TransiionMode PFC and QuasiResonan Curren Mode PWM Conroller REV: 05 General Descripion The feaures ransiion mode Power Facor correcion (PFC) conroller and QuasiResonan (QR) curren mode conroller for cos effecive and fewer exernal componens design of high power applicaion. The inelligen PFC swiching ON/OFF, zero curren deecion (ZCD) and frequency limiaion mechanism enable a beer efficiency under any load condiions. The device is also inegraed several funcions of proecion, such as XCAP discharge, Brownin/ou proecion, Over Load proecion (OLP), Over Temperaure Proecion (OTP), Over Volage Proecion (OVP) and Over Curren Proecion (OCP) wih High / Low Line Compensaion. Therefore i can proec he sysem from damage due o occasional failure. The is available in a SOP16 package. Feaures Inegraed PFC and QR Flyback Conroller Transiion Mode PFC Conroller QuasiResonan Operaion for Flyback Builin XCAP Discharging Brown IN/OUT Proecion Inernal SofSar Funcion Adjusmen OLP Debounce ime Exernal Lach Proecion PFC Ligh Load Turnoff Conrol OVP (Over Volage Proecion) OCP (Cycle by cycle curren limiing) 500/1200mA Driving Capabiliy Inernal OTP funcion Applicaions ACDC High Power Adaper Open Frame SMP Typical Applicaion AC Inpu EMI Filer 8 12 11 9 PFCAUX PFCDRIVER PFCSENSE VOSENSE 16 HV FBDRIVER 13 7 PFC ON/OFF 6 PFCCOMP FBSENSE 10 1 FBCOMP 3 4 FBAUX GND 2 CT 14 LATCH 5 phoocoupler 1
Pin Configuraion SOP16 (TOP VIEW) GND FBCOMP FBAUX LATCH PFCCOMP PFCONOFF PFCAUX 1 2 3 4 5 6 7 8 TOP MARK YYWWPP 16 15 14 13 12 11 10 9 HV NC CT FBDRIVER PFCDRIVER PFCSENSE FBSENSE VOSENSE YY: Year code WW: Week code PP: Producion code Ordering Informaion Par number Package Top Mark Shipping GS SOP16 GS 2500 /ape & reel The is ROHS complian/ green packaged. Proecion Mode OVP Par number ( & FBAUX) OLP Exernal Lach Inernal OTP GS Auo recovery Auo recovery Lach Auo recovery 2
Pin Descripions Pin NAME FUNCTION 1 Supply volage pin. 2 GND Ground. 3 FBCOMP Volage feedback pin for flyback sage. Connec a phoocoupler o close he conrol loop and achieve he regulaion. 4 FBAUX Zero curren deecion and over volage proecion for flyback sage. 5 LATCH Exernal lach proecion pin. 6 PFCCOMP Oupu of he error amplifier for PFC volage loop compensaion. 7 PFCONOFF Threshold volage seing of FBCOMP for PFC ON/OFF loading conrol. 8 PFCAUX Zero curren deecion for PFC sage. 9 VOSENSE Volage sense for PFC oupu, regulaion volage is 2.5V. 10 FBSENSE Curren sense pin. Connec i o sense he Flyback MOSFET curren. 11 PFCSENSE Curren sense pin. Connec i o sense he PFC MOSFET curren. 12 PFCDRIVER Gae drive oupu o drive he exernal MOSFET for PFC. 13 FBDRIVER Gae drive oupu o drive he exernal MOSFET for Flyback. 14 CT Timer seing for Open Loop Proecion, PFC lighload urnoff and flyback sofsar. 15 NC Unconneced Pin. 16 HV Connec his pin o Line/Neural of AC main volage hrough a resisor o provide he sarup curren for he conroller. When volage increases o rip he poin of UVLO(on), his HV loop will be urned off o reduce he power loss over he sarup circui. HV pin Inernal circui will deec he AC peak volage, providing Brown in/ou and High / Low Line Deecion funcion. HV pin inernal circui will discharge Xcap s energy hrough HV curren source when AC line is disconneced. 3
Block Diagram HV Line Volage Deecion ACOFF Deecion HV Sarup Brownou High AC Inpu AC Off 18V / 8V 31.5V Inernal Bias 7V OVP Comparaor UVLO Comparaor OVP PDR Power Good OK GND PFCDRIVER PFCSENSE FBAUX FBCOMP PFC ON/OFF 13V 0.52V High AC Inpu: 0.40V V CT Clamp Circui & OVP Deecion V BIAS V BIAS 25.75/25µA 4.2V 2.9V Buffer Triangle Wave Generaor AC Off OK Enable PFC OVP Power Good PFC ON Proecion Curren Limi Comparaor Zero Curren Deecion Max. Freq Limi & Green Mode OLP Clock 4.5R 1R Debounce PFC ON/OFF Debounce Clock Q Heavy Load PFC ON S R PFC LEB LEB Inernal Thermal Shudown Enable PFC OVP PFC OVP Comparaor High AC Inpu PWM Comparaor S R Inernal OTP Proecion Zero Curren Q Deecor GM Enable Power Good Proecion Heavy Load High AC Inpu 4V 1.1/0.9V 2.63/2.5V V BIAS 0.65V PWM Comparaor Sofsar Comparaor Ramp Generaor V CT 8µA 2.5V 13V V BIAS 200µA PFCAUX VOSENSE PFCCOMP FBDRIVER FBSENSE CT V BIAS 1.35/1.25V Debounce Exernal Lach Auo Mode Proecion Brownou AC Off OVP/ FB OVP OLP Inernal OTP Lach Mode Proecion Exernal Lach LATCH 4
Absolue Maximum Raings 0.3V ~ OVP HV 0.3V ~ 500V FBCOMP, PFCCOMP, FBSENSE, PFCSENSE, FBAUX, PFCAUX, VOSENSE, LATCH, CT, PFCONOFF 0.3V ~ 6V FBDRIVER, PFCDRIVER 0.3V ~ Vcc0.3V Power Dissipaion, SOP16 600mW Package Thermal Resisance SOP16, JA 110 C/W SOP16, JC 36 C/W Juncion Temperaure 150 C Lead Temperaure (Soldering, 10sec) 260 C Sorage Temperaure Range 55 C ~ 150 C ESD Volage Proecion, Human Body Model, (Pin 3~11 and Pin 14) 3.5KV ESD Volage Proecion, Human Body Model, (Pin 1, 12, 13) 2.5KV ESD Volage Proecion, Human Body Model, (Pin 16) 1.0KV ESD Volage Proecion, Machine Model (excep HV Pin) 250V Gae Oupu Curren 500mA/1200mA Recommended Operaing Condiions Supply Volage 10V ~ 29.5V Capacior 47uF ~ 100µF HV Pin Resisor 10k ~ 50k FBCOMP Capacior Value 1nF ~ 10nF VOSENSE Capacior Value 1nF ~ 10nF PFCAUX Pin Resisor 10k ~ 30k PFCAUX Sink and Source Curren Seing 1mA Operaing Ambien Temperaure 40 C ~ 85 C Operaing Juncion Temperaure Range 40 C ~ 125 C Noe: 1. I s essenial o connec COMP pin wih a capacior o filer ou he undesired swiching noise for sable operaion. 2. Place he small signal componens closed o IC pin as possible. Cauion: Sress exceeding Maximum Raings may damage he device. Maximum Raings are sress raings only. Funcional operaion above he Recommended Operaing Condiions is no implied. Exended exposure o sress above Recommended Operaing Condiions may affec device reliabiliy. 5
Elecrical Characerisics (T A = 25 C unless oherwise saed, =15.0V) PARAMETER CONDITIONS SYM MIN TYP MAX UNITS HighVolage Supply (HV Pin) HighVolage Curren Source for Sarup OffSae Leakage Curren Line Volage Deecion (HV Pin) < PDR, VHV = 80V I HV1 1.20 1.50 1.80 ma > PDR, VHV = 80V I HV3 2.00 3.00 4.00 ma Afer UVLO(on), VHV = 500V I HVOFF500 32 A XCap Discharge Curren * I HVXCAP 3 ma Brownin Level V BNI 98 105 112 V Brownou Level V BNO 89 95 101 V Brownin BrownOu Level * V BNHYS 10 V BrownOu Debounce Time * T DBNO 75 ms High Line Trip Level V HLINE 220 V Low Line Trip Level V LLINE 184 V High Line Threshold Low Line Level Supply Volage ( Pin) Holding Curren Before UVLO (on) Operaing Curren V LINHYS 5 V < UVLO (on) I ST 150 A < UVLO (on), VLATCH = 0V VFBCOMP = 0V, PFC & Flyback OFF VFBCOMP = 3V, PFC & Flyback ON I LCH 300 A I BST 1.3 ma I 3 2 ma UVLO (off) (20 C ~125 C) V UVOFF 7.5 8.0 8.5 V UVLO (on) (20 C ~125 C) V UVON 17.0 18.0 19.0 V OVP Level V CCOVP 30.5 31.5 32.5 V OVP Debounce Time * T DOVP 64 s Power Down Rese Volage (PDR) PFC ON/OFF Conrol (PFCONOFF pin) Source Curren for PFC OFF Threshold Seing Source Curren for PFC ON Threshold Seing PDR 6 7 8 V I PFCOFF 24.10 25.00 25.90 A I PFCON 25.75 A 6
PARAMETER CONDITIONS SYM MIN TYP MAX UNITS PFC OFF & Open Loop Proecion Debounce Timer Seing (CT Pin) CT=0.047 F, VFBCOMP > VOLP, T DOLP 64 ms OLP Debounce Time afer sarup CT=0.047 F, VFBCOMP > VOLP, T DOLPST 74 ms a sarup * FB Sof Sar Time CT=0.047 F * T FBSS 10 ms OSCP Debounce Time CT=0.047 F, VFBCOMP > VOLP, = UVLO (off) 1V, afer sarup T DOSCP 16 ms PFC Turnoff Debounce VFBCOMP < VPFC Time ON/OFF, CT=0.047 F T DPFCOFF 1 s Exernal Lach (LATCH Pin) LATCH Pin Source Curren I LCH 75 80 85 A TurnOn Trip Level V LATCHON 1.30 1.35 1.40 V TurnOff Trip Level V LATCHOFF 1.20 1.25 1.30 V OTP LATCH pin debounce ime Disable (High o Low) T DLATCHOFF 400 500 600 s On Chip OTP (Inernal Thermal Shudown) OTP Level * T SHUTDOWN 140 C OTP Hyseresis * T RESTART 40 C PFC Oupu Volage Sensing (VOSENSE pin) Reverence Inpu Volage, V REF PFC OVP Trip Level Source Curren of VOSENSE Enable and Disable Threshold Volage VOSENSE Pull Down Resisance (20 C ~125 C) V FBREF 2.47 2.50 2.53 V V PFCOVP 2.59 2.63 2.67 V OVP Hyseresis V PFCOVPHYS 0.115 0.130 0.145 V Debounce ime * T DPFCOVP 50 s VHV PEAK = 150V I FOLBTLV 8 A VHV PEAK = 250V I FOLBTHV 0.1 A PFC & Flyback Enable Threshold V PFCEN 1.0 1.1 1.2 V PFC Disable Threshold V PFCENL 0.8 0.9 1.0 V Debounce Time * T DPFCEN 50 µs R VOSENSE 5 6 7 M 7
PARAMETER CONDITIONS SYM MIN TYP MAX UNITS PFC Error Amplifier (PFCCOMP Pin) Transconducance GM 60 80 100 mho Oupu Upper Clamp Volage VOSENSE = V REF 0.1V V PCOMPMAX 5.0 5.2 5.4 V Oupu Minimum Clamp Volage V PCOMPMIN 0.85 0.90 0.95 V Trip Level for PFCDRIVER Sop PFC Burs Mode Trip Level for PFCDRIVER Sar PFC Maximum OnTime V PCOMPOFF 0.95 1.00 1.05 V Threshold for PFCDRIVER V PCOMPON sop V 50mV PFC Max. OnTime VHV PEAK = 150V T ONMAXPLV 22 25 28 s VHV PEAK = 250V T ONMAXPHV 7 8 9 s PFC Minimum OffTime PFC Minimum OffTime * T POFFMIN 1 s PFC Maximum Frequency PFC Maximum Frequency F MAXPFC 225 250 275 khz PFC Curren Sensing (PFCSENSE Pin) Curren Sense Inpu VHV PEAK = 150V V PFCCSLV 0.47 0.52 0.57 V Threshold Volage VHV PEAK = 250V V PFCCSHV 0.40 V Sof Sar * FBSENSE = 0.05~0.52V T PFCSS 10 ms Leading Edge Blanking ime T LEBPFC 180 250 320 ns PFC Zero Curren Deecor (PFCAUX Pin) Upper Clamp Volage IPFCAUX = 3mA V PFCAUXUC 3.5 4.0 4.5 V PFC ZCD Trip Level V PFCAUXH 0.15 0.20 0.25 V Delay from PFCAUX o Oupu * T DPFCZCD 200 ns PFC ZCD Time Ou Afer PFCDRIVER Turnoff T TOPFC 40 50 60 s 8
PARAMETER CONDITIONS SYM MIN TYP MAX UNITS Flyback Comp Pin (FBCOMP Pin) Shor Circui Curren V COMP=0V I FBCOMPSC 0.100 0.125 0.150 ma Flyback Burs Mode Trip Level for FBDRIVER Sar V BSTONQR 0.7 0.8 0.9 V Trip Level for FBDRIVER Sop V BSTOFFQR 0.5 0.6 0.7 V Heavy Load Trigger Level V IFBCSEN 2.8 2.9 3.0 V Open Loop Volage FBCOMP pin open V FBC 5.2 5.4 5.6 V Over Load Proecion (FBCOMP Pin) OLP Trigger Level (VOLP) V OLP 4.1 4.2 4.3 V Oupu Shor Circui Proecion OSCP Trigger Level * VFBCOMP > VOLP V CCOSCP UVLO (off) 2 V Flyback OVP (FBAUX pin) OVP Trigger Curren I FBAUXOVP 270 300 330 A Upper Clamp Volage IFBAUX = 0.3mA V FBAUXH 1.90 2.00 2.10 V Debounce Cycle * T DFBAUXOVP 4 FB PWM cycle FBAUX OVP Deecion Blanking Time * Afer FBDRIVER Turnoff T DFBOVPDET 2 s Zero Curren Deecion (FBAUX Pin) Lower Clamp Volage IFBAUX = 1mA V FBAUXLC 0.3 0 V Flyback ZCD Trip Level V QRDLQR 50 mv Flyback ZCD Delay Time * T DFBZCD 200 ns Flyback ZCD Time Ou1 Afer Max. Frequency T O1QR 4 5 6 s Minimum Flyback ZCD Time Ou2 Afer FBDRIVER Turnoff T O2QR 115 150 185 s ZCD Blanking Time Afer FBDRIVER Turnoff T OFFMINQR 1.6 2.0 2.4 s Oscillaor for Swiching Frequency Flyback Max. Frequency F MAXQR 78 85 92 khz Flyback Max. Frequency Mode Threshold, V FBCOMP * V FBCFMAX 2.2 V Flyback Green Mode Frequency F GREENQR 27 30 33 khz Flyback Green Mode Threshold, V FBCOMP * V FBCGREEN 1.0 V Flyback Maximum On Time T ONMAXQR 40 45 50 s 9
PARAMETER CONDITIONS SYM MIN TYP MAX UNITS Flyback Curren Sensing (FBSENSE Pin) Threshold for Cycle by Cycle Curren Limi, Vcs(off) (20 C ~125 C) V OCQR 0.62 0.65 0.68 V Leading Edge Blanking Time T LEBQR 250 350 450 ns OCP Compensaion Curren VHV PEAK = 250Vdc FBCOMP = 3V I FBCSHV 180 200 220 A Delay o Oupu * T DCS 80 ns PFC and Flyback Gae Drive Oupu (PFCDRIVER & FBDRIVER Pin) Oupu Low Level =15V, I SINK=100mA V OUTH1 0 1.5 V Oupu High Level =15V, I SOURCE =100mA V OUTL 9.0 V Oupu High Level =9V, I SOURCE =2mA V OUTH2 8.5 V Oupu High Clamp Level =17V V OUTCL 13 V Rising Time * =15V, CL=2700pF T OUTR 130 ns Falling Time * =15V, CL=2700pF T OUTF 45 ns Noes: Guaraneed by design. 10
Typical Performance Characerisics 11
Typical Performance Characerisics 12
Typical Performance Characerisics 13
Applicaion Informaion Operaion Overview As long as he green power requiremen becomes a rend and he power saving is geing more and more imporan for he swiching power supplies and swiching adapors, he radiional PWM conrollers are no able o suppor such new requiremens. Furhermore, he cos and size limiaion force he PWM conrollers need o be powerful o inegrae more funcions o reduce he exernal par couns. The is ideal for hese applicaions o provide an easy and cos effecive soluion; is deailed feaures are described as below. Inernal HighVolage Sarup Circui and Under Volage Lockou (UVLO) The radiional circui provides he sarup curren hrough a sarup resisor o power up he PWM conroller. However, i consumes oo much power o mee he curren power saving requiremen. In mos cases, sarup resisors carry larger resisance and ake more ime o sar up. As shown in Fig 15, THE is implemened wih a highvolage sarup circui o minimize power loss on sarup circui. During he sarup phase, a highvolage curren source sinks curren from AC Line or Neural o provide he sarup curren and charge he capacior C1 a he same ime. Refer o Fig 16. If is below PDR, he charge curren is only 1.5mA and he lower charge curren can proec IC if he Pin is shored o GND. Once volage rises up o reach he UVLO(on) hreshold, HV pin will no longer charge he capacior and insead, send a gae drive signal o draw supply curren for from he auxiliary winding of he ransformer. Tha minimizes he power loss on he sarup circui successfully. An UVLO comparaor is embedded o deec he volage across pin o ensure he supply volage is high enough o power on he and in addiion o drive he power MOSFET. As shown in Fig 16, a hyseresis is provided o preven THE from shudown by he volage dip during sarup. The urnon and urnoff hreshold level are se a 18V and 8V respecively. For beer EMI performance, i s recommend o connec HV pin o he inpu erminals of bridge diode, as Fig 15. AC inpu UVLO(on) UVLO(off) PDR HV curren source PWM IC Vcc GND HV Curren 1.5mA Holding Curren (~150uA) 3mA Vcc curren FBSENSE Fig 15. ~ ~ Operaion &Swiching ~ 0mA (off) Rs C1 D1 Operaing Curren (Supply from Auxiliary Winding) Fig 16. 14
Oupu Driver Sage The device builds a CMOS buffer respecively in he sages of PFC and Flyback, wih ypical 500mA/1200mA driving capabiliy, o drive he power MOSFET direcly. The oupu volage is clamped a 13V o proec he MOSFET gae even when he volage is over 13V. Brown In/ Ou Proecion The feaures Brownin / Brownou proecion on HV pin. As he builin comparaor deecs line volage, i will urn off he conroller o preven from any damage. In case VHV < Brownou Level, he oupu driver will be disabled even when already reaches UVLO (on). I herefore forces hiccup beween ULVO (on) and UVLO (off). Unless he line volage is large enough and over Brownin Level, he oupu driver will no sar swiching even if he nex ULVO (on) is ripped. A hyseresis is designed o preven from falseriggering and damage o he exernal componens during urnon and urnoff phase. See Fig 17 for he operaion. Line Volage High Line and Low Line Deecion The HV pin can deeced AC inpu level o conrol source curren of VOSENSE Pin and OCP compensaion logic. During AC inpu variaions, he source curren of VOSENSE and OCP compensaion logic show as below. VHV PEAK High Line Trip Level Low Line Trip Level Source Curren of VOSENSE OCP Comp. Logic > 220V 0A Enable < 184V 8µA Disable Line Volage VHV(peak) Low Line area High Line area Low Line area I VOSENSE 8µA 0A OCP Compensaion VHV(peak) BNO/on Disable Enable Disable BNO/off Fig 18. Vcc XCap Discharge Funcion UVLO(on) UVLO(off) The EMI filer has a paralleled discharging resisor across Xcapacior. To mee safey requiremen, his componen FBDRIVER is required o be discharged in less han 1sec, ha is, Discharge CX Cap RDischarg e 1sec NonSwiching Fig 17. Swiching Non Swiching The power loss of his resisor is in direc proporion o square of inpu volage. For example, if he inpu volage is 264Vac and he discharging resisance ~ 2M, 35mW, we can conclude he power loss by follow equaion. 15
2 VAC (RMS) PLoss RDischarge To eliminae he significan power loss from his discharging resisor, applies he innovaive paen echnology o discharge Xcap s energy hrough HV curren source when AC line is disconneced. Fig 19 shows he operaion. By applying his echnology, he sysem can easily pass he safey es wihou discharging resisor and reduce power loss. If i s unplugged, he AC volage across Xcap will sill remain he same. The deecs HV pin o monior he AC volage across Xcap. If AC volage across Xcap rises or falls beyond he limi of he hreshold, he HV scheme will sink consan curren o GND o discharge i in around 75ms of debounce ime under any load condiion. decreased, FBCOMP volage becomes lower and he swich frequency can be reduced under he ligh load condiion. This feaure helps o enhance he efficiency in ligh load condiions. The curve shows as Fig 20. To mee he requiremen of European 'EMCdirecive', i s necessary o adop a soluion wih PFC conrol. In order o enhance efficiency a ligh load, he feaures PFC conrol and is able o shu down swiching o reduce power consumpion. As FBCOPM volage falls below PFC ON/OFF volage hreshold, he PFC conroller will sop PFCDRIVER swiching unil FBCOMP volage resume o is level. See Fig 21 for he block. 85kHz 30kHz AC inpu ~ ~ Cbulk FBCOMP 0.6V 1V 2.2V Fig 20. Max. Frequency Limi of Flyback V BIAS C1 D1 FBCOMP V BIAS 2.9V AC deeced CKT Gae CS PFC ON/OFF 25.75/25µA V BIAS PFC ON/OFF Debounce PFC ON Clock for PFC OFF debounce PWM IC Rs GND Fig 19. Flyback Green Mode and PFC Turnoff Conrol THE uses maximum frequency limi scheme o conrol flyback swiching frequency, and i depends on he level of FBCOMP volage. When oupu loading is CT V CT Fig 21. PFC Oupu Volage Seing moniors he oupu volage signal from VOSENSE pin hrough a resisor divider pair of RA and 16
RB. A ransconducance amplifier is used for i o replace he convenional volage amplifier. The oupu curren of he amplifier changes according o he volage difference of he invering and noninvering inpu of he amplifier. The oupu volage of he amplifier is compared wih he inernal ramp signal o generae he urnoff signal. A curren is flowed ou of he VOSENSE Pin (8µA) during low line condiion. The PFC oupu volage is deermined by he following relaionship. PFC Over Volage Proecion To preven unsable volage occurred o he PFC oupu capacior under faul condiion, he is implemened wih OverVolage Proecion on VOSENSE pin. If VOSENSE volage rises over he OVP hreshold of 2.63V, he oupu driver circui will be shu down simulaneously o sop he swiching of he power MOSFET unil VOSENSE volage drops o 2.5V. Fig 23 shows is operaion. High Line: PFC V O = 2.5V (1 RA RB//R VOSENSE ) (1) 2.63V 2.50V VOSENSE OVP Tripped Low Line: PFC V O RA ( RB//R = (2.5V 8μA RB//R VOSENSE VOSENSE ) 2.5V (2) Where RA and RB are values for op and boom feedback resisor (as shown in he Fig 22). Once he value of PFC V O is deermined, hen subsiue he value of RA/RB obained from he formula (1) o (2) o ge he RB value. ) PFCDRIVER Swiching Non Swiching Fig 23. OVP Clear Swiching Non Swiching AC Line Inpu PFC Zero Curren Deecion PFC Vo Fig 24 shows PFC Zero Curren Deecion (ZCD) block. As he auxiliary winding coupled wih he inducor deecs HV PFC OVP PFC OVP Comparaor 2.63/2.5V RA he curren over he boos inducor drops o zero, he ZCD block will swich on he exernal MOSFET. This feaure allows ransiionmode operaion. If he volage of he Line Volage Deecion PWM Comparaor High Line GM V BIAS 8µA 2.5V R VOSENSE VOSENSE PFCCOMP RB PFCAUX pin rises above 0.2V, he ZCD comparaor will urn on he MOSFET. The PFCAUX pin is proeced inernally by 4Vhigh clamp and 0Vlow clamp. The 50µs imer will generae a MOSFET urnon signal if he oupu driver has been a low level for over 50µs. Ramp Generaor Fig 22. 17
PFCDRIVER RZ VAUX RAMP COMP PFCAUX Resar Timer ID I PEAK Inducor Curren zero 0A T on T dis 4V 0.1/0.2V S R Q PFCDRIVER PFCSENSE RCS n aux/n p V IN AUX Volage I NEG 0V Fig 24. Delay Time 4V n aux/n p (V OUT V IN) Fig 25 shows ypical ZCDrelaed waveforms. Rz will produce some delay because of he parasiic capaciance on PFCAUX pin. Before he swich urns on wih he delay, PFCAUX Volage V OUT 0.2V he sored charge of he C OSS (MOSFET oupu capacior) will be discharged o a small filer capacior C IN1 wih a bridge diode hrough he pah indicaed in Fig 26. So he V DS Minimum Volage Turnon 0V inpu curren I IN1 drains o zero a he ime. Here, i s recommended o se source curren of PFCAUX pin around 1mA. Rz could be obained from he below formula and is also adjusable o conrol he urnon iming of he swich. MAX NAUX,PFC RZ PFC Vo 1mA NP,PFC AC I IN C IN1 Fig 25. L D V OUT I L Q C OSS C o Fig 26. PFC Curren Sensing The deecs he PFC MOSFET curren across PFCSENSE pin o proec he MOSFET, which is for he cyclebycycle curren limi. The maximum volage hreshold of PFCSENSE pin is se a 0.52V. The MOSFET peak curren can be obained as below. 0.52V IPEAK(MAX) RPFCS A 250ns leadingedge blanking (LEB) ime is buil in PFCSENSE pin o preven he falserigger from he curren spike. The RC filer is eliminable in some low power applicaions, such as he pulse widh of he urnon 18
spike below 250ns and he negaive spike on PFCSENSE pin is below 0.3V. However, he pulse widh of he urnon spike is deermined according o he oupu power, circui design and PCB layou. I is srongly recommended o adop a smaller RC filer for high power applicaion o avoid PFCSENSE pin being damaged by he negaive urnon spike. PFCDRIVER PFCSENSE GND R PFCS RC filer is required when he negaive spike exceeds 0.3V or he oal spike widh is over 250nS LEB period. Fig 27. Flyback Volage Feedback Loop The volage feedback signal is provided from he TL431 on he secondary side hrough he phoocoupler o FBCOMP pin of he and fed o he volage divider wih 1/5.5 raio. Tha is, V V FBCOMP FBSENSE(PWM ) COMPARATOR 5.5 A pullhigh resisor is embedded inernally o opimize he exernal circui. Flyback Curren Sensing & OCP Compensaion Design Tip The feaures curren mode of flyback conrol. I receives boh curren signal and volage signal o form he conrol loop and achieve regulaion. deecs he primary MOSFET curren across FBSENSE pin for peak curren mode and also limis he curren cyclebycycle. The maximum volage hreshold of FBSENSE pin is se a 0.65V. Thus he MOSFET peak curren can be calculaed as: I PEAK(MAX) 0.65V R FBS In general, he power converer provides various curren signals o reflec he inpu volage wih propagaion delay ime. To compensae i, an offse volage is added o he FBSENSE signal by an inernal curren source (200µA) and an exernal resisor (R OCP) beween he sense resisor (R FBS) and FBSENSE pin, as shown in Fig 28. The compensaion curren is only enabled when FBCOMP volage is above 2.9V a high line condiion. ROCP: 220~1k ; COPC: 47p~470pF. As PFC behaves in curren sensing, a 350nS leadingedge blanking (LEB) ime is incorporaed in he inpu of FBSENSE pin o preven falseriggering from he curren spike. FBCOMP > 2.9V High AC Inpu VBIAS 200µA FBDRIVER FBSENSE R OCP Flyback Burs Mode Conrol Curren Limi Comparaor 0.65V C OCP R FBS The oupu driver of he can be disabled immediaely by pulling FBCOMP pin volage level below FBDRIVER Sop Trip Level. The disablemode can be released when FBCOMP pin volage level is pulled high above FBDRIVER sar rip level. Proecion Mode Fig 28. There are wo kinds of proecion modes available in he. 19
AuoRecovery Proecion Mode As AuoRecovery proecion circui laches he operaion, he gae oupu will swich for a shor erm as every ime rises back o UVLO(ON). I herefore forces he hiccup beween UVLO(ON) and UVLO(OFF). As soon as he faul condiion is removed, he sysem will resume i operaion righ away. Fig 29 shows he operaion. UVLO(on) UVLO(off) AC Inpu UVLO(on) UVLO(off) PDR Lach Mode Proecion Signal è Remove he Abnormal Condiion AuoRecovery Proecion Signal è Remove he Abnormal Condiion Gae Driver Swiching Swiching Gae Driver Swiching Swiching Swiching Fig 29. Lach Proecion Mode As Lach ype proecion circui laches he operaion, he gae oupu will remain in off sae even when he reaches UVLO(ON). The sysem is unable o recover unless i is repowered o le drop below Power Down Rese (PDR) and hen ramps over UVLO(on). Fig 30 shows he operaion. Fig 30. Over Load Proecion (OLP) Auo Recovery To proec he circui from being damaged a overload condiion, shor or open loop condiion, he is implemened wih smar OLP funcion. The feaures auo recovery funcion. See Fig 31 for he waveform. In such faul condiion, he feedback sysem will force he volage loop o ener sauraion and hen pull high he volage over FBCOMP pin (VFBCOMP). When VFBCOMP ramps up o he OLP ripped level (4.2V) for longer han he OLP delay ime, he proecion will be acivaed o urn off he oupu driver and o sop he swiching of power circui. The OLP delay ime is se by CT pin. I is o preven he false riggering during he ransien condiion of poweron and urnoff. A divide4 couner is implemened o reduce he average power under OLP behavior. Whenever OLP is acivaed, he oupu is lached off and he divide4 couner sars o coun he number of UVLO(off). The proecion mode will 20
no be released and he oupu will no be resumed unil he 4h UVLO(off) level is ripped. Wih he proecion mechanism, he average inpu power will be reduced, so ha he componen emperaure and sress can be conrolled wihin he safe operaing area. UVLO(on) UVLO(off) COMP OLP 4nd UVLO(off) Proecion Rese oupu driver righ away and disable he power MOSFET unil he UVLO(on) is ripped. The OVP funcion is auorecoverable. If he OVP condiion, usually caused by openloop of feedback, is no released, he will rip he OVP level again and reshudown he oupu driver. This makes work in hiccup mode. Fig 32 shows is operaion. Afer he OVP condiion is removed, will keep in is normal operaion level and he oupu driver also reurn o he normal operaion. OLP Delay Time OVP Level OVP Tripped VOLP OUT OLP rip Level UVLO(on) UVLO(off) FBDRIVER / PFCDRIVER OUT Clamping Swiching NonSwiching Swiching NonSwiching Swiching Fig 31. Swiching Fig 32. Oupu Shor Circui Proecion (OSCP) If he oupu of he sysem is shorcircuied, Vo and will drop immediaely. Due o he operaing of he volage loop, FBCOMP volage will be pulled high a he same ime. If he siuaion coninues o pull FBCOMP high over 4.2V for over 16ms and drops below 10V, i will acivae OSCP proecion agains damage and urn off he gae driver. OVP on Auo Recovery The maximum raing of he is abou 32.5V. To proec he in overvolage condiion, i is implemened wih OVP funcion on. Once volage rises over he OVP hreshold, i will urn off he Flyback Zero Curren Deecion Fig 33 shows flyback Zero Curren Deecion (ZCD) block. As PFC behaves in ZCD, as soon as he auxiliary winding coupled wih he inducor deecs he curren over he flyback ransformer drops o zero, he ZCD block will swich on he exernal MOSFET. This feaure enables QuasiResonan operaion. The FBAUX uses falling edge o rigger ZCD o urn on FBDRIVER and he rigger level is 0.05V as shown in Fig 34. FBAUX pin is builin wih 2Vhigh clamp and 0Vlow clamp. 21
R ZCD V AUX FBAUX FBDRIVER ZCD Signal 0.05/0.15 2V Time Ou Managemen Freq. Limi & Timing Conrol Managemen Fig 33. Turnon delay FBDRIVER Turnon ransformed ino a curren signal. The sinking curren of FBAUX is, N I AUX FBAUX = [(VO VD ) NS 2V] / RZCD The samples he signal afer FBDRIVER urnoff wih 2µs delay o perform oupu over volage proecion. This 2µs delay ime is used o ignore he volage ringing from leakage inducance of PWM ransformer. The sampled curren level is compared wih inernal hreshold curren 300µA. If he sampled curren exceeds he OVP rip level, an inernal couner will sar o coun he subsequen OVP evens. The couner has been added o preven incorrec OVP deecion which migh occur during ESD or lighning evens. If 4 flyback PWM cycles of he subsequen OVP evens are deeced, he OVP circui will swich he power MOSFET off. Vo VD NS: NAUX RZCD VAUX FBAUX 2V 300µA FBOVP Debounce 0.05V AUX Winding Sampling LEB Conrol Fig 35. FBDRIVER Max Frequency Limi Fig 34. OVP on FBAUX Auo Recovery FBAUX also provide over volage proecion(ovp). An oupu overvolage proecion is implemened in he, as shown in Fig 35 and Fig 36. I senses he auxiliary winding volage by he resisor, R ZCD. The auxiliary winding volage is refleced on he secondary winding and herefore he fla volage on FBAUX pin is in proporion o he oupu volage. The fla volage can be AUX Winding 2µs Sampling Signal Fig 36. N (Vo VD ) N AUX S 22
OnChip OTP Auo Recovery An inernal OTP circui is embedded in he o provide he worscase proecion. When he chip VLATCH 1.35V 1.25V OTP Exernal Lach Release emperaure rises over he rip OTP level, he oupu driver will be disabled unil he chip is cooled down below he hyseresis emperaure. UVLO(on) UVLO(off) PDR Exernal Lach The Exernal Lach funcion is implemened o sense wheher here is any hospo of power circui like power MOSFET or oupu recifier. Once an overemperaure condiion is deeced, he OTP will be acivaed o shu down he. Typically, an NTC is recommended o connec o LATCH pin. The NTC resisance will decrease as he device or ambien says in high emperaure. The relaionship is shown below. VLATCH 80μA R NTC When V LATCH < Turnoff Trip (yp. 1.25V), i will rigger he proecion o shu down he oupu driver and lach off he power supply. The will remain lached unless he drops below PDR (power down rese) and rise over UVLO(on). I requires wo condiions o resar he successfully. Cool down he circui so ha he NTC resisance will increase and raise V LATCH above 1.35V. Then replug in AC power. The deailed operaion is show in Fig 37. AC inpu Volage FBDRIVER, PFCDRIVER Swiching AC Off Lach Mode Released NonSwiching Fig 37. Adjusable Timer on CT Pin AC On (Recycle) Swiching Connec CT pin wih an exernal capaciance o generae clock for imer. The OLP debounce, PFC Turnoff debounce and flyback Sofsar period are se according he below able. C CT FB Sofsar period OLP Debounce Time PFC Turnoff Debounce 22nF 4.6ms 30ms 0.47s 47nF 10.0ms 64ms 1.00s 68nF 14.0ms 93ms 1.45s 100nF 21.2ms 136ms 2.13s 23
PullLow Resisor on he Gae Pin of MOSFET The consiss of an anifloaing resisor a PFCDRIVER and FBDRIVER pin o preven he oupu driver in any abnormal condiion which may false rigger MOSFET. Even so, we sill recommend adding an exernal one a he MOSFET gae erminal o provide more proecion in case of disconnecion of gae resisor R G during poweron. In such singlefaul condiion, as shown in Fig 38, he resisor R8 can provide a discharge pah o avoid he MOSFET from being falseriggered by he curren hrough he gaeodrain capacior C GD. Therefore, he gae of MOSFET should be always pulled low and kep in he offsae as he gae resisor is disconneced or opened in any case. V IN Leadrend s proprieary of HiV echnology will eliminae parasiic SCR in THE. Fig 40 shows he equivalen HiV srucure circui of THE. THE is more capable o susain negaive volage han similar producs. However, a 10K resisor is recommended o be added in he HiV pah o play as a curren limi resisor whenever a negaive volage is applied. Negaiveriggered Parasiic SCR. Small negaive spike on HV pin will cause he lachup beween Vcc and GND. 0V HV Fig 39. GND Oher HV process wih parasiic SCR PFCDRIVER FBDRIVER dvin i = Cgd d C GD 0V Curren limi resisor for Prevening damage from Negaive volage (recommended) Rg HV R8 GND CS Parasiic effec beween HV, Vcc and GND GND This resisor would proec he MOSFET from being false riggered by he curren hrough C GD, if R G is disconneced. Fig 38. Proecion Resisor on he HV Pah In some oher HiV process and design, here may be a parasiic SCR formed beween HV pin, and GND. As shown in Fig 39, a small negaive spike on he HV pin may rigger his parasiic SCR and cause lachup beween and GND. I may damage he chip because of he equivalen shorcircui induced by such lachup behavior. Fig 40. PCB Layou Guideline The consiss of a pair of gae drivers. Here are some guide lines o layou he PCB o suppress he noise caused from he effecs beween PFC and flyback. The PCB layou diagram is shown as Fig 41. 1. Separae small signal curren loop from gae driver or curren loop. 2. Separae curren loop from PFC gae driver o minimize he effec from flyback ZCD. 24
3. Minimize he race lengh beween GND pin and he curren sense resisor. 4. Be aware o roue he HV pin AWAY from he oher races for i possesses high volage. Flyback RCS PFC RCS High Curren Loop (Gae Driver, ) Low Curren Loop (Small Signal) 1 2 3 4 5 6 7 8 Fig 41. GND FBCOMP FBAUX LATCH PFCCOMP VINSENSE PFCAUX Inrush Curren of PFC HV HVS CT FBDRIVER PFCDRIVER PFCSENSE FBSENSE VOSENSE High Volage Trace During fas AC powers on/off, inrush curren will flow hrough PFC choke if bulk capacior volage is lower han AC line volage. Once PFC conroller remains operaion in such condiion, large curren will flow in PFC MOSFET during gae urnon phase, shown as 錯誤! 找不到參照來 源. So, i's necessary o selec a MOSFET of proper curren sress o avoid damage. 16 15 14 13 12 11 10 9 Under his condiion, during MOSFET gae urnon and urnoff period, some MOSFET will couple wih he high frequency energy, generaed from parasiic elemen as inrush curren resonaes ino he conroller. See Fig 43 for i. The gae driver of conroller could be damaged by he exernal energy. Add a bead core in he gae driver curren loop o blank he high frequency energy from damage, shown as Fig 44. And place an exra bypass diode here o limi inrush curren of PFC choke helps o minimize he risk, shown as Fig 45. I PFCDRIVER Fig 43. Fig 44. IL ID VIN _ VDS _ PFC VO _ VGS _ I L Cycle by cycle curren limi Fig 45. Zoom in I L I D Cycle by cycle curren limi V GS Minimum onime Fig 42. 25
Package Informaion SOP16 Symbols Dimensions in Millimeers Dimensions in Inch MIN MAX MIN MAX A 9.800 10.010 0.386 0.394 B 3.800 4.000 0.150 0.157 C 1.346 1.753 0.053 0.069 D 0.330 0.510 0.013 0.020 F 1.27 TYP. 0.05 TYP. H 0.178 0.254 0.007 0.010 I 0.100 0.254 0.004 0.010 J 5.790 6.200 0.228 0.244 M 0.380 1.270 0.015 0.050 θ 0 8 0 8 Imporan Noice Leadrend Technology Corp. reserves he righ o make changes or correcions o is producs a any ime wihou noice. Cusomers should verify he daashees are curren and complee before placing order. 26
Revision Hisory REV. Dae Change Noice 00 9/11/2013 Original Specificaion. 01 1/27/2014 Typical Applicaion add PFC wih inrush curren bypass diode Fixed UNITs, 1. From NF o nf 2. From Ns o ns 3. Flyback Burs Mode, Trip Level for FBDRIVER Sop: from mv o V Add Recommended Operaing Condiion: 1. VOSENSE Capacior Value 2. PFCAUX Pin Resisor 3. PFCAUX Sink and Source Curren Add iems for Applicaion Informaion 1. Add VOSENSE Pull Down Resisor Informaion 2. Add Inrsush Curren of PFC 02 7/30/2014 Correc rule of dae code. 03 4/16/2015 Spec JC is added. The max power dissipaion and juncion emperaure are changed. 04 4/30/2015 Spec iems are changed: 1. The ypical value of FBSS is changed. 2. Parameers DOVP, DPFCOVP, DPFCEN and DFBAUXOVP, DCS are guaraneed by design. 3. The CCT Pin imer able is modified. 4. Pin configuraion figure is correced. 05 Parameers I HVXCAP, V BNHYS, T DOLPST and T FBSS are guaraneed by design. 27