Global 450mm Consortium at CNSE Michael Liehr, General Manager G450C, Vice President for Research - CNSE Overview - G450C Vision - G450C Mission - Org Structure - Scope - Timeline
The Road Ahead for Nano-Fabrication Technology More than Moore: Diversification Wireless Integrated Passives Anal./Digit. Conversion HV Power Sensors Actuators Biochips fluidics Optoelec. Integration More Moore: Miniaturization Baseline CMOS: CPU, Memory, Logic 130nm 90nm 65nm 45nm 32nm 22nm Information Processing Digital content System-on-chip (SoC) Interacting with people and environment Non-digital content System-in-package (SiP) Combining SoC and SiP: Higher Value Systems Leading-Edge Designs drive High Cost and High Volume Hugh Demand in Smart Devices drives Utilization of Older Nodes Fewer will sit in the Front of the Scaling Bus Sources: International Business Strategies; GLOBALFOUNDRIES Heterogeneous Integration using 3D Technology Source: 2005 ITRS, Sematech, ITPC 2011
Industry consolidation will continue as all 450mm participants exploit leading-edge technologies, therefore wafer size and scaling challenges will be hard to discern Bigger, yet smaller and more precise Fewer public and private playgrounds for: Developing new materials, processes and equipment Developing technology integration Optimizing manufacturing including resource conservation Cost and financial pressures create need for further pre-competitive collaboration With permission: D.Armbrust, Sematech, R.Bruck, Intel, ITPC 2011 3
Full complement of state-of-the-art 300mm tools. Used for 1xnm node development. Compatible with previous generations. Capacity of ~30 integrated wafer starts per day. 24/7 operation. Staffed with professional engineering and faculty. G450C College of Nanoscale Science and Engineering
Announcement on September 27, 2011 $4.8 billion investment, most of it private $400 million coming from NYS R&D in Albany, Canandaigua, Utica, East Fishkill and Yorktown Heights. Intel intends to establish its East Coast headquarters in Albany to manage 450mm development. 2,500 new high-tech jobs, including: 800 at the CNSE 400 in Utica 1,500 construction jobs in Albany
Goal: Establish New York State / CNSE as the leader for 450 mm Development Define the key elements of the Global 450mm Consortium (G450C) 1.Near term (5-years) Establish a program to develop Test Wafer fabrication infrastructure, equipment prototypes & high-volume tools to enable industry transition to 450mm. 2.Long term Equipment set capable of advanced semiconductor process module development installed and operational at CNSE. Establish, staff, and support a follow on process technology development program.
G450C Vision A public-private partnership program to develop a cost-effective test wafer fabrication infrastructure, equipment prototypes & high-volume tools to enable a coordinated industry transition to 450mm wafers, located primarily at CNSE. Use of the capability established at CNSE for joint development activities and support of a comprehensive industry ecosystem. A partnership of New York State (CNSE), Intel, TSMC, Samsung, IBM and Globalfoundries
G450C Program Management GM and Coordinator CNSE Industry / Strategy GM Intel Internal / OPS GM TSMC 450mm Integration Manager Program Coordination Manager Engineering Manger Photo/Etch Engineering Manger CMP/thermal/cleans Engineering Manger CVD/PVD/Implant 450mm Fab OPS Managers (2) TBD TBD TBD TBD TBD TBD Industry consortium coordinated by not-for-profit entity Leveraging New York State funding, matched by all industry participants Could be the template for interactions with equipment suppliers / SEMI
G450C Mission G450C as an umbrella initiative Assure smooth and coordinated 300mm to 450mm wafer transition Significant benefit to the industry and the State of New York. New York state-of-the-art cleanroom and associated infrastructure. Collective investments of G450C members, State of New York, Original equipment manufacturers, Tool, material, and chemical suppliers, and Facilities and infrastructure contractors. Assemble a critical mass of intellectual and physical assets.
G450C Overview New York/CNSE based consortium. Headquarter and core operations in NY. CNSE, Intel, Samsung, TSMC, GlobalFoundries, and IBM. Consortium to collaboratively work with suppliers Develop and test 450 mm equipment Wafers, equipment, people, and fab space will be put in place. Consortium will have a complete fab tool set at CNSE. Consortium will work with suppliers and other associations / consortia to develop standards and support the development of common equipment building blocks.
G450C Objectives Enable supplier development. Support tool demonstrations. Establish wafer support operations. Enable innovation and do not slow scaling. Demonstrate a full 450 mm fab tool set. Enable OEMs and tool makers to transition to 450mm in a highly coordinated fashion under a financially (New York) leveraged business strategy.
NFX New CNSE Cleanroom >25,000 ft 2 in NFX and NFN NFX RFE in 4Q12 12
Expand Test Wafer operations to accelerate and support Supplier development and to support tool demonstrations Demonstrate a full 450 mm tool set with ~ 2 Suppliers for each of ~ 50 tool types (~100 demos) by 2014 / 2015 Current status: RFQ sent, responses due in April Projected Timeline 2012 2013 2014 2015 Launch G450C Imprint Litho capability 193i EUV TBD (Phase 1) Expand Test Wafer Operations Demonstrate Full 450 mm Tool Set Late Tools? Objectives Beyond TW/Demo: Define Further Program Scope (Phase 2) Full flow 450 mm Tool Set and Process @ CNSE
Development and Technology Intercept Targets for 450 mm Early 450 mm Development Consortium Programs Early Development of Silicon and factory integration / automation standards, interoperability test beds for component and standards verification; early tool development 450 mm Test Wafer Generation supports tool development and demonstrations Test Wafer Generation Equipment Demonstrations Tool Demonstrations moved from 2010-12 to 2013-14 Tools for Consortium Demonstrations unit process capable (no full-flow) Technology Synchronization Points (ITRS DRAM stagger-contacted Metal 1 half-pitch) ISMI 32/22 nm Equipment Performance Metrics 450 mm and 300 mm tools progress synchronously through technology generations Process and metrology modules evolve on systems extending several generations 14 nm Nominal 1X nm Range for G450C Demonstrations 10 nm and beyond Target for IC Maker Pilot Line Tools Full (flow) set of production process and metrology tools + automation systems capable of meeting technology targets 2008 2009 2010 2011 2012 2013 2014 2015 Detailed technology goals will be defined by individual company business requirements
450-mm Lithography Tool Alignment G450C Aligned Schedule 1. Prototype tool*, 193i (G450C) 2013 2. Beta tool, 193 i/dry 2014 3. Beta tool, EUV 2015 4. Early production 193i/dry 2015 5. Early production EUV 2016 6. Production 193i/dry 2016 7. Production EUV 2017 G450C * prototype tool: 14 nm patterning capability, (relax WPH and overlay ) 450mm tool development will strategically align with 300mm EUV schedule to ensure both programs success.
G450C Summary Unique Industry Consortia Academia - Government partnership Successful model applied to 450mm program Associate memberships for suppliers possible