Dual.W Audio Power Amplifier GENERAL DESCRIPTION The SGM4863 is a dual bridge-connected audio power amplifier which, when connected to a 5V supply, will deliver.w into a 4Ω load or.5w into a 3Ω load with typically % THD+N. In addition, the headphone input pin allows the amplifiers to operate in single-ended mode when driving stereo headphones. To simplify audio system design, the SGM4863 combines dual bridge speaker amplifiers and stereo headphone amplifiers on one chip. The SGM4863 features a low power consumption shutdown mode and thermal shutdown protection. It also utilizes circuitry to reduce pop/click during device turn-on. The SGM4863 is available in Green TSSOP- (Exposed Pad), TQFN-3 3-L, TSSOP-6 (Exposed Pad), SOIC-6 and DIP-6 packages. It operates over an ambient temperature range of -4 to +85. FEATURES.5W into 3Ω Load from 5V Power Supply at THD+N = % (Typical, per Channel).W into 4Ω Load from 5V Power Supply at THD+N = % (Typical, per Channel).3W into 8Ω Load from 5V Power Supply at THD+N = % (Typical, per Channel) Low Shutdown Current:.3μA Operation Supply Voltage:.8V to 5.5V Stereo Headphone Amplifier Mode Pop/Click Suppression Circuitry Unity-Gain Stable Thermal Shutdown Protection Circuitry -4 to +85 Operating Temperature Range Available in Green TSSOP- (Exposed Pad), TQFN-3 3-L, TSSOP-6 (Exposed Pad), SOIC-6 and DIP-6 Packages APPLICATIONS Multimedia Monitors Portable and Desktop Computers Portable Televisions REV. B. 3
PACKAGE/ORDERING INFORMATION Dual.W Audio Power Amplifier MODEL ORDER NUMBER PACKAGE DESCRIPTION PACKAGE OPTION MARKING INFORMATION SGM4863 SGM4863YPTSG/TR TSSOP- (Exposed Pad) Tape and Reel, 3 SGM4863YPTS SGM4863YTQGG/TR TQFN-3 3-L Tape and Reel, 3 SGM4863QG SGM4863YPTS6/TR TSSOP-6 (Exposed Pad) Tape and Reel, 3 SGM4863YPTS6 SGM4863YS6/TR SOIC-6 Tape and Reel, 5 SGM4863YS6 SGM4863YP6 DIP-6 Tube (5pcs) SGM4863YP6 Green (RoHS & HSF): defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If you have additional comments or questions, please contact your SGMICRO representative directly. ABSOLUTE MAXIMUM RATINGS Supply Voltage...6V Input Voltage..-.3V to () +.3V Storage Temperature Range -65 to +5 Junction Temperature..5 Operating Temperature Range...-4 to +85 Lead Temperature Range (Soldering sec). 6 ESD Susceptibility HBM...4V MM 4V NOTE: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. CAUTION This integrated circuit can be damaged by ESD if you don t pay attention to ESD protection. SGMICRO recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. SGMICRO reserves the right to make any change in circuit design, specification or other related things if necessary without notice at any time. Please contact SGMICRO sales office to get the latest datasheet.
Dual.W Audio Power Amplifier PIN CONFIGURATIONS (TOP VIEW) SHUTDOWN HP-IN SHUTDOWN HP-IN 9 9 8 7 6 +OUTA -OUTA -INA 3 4 5 6 8 7 6 5 +OUTB -OUTB -INB +OUTA -OUTA 3 5 4 3 +OUTB -OUTB +INA 7 4 BYPASS 8 3 +INB 9 -INA 4 5 6 7 8 9 -INB BYPASS TSSOP- (Exposed Pad) +INA TQFN-3 3-L +INB SHUTDOWN 6 HP-IN SHUTDOWN 6 HP-IN 5 5 +OUTA 3 4 +OUTB +OUTA 3 4 +OUTB -OUTA -INA 4 5 6 3 -OUTB -INB -OUTA -INA 4 5 6 3 -OUTB -INB 7 BYPASS 7 BYPASS +INA 8 9 +INB +INA 8 9 +INB TSSOP-6 (Exposed Pad) SOIC-6/DIP-6 LOGIC LEVEL TRUTH TABLE SHUTDOWN HP-IN PIN OPERATIONAL MODE Low Logic Low Bridged Amplifiers Low Logic High Amplifiers High Logic Low Micro-Power Shutdown High Logic High Micro-Power Shutdown 3
ELECTRICAL CHARACTERISTICS (The following specifications apply for = 5V, limits apply for T A = +5 C, unless otherwise noted.) Dual.W Audio Power Amplifier PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage.8 5.5 V V IN = V, I O = A (), BTL mode 5.7 Quiescent Power Supply Current I Q ma V IN = V, I O = A (), SE mode 3. 5 Shutdown Current I SD applied to the SHUTDOWN pin.3 μa Headphone Sense High Input Voltage V IH Hold High for SE mode 4 V Headphone Sense Low Input Voltage V IL Hold Low for BTL mode 3. V Shutdown Voltage Input High V SDIH.6 V Shutdown Voltage Input Low V SDIL.5 V Turn-On Time T ON C BYPASS = μf 48 ms ELECTRICAL CHARACTERISTICS FOR BRIDGED-MODE OPERATION (The following specifications apply for = 5V, limits apply for T A = +5 C, unless otherwise noted.) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Output Offset Voltage V OS V IN = V 9 3 mv Output Power () P O THD+N = %, f = khz THD+N = %, f = khz R L = 3Ω.5 R L = 4Ω. R L = 8Ω.3 R L = 3Ω 3. R L = 4Ω.6 R L = 8Ω.6 W Total Harmonic Distortion + Noise THD+N f = khz, R L = 4Ω, P O = W.4 A VD = R L = 8Ω, P O = W.3 % Power Supply Rejection Ratio PSRR V RIPPLE = mv RMS, f = khz -7 db R L = 8Ω, C BYPASS =.µf f = 7Hz -73 Crosstalk X TALK f = khz, C BYPASS =.µf -86 db Signal to Noise Ratio SNR = 5V, P O =.W, R L = 8Ω, BW < 8kHz -99 db 4
Dual.W Audio Power Amplifier ELECTRICAL CHARACTERISTICS FOR SINGLE-MODE OPERATION (The following specifications apply for = 5V, limits apply for T A = +5 C, unless otherwise noted.) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Output Offset Voltage V OS V IN = V 5 3 mv THD+N = %, f = khz, R L = 8Ω 34 THD+N = %, f = khz, R L = 8Ω 44 Output Power P O THD+N = %, f = khz, R L = 6Ω 9 THD+N = %, f = khz, R L = 6Ω 3 mw THD+N = %, f = khz, R L = 3Ω 9 Total Harmonic Distortion + Noise Power Supply Rejection Ratio THD+N PSRR THD+N = %, f = khz, R L = 3Ω A V = -, P O = 75mW, Hz f khz, R L = 3Ω V RIPPLE = mv RMS, C BYPASS =.µf f = khz -78 f = 7Hz -74. % db Crosstalk X TALK f = khz, C BYPASS =.µf -8 db Signal to Noise Ratio SNR P O = 34mW, R L = 8Ω, BW < 8kHz - db NOTES:. The quiescent power supply current depends on the offset voltage when a practical load is connected to the amplifier.. When driving 3Ω or 4Ω loads, the SGM4863 must be mounted to a circuit board that has a minimum of.5in of exposed, uninterrupted copper area connected to the package s exposed DAP. 5
TYPICAL APPLICATION Dual.W Audio Power Amplifier R F kω L H C S + μf TANT kω AUDIO INPUT C I.39μF R I kω -INA +INA _ Amp A + SHUTDOWN -OUT A C O μf + kω C BYPASS μf + BYPASS _ Amp A + + Amp B _ +OUT A HP-IN +OUT B R L 8Ω kω R L 8Ω kω CONTROL PIN RING TIP HEADPHONE JACK SLEEVE AUDIO INPUT C I R I.39μF kω +INB -INB + Amp B _ -OUT B + C O μf kω R F kω NOTES:. It is necessary to connect the schottky barrier diode with the power supply to prevent IC destruction during power supply surge.. A kω resistor must be serially connected to SHUTDOWN pin. EXTERNAL COMPONENTS DESCRIPTION COMPONENTS R I C I R F C S C BYPASS FUNCTIONAL DESCRIPTION The inverting input resistance, along with R F, set the closed-loop gain. R I, along with C I, form a high pass filter with f C = /(πr I C I ). The input coupling capacitor blocks DC voltage at the amplifier s input terminals. C I, along with R I, create a highpass filter with f C = /(πr IC I). The feedback resistance, along with R I, set the closed-loop gain. The supply bypass capacitor. The capacitor, C BYPASS, filters the half-supply voltage present on the BYPASS pin. 6
Dual.W Audio Power Amplifier SGM4863 TYPICAL PERFORMANCE CHARACTERISTICS.. f = khz THD+N vs. Output Power f = khz = 5V, R L = 3Ω, A V = -, BW < 8kHz,. f = Hz.... THD+N vs. Output Power = 5V, R L = 6Ω, A V = -, BW < 8kHz, f = Hz f = khz f = khz... THD+N vs. Output Power = 5V, R L = 8Ω, A V =, BW < 8kHz, Bridged THD+N vs. Output Power = 5V, R L = 4Ω BW < 8kHz.. f = khz f = khz f = Hz.. f = khz f = khz f = Hz........ THD+N vs. Output Power = 5V, R L = 3Ω BW < 8kHz f = khz f = khz f = Hz.. THD+N vs. Output Power = 3.3V, R L = 8Ω A V = f = khz f = khz f = Hz...... 7
Dual.W Audio Power Amplifier SGM4863 TYPICAL PERFORMANCE CHARACTERISTICS = 3.3V, R L = 4Ω A V = THD+N vs. Output Power THD+N vs. Frequency A V = - f = khz. f = khz f = Hz...... A V = -5 A V = - = 5V, R L = 3Ω P O = 75mW, No filters..... THD+N vs. Frequency A V = -5 A V = - A V = - = 5V, R L = 6Ω P O = 5mW, No filters..... THD+N vs. Frequency A V = A V = A V = = 5V, R L = 8Ω P O = W, No filters Bridged Load.. THD+N vs. Frequency = 5V, R L = 4Ω, P O = W A V =, No filters THD+N vs. Frequency = 5V, R L = 3Ω, P O =.W A V =, No filters.......... 8
Dual.W Audio Power Amplifier SGM4863 TYPICAL PERFORMANCE CHARACTERISTICS THD+N vs. Frequency THD+N vs. Frequency = 3.3V, R L = 8Ω, P O = 45mW A V =, No filters = 3.3V, R L = 4Ω, P O = 75mW A V =, No filters.......... PSRR (db) - -4-6 Power Supply Rejection Ratio vs. Frequency = 5V R L = 3Ω mvrms PSRR (db) - -4-6 Power Supply Rejection Ratio vs. Frequency = 5V R L = 8Ω mvrms Bridged Load -8-8 -.. -.. Crosstalk vs. Frequency Crosstalk vs. Frequency -6-7 = 5V, R L = 8Ω, P O = W, Bridged Load -6-7 = 5V, R L = 3Ω, P O = 75mW, Level (db) -8-9 - Level (db) -8-9 - - - -.. -.. 9
Dual.W Audio Power Amplifier SGM4863 TYPICAL PERFORMANCE CHARACTERISTICS. Power Dissipation vs. Output Power Power Dissipation vs. Output Power Power Dissipation (W).8.6.4. R L = 3Ω R L = 6Ω = 5V, f = khz THD+N % BW < 8kHz Single Channel.4.8..6. Power Dissipation (W).6..8.4 R L = 8Ω R L = 4Ω R L = 3Ω = 5V, f = khz Bridged Load THD+N % BW < 8kHz Single Channel.5.5.5 3.8.5..9.6.3 Output Power vs. Supply Voltage R L = 3Ω f = khz BW < 8kHz THD+N = % THD+N = %.3.4.8..6 Output Power vs. Supply Voltage R L = 6Ω f = khz BW < 8kHz THD+N = % THD+N = %.5 3 3.5 4 4.5 5 5.5 6 Supply Voltage (V).5 3 3.5 4 4.5 5 5.5 6 Supply Voltage (V).5.5.5 Output Power vs. Supply Voltage R L = 8Ω f = khz BW < 8kHz Bridged Load THD+N = % THD+N = % 4 3..4.6.8 Output Power vs. Supply Voltage R L = 4Ω f = khz BW < 8kHz Bridged Load THD+N = % THD+N = %.5 3 3.5 4 4.5 5 5.5 6 Supply Voltage (V).5 3 3.5 4 4.5 5 5.5 6 Supply Voltage (V)
Dual.W Audio Power Amplifier SGM4863 TYPICAL PERFORMANCE CHARACTERISTICS 5 4 3 Output Power vs. Supply Voltage R L = 3Ω f = khz BW < 8kHz Bridged Load THD+N = % THD+N = % Supply Current (ma) 8 6 4 V IN = V No Load Supply Current vs. Supply Voltage HP - IN =, Bridged Load HP - IN =,.5 3 3.5 4 4.5 5 5.5 6 Supply Voltage (V).5 3 3.5 4 4.5 5 5.5 6 Supply Voltage (V) Output Power (w).75.5.5.75.5.5 Output Power vs. Load Resistance THD+N = % THD+N = % = 5V, f = khz A V =, BW < 8kHz, Bridged Load 3 4 5 6 7 Load Resistance (Ω) Output Power (w)..8.6.4 Output Power vs. Load Resistance THD+N = % = 5V, f = khz A V = -, BW < 8kHz,. THD+N = % 3 4 5 6 7 Load Resistance (Ω)
PACKAGE OUTLINE DIMENSIONS Dual.W Audio Power Amplifier TSSOP- (Exposed Pad) D D 4. E E E 3 5.94 b e.78.5 MIN.4.65 RECOMMENDED LAND PATTERN (Unit: mm) L A A A θ H c Symbol In Millimeters In Inches MIN MAX MIN MAX A..43 A.5.5..6 A.8..3.39 b.9.3.7. c.9..4.8 D 6.4 6.6.5.59 D 4. 4.3.65.69 E 4.3 4.5.69.77 E 6.5 6.55.46.58 E.9 3..4. e.65 BSC.6 BSC L.5.7..8 H.5 TYP. TYP θ 7 7
PACKAGE OUTLINE DIMENSIONS Dual.W Audio Power Amplifier TQFN-3 3-L D e L D E E N k b N TOP VIEW BOTTOM VIEW.5.7 A 3.5..5 A SIDE VIEW A.4. RECOMMENDED LAND PATTERN (Unit: mm) In Millimeters In Inches Symbol MIN MAX MIN MAX A.7.8.8.3 A..5.. A.3 REF.8 REF D.94 3.76.5. D.4.6.55.63 E.94 3.76.5. E.4.6.55.63 k. MIN.8 MIN b.5.5.6. e.4 TYP.6 TYP L.34.476.3.9 3
PACKAGE OUTLINE DIMENSIONS Dual.W Audio Power Amplifier TSSOP-6 (Exposed Pad) D D 3. E E E.3 5.94.78 e b.4.65 RECOMMENDED LAND PATTERN (Unit: mm) L A A A θ H c In Millimeters In Inches Symbol MIN MAX MIN MAX A..43 A.5.5..6 A.8..3.39 b.9.3.7. c.9..4.8 D 4.9 5..93. D.9 3..4. E 4.3 4.5.69.77 E 6.5 6.55.46.58 E..4.87.94 e.65 BSC.6 BSC L.5.7..8 H.5 TYP. TYP θ 7 7 4
PACKAGE OUTLINE DIMENSIONS Dual.W Audio Power Amplifier SOIC-6 D e.75 E E 5.6.7.65 RECOMMENDED LAND PATTERN (Unit: mm) L A b A A θ c In Millimeters In Inches Symbol MIN MAX MIN MAX A.35.75.53.69 A..5.4. A.35.55.53.6 b.33.5.3. c.7.5.6. D 9.8..386.4 E 3.8 4..5.57 E 5.8 6..8.44 e.7 BSC.5 BSC L.4.7.6.5 θ 8 8 5
PACKAGE OUTLINE DIMENSIONS Dual.W Audio Power Amplifier DIP-6 E A e A L A b b E c D E In Millimeters In Inches Symbol MIN MAX MIN MAX A 3.7 4.3.46.7 A.5. A 3. 3.6.6.4 b.38.57.5. b.54 BSC.6 BSC c.4.36.8.4 D 8.8 9..74.756 E 6. 6.6.44.6 E 7.3 7.9.88.3 e.54 BSC. BSC L 3. 3.6.8.4 E 8.4 9..33.354 6
TAPE AND REEL INFORMATION Dual.W Audio Power Amplifier REEL DIMENSIONS TAPE DIMENSIONS P P W Q Q Q Q Q Q B Q3 Q4 Q3 Q4 Q3 Q4 Reel Diameter P A K Reel Width (W) DIRECTION OF FEED NOTE: The picture is only for reference. Please make the object as the standard. KEY PARAMETER LIST OF TAPE AND REEL Package Type TSSOP- (Exposed Pad) Reel Diameter Reel Width W A B K P P P W Pin Quadrant 3.4 6.8 6.85.7 4. 8... Q SOIC-6 3 6.4 6.5.3. 4. 8.. 6. Q TSSOP-6 (Exposed Pad) 3.4 6.9 5.6. 4. 8... Q TQFN-3 3-L 3.4 3.3 3.3. 4. 4... Q 7
CARTON BOX DIMENSIONS Dual.W Audio Power Amplifier NOTE: The picture is only for reference. Please make the object as the standard. KEY PARAMETER LIST OF CARTON BOX Reel Type Length Width Height Pizza/Carton 3 386 8 37 5 8