Power MOSFET for 1-Cell Lithium-ion Battery Protection 12 V, 5.8 mω, 17 A, Dual N-Channel This Power MOSFET features a low on-state resistance. This device is suitable for applications such as power switches of portable machines. Best suited for 1-cell lithium-ion battery applications. Features 2.5 V Drive 2 kv ESD HBM Common-Drain Type ESD Diode-Protected Gate Pb-Free, Halogen Free and RoHS compliance Applications 1-Cell Lithium-ion Battery Charging and Discharging Switch SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS at Ta = 25 C (Note 1) Parameter Symbol Value Unit Source to Source Voltage VSSS 12 V Gate to Source Voltage VGSS 8 V Source Current (DC) IS 17 A Source Current (Pulse) PW 1 s, duty cycle 1% ISP 8 A Total Dissipation (Note 2) PT 1.8 W Junction Temperature Tj 15 C Storage Temperature Tstg 55 to +15 C Note 1 : Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. THERMAL RESISTANCE RATINGS Parameter Symbol Value Unit Junction to Ambient (Note 2) R JA 9.4 C/W Note 2 : Surface mounted on ceramic substrate (5 mm 2.8 mm). 5 2 VSSS RSS(on) Max IS Max 12 V ELECTRICAL CONNECTION N-Channel 4, WLCSP 2.x1.49x 5.8 mω @ 4.5 V.2 mω @.8 V 7.5 mω @.1 V 9. mω @ 2.5 V 1, MARKING DIAGRAM NT AYWZZ 17 A 1 : Source1 2 : Gate1 : Source1 4 : Source2 5 : Gate2 : Source2 PIN ASSIGNMENT 1 2 S1 G1 S1 S2 G2 S2 5 4 Bottom View NT = Specific Device Code A = Assembly Location Y = Year W = Work Week ZZ = Assembly Lot = Pb-Free Package ORDERING INFORMATION See detailed ordering and shipping information on page of this data sheet. Semiconductor Components Industries, LLC, 217 1 Publication Order Number : August 217 - Rev. EFC2J1NUZ/D
ELECTRICAL CHARACTERISTICS at Ta 25 C (Note ) Parameter Symbol Conditions Value min typ max Unit Source to Source Breakdown Voltage V(BR)SSS IS = 1 ma, VGS = V 12 V Zero-Gate Voltage Source Current ISSS VSS = 1 V, VGS = V 1 A Gate to Source Leakage Current IGSS VGS = 8 V, VSS = V 1 A Gate Threshold Voltage VGS(th) VSS = V, IS = 1 ma.4 1. V IS = 5 A, VGS = 4.5 V. 4.5 5.8 mω Static Source to Source On-State IS = 5 A, VGS =.8 V.2 4..2 mω RSS(on) Resistance IS = 5 A, VGS =.1 V.4 5. 7.5 mω IS = 5 A, VGS = 2.5 V.8 5. 9. mω Turn-ON Delay Time td(on) 11 s Rise Time VSS = 5 V, VGS =.8 V tr 2 s IS = 5 A, Rg = 1 kω Turn-OFF Delay Time td(off) 1 s Switching Test Circuit Fall Time tf 7 s Total Gate Charge Qg VSS = 5 V, VGS = 4.5 V, IS = 5 A 7 nc Forward Source to Source Voltage VF(S-S) IS = A, VGS = V.7 1.2 V Note : Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. Switching Test Circuit td(on), tr,td(off), tf S2 RL When FET1 is measured, Gate and Source of FET2 are short-circuited. Rg G2 G1 V S1 V SS 2
TYPICAL CHARACTERISTICS Source Current, IS A. 5. 4.. 2. Ta = 25 C 4.5 V.8 V.1 V VGS = 2.5 V Source Current, IS A 12 9 V SS = V Ta = 75 C 25 C --25 C.5.1.15.2.25..5..8 1.2 1.4 Source to Source Voltage, V SS V Gate to Source Voltage, V GS V Figure 1. On-Region Characteristics Figure 2. Transfer Characteristics Static Source to Source On State Resistance, RSS(on) mω 8. 7.5 7..5. 5.5 5. 4.5 4..5 Gate to Source Voltage, VGS V I S = 5 A Ta = 75 C 25 C --25 C. 1 2 4 5 7 Figure. On-Resistance vs. Gate-to-Source Voltage Static Source to Source On State Resistance, RSS(on) mω 1 9 8 7 5 4 I S = 5 A, V GS = 2.5 V IS = 5 A, V GS =.1 V I S = 5 A, VGS =.8 V IS = 5 A, V GS = 4.5 V 2 8 - -4-2 2 4 8 1 12 14 1 Ambient Temperature, Ta C Figure 4. On-Resistance vs. Temperature 1. VGS = V 1 Source Current, IS A.1 Ta = 75 C 25 C --25 C.1.2.4..8 1.2 Forward Source to Source Voltage, VF(S-S) V Figure 5. Forward Source-to-Source Voltage vs. Current Swiching Time, S/W μs 1 1 td(off) t f tr td(on) VSS = 5 V VGS =.8 V IS = 5 A 1 1 Gate Resistance, Rg kω Figure. Switching Time vs. Gate Resistance
TYPICAL CHARACTERISTICS Gate to Source Voltage, VGS V 4.5 4..5. 2.5 2. 1.5.5 V SS = 5 V I S = 5 A 5 1 15 2 25 5 4 Source Current, I S A 1 1. Operation in this area is limited by RSS (on). Ta = 25 C Surface mounted on ceramic substrate (5 mm 2.8 mm) ABSOLUTE MAXIMUM RATINGS 1 ms 1 ms 1 ms DC operation 1 μs.1 1. Total Gate Charge, Q g nc Source to Source Voltage, V SS V Figure 7. Gate-to-Source Voltage vs. Total Charge Figure 8. Safe Operating Area Total Dissipation, P T W 2. 1.8 1. 1.4 1.2.8..4 Surface mounted on ceramic substrate (5 mm 2.8 mm).2 25 5 75 1 125 15 175 Ambient Temperature, Ta C Figure 9. Total Dissipation vs. Temperature Thermal Resistance, R θja C/W 1 1 1E-5 Duty Cycle = 5% 2% 1% 5% 2% 1% Single Pulse.1.1 Pulse Time, PT s Figure 1. Thermal Response Surface mounted on ceramic substrate (5 mm 2.8 mm).1 1 4
PACKAGE DIMENSIONS unit : mm WLCSP 2.x1.49x CASE 57UF ISSUE O PIN 1 REFERENCE E A B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. TOP VIEW D MILLIMETERS DIM MIN NOM MAX A.8 2 b.27.. D E 1.95 1.44 2. 1.49 2.5 1.54 e.5 BSC. C A. C SIDE VIEW C SEATING PLANE RECOMMENDED SOLDERING FOOTPRINT* e 1 PACKAGE OUTLINE 1 : Source1 2 : Gate1 : Source1 4 : Source2 5 : Gate2 : Source2 4 1 BOTTOM VIEW e X b.5 M C A B.5 PITCH.5 PITCH X. DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 5
ORDERING INFORMATION EFC2J1NUZTDG Device Marking Package Shipping (Qty / Packing) NT WLCSP, 2.x1.49x (Pb-Free / Halogen Free) 5, / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD811/D. http:///pub_link/collateral/brd811-d.pdf Note on usage : Since the EFC2J1NUZ is a MOSFET product, please avoid using this device in the vicinity of highly charged objects. Please contact sales for use except the designated application. ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor s product/patent coverage may be accessed at /site/pdf/patent-marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. Typical parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.