tures from the detail spec i fi ca tions as may be required to permit improvements in the per for mance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. Allegro s products are not to be used in life support devices or systems, if a failure of an Allegro product can reasonably be expected to cause the failure of that life support device or system, or to affect the safety or effectiveness of that device or system. The in for ma tion in clud ed herein is believed to be ac cu rate and reliable. How ev er, assumes no responsibility for its use; nor for any in fringe ment of patents or other rights of third parties which may result from its use. For the latest version of this document, visit our website: www.allegromicro.com 9