Compression Molding Solutions for 3D TSV and other advanced packages as well as cost savings for standard package applications
1. Company Introduction 2. Package Development Trend 3. Compression FFT Molding Technology 4. Advantages by Compression FFT Mold 5. Cost reduction by Compression FFT Mold 6. Mass production equipment (PMC1040) 7. LED Lense Compression Molding 8. Summary / Conclusion 2
1 Company Introduction TOWA Europe GmbH has been established in 2004. A division of The TOWA Corporation of Japan, founded in 1979. Towa Corporation, a Molding Pioneer With a 40% WW market share, Towa is largest supplier of Mold equipment Cooperation with the package/product development centres of our European customers as well as with European institutes, enables us to play a leading role in the development of new products by European companies With our Towa Europe PDC (Package Development Center) we give full support in package development of Semiconductor and LED packages, from the designing stage to mass production. Source : VLSI Research 3
1 Company Introduction 4
Assembly Style 2 Package Road Map and Towa Mold Solutions Structure Package Trend 1980 1990 2000 Former generation DIP Single Cavity QFP/TQFP SOP/TSOP Single Cavity New generation PBGA Map Cavity FBGA FC BGA CSP Chip stack WL CSP POP Package stack WL CSP High end SIP 2014 Through Silicon Via Large Substrate Future mainstre am Matrix Cavity Matrix Cavity Map Unit Cavity Large Frame 5
2 Package Road Map and Towa Mold Solutions 1st Generation Mold method Transfer Single plunger 2nd Generation Mold method Transfer Multi-plunger 2.5th Generation Mold method Transfer Multi-plunger with vacuum 3rd Generation Mold method Compression FFT molding Single Cavity LF Matrix Cavity L/F Matrix allay package(map) FC BGA FBGA CSP High Power UV LED Chip stuck WL CSP SOP/TSOP PBGA Package stuck Stack Die & long wire & low loop height DIP QFP/TQFP Single Chip Flow Free Thin Molding Fine & Long wire Thin Package Multi-Stack Die Low-K Die Year 1990 2000 2014 Mold thickness (mm) 3 1 0.5 0.4 0.3 0.2 Mold Width (mm) 30 50 75 100 120 150 No of stack chip 1 2 5 7 8 10 16 20 Wire length (mm) 4 5 6 7 8 10 Wire dia (μm) 25 23 20 18 15 12 6
2 Package Road Map and Towa Mold Solutions Advance packaging 2013 => 7
3 Compression FFT Molding Technology Transfer Molding FM Seal Compression Molding Upper Transfer Speed Upper Chase Transfer Pressure Lower Lower Chase MAP Substrate Wafer LED Mold compound ( Pellet ) is set in the pot. Melted compound is transferred into mold chase. Mold compound ( Granule / Liquid) is set in lower chase. Substrate is slowly dipped into melted compound. 8
3 Compression Molding Technology: Film Handler Unwind Wind Upper Mold Die Release Film Middle Plate Ion Blow Lower Mold Die Film Width : 100 ~ 140mm Film roll diameter : φ180 MAX. Film exchange time : about 10 minute Film usage length per shot : length 400mm 9
3 Compression Molding Technology: FM Technology FM Die STD Molding FM unit FM Molding Steam Air in tablet Packed air 1mm FM position In filling Feature With vacuum unit, vacuum tank and unique seal enable gas & air inside of tablet or during resin fusion to deaerate within 1 second just 1mm away from final clamping position. Effect Void free and stable molding. Adequate to Thin Large Package, Stack Die, Stack Package, Flip Chip,Clear Resin etc 10
3 Compression FFT Molding Technology Fundamentals Compression molding Set resin into cavity area only. Pressurized encapsulation. - - No cull / runner Stable molding. Release film Release molded products from mold cavity. - No damage caused by ejection stress. - No ejector pin marks Protect cavities from contamination and abrasion. - Reduce cleaning or maintenance process FM Remove air and out-gas while molding. - - No voids No burnt spot caused by gas or air 11
4 Advantages: Enlarged substrate Size Transfer molding Compression FFT molding GATE side Compound flow-free Compound flow unbalance Compression FFT Molding Method is able to minimize resin flow comparing with Transfer Molding Method. To fill out all part of molding area, Transfer Molding Method takes much longer time. Compression FFT molding method has an advantage at larger substrate due to this reason. Cost reduction by using larger substrate up to 100 x 300 or Large Panels 12
4 Advantages: High Quality Molding Multi-stack die package Transfer molding Void Compression FFT molding Resin flow 13
4 Advantages: High Quality Molding Sensitive packaging - Overhanging dies, Low K die, fragile MEMS can be molded by compression molding by low encapsulation pressure. Compression FFT molding 14
4 Advantages: High Quality molding Long or fine wire bonded package Transfer molding Compression FFT molding Wire sweep max. 5% Resin : Green compound Wire diameter : 20 µm Wire length : 5.5 mm MAX. Wire sweep max. 0.3% 15
4 Advantages: High Quality molding Flip chip underfill Comparison picture With/Without FM(Flip chip / Matrix) Chip size : 7mm Gap : 70μm With FM Without FM 16
5 Cost Reduction: Reduction of Gold Wire Fine wire Compression FFT Molding Method enables gold wire to be smaller by minimized resin flow. Mold evaluation example of fine & long Wire MOLDING CONDITION Wire: φ15μm Wire length 5mm Cost down proposal of finer gold wire φ25μm φ15μm φ22μm φ15μm Approx. 64% reduction Approx. 54% reduction Cross-section ratio 17
5 Cost Reduction: Improved Resin Utalization Transfer Molding Compression FFT Molding Approx. 40~60% resin usage 100% resin usage Improved resin utilization and reduction of waste material and disposal cost
5 Cost Reduction: Reduction CMP / Backgrinding By reducing CMP, Back grinding process, Reduction of one process and equipment cost CMP, Back grinding process is required Chip thickness is free so that CMP, Back grinding process can be eliminated. Minimum Mold Gap over Die Transfer molding CompressionFFT molding
5 Cost Reduction: Progress of productivity and workability 1.Flexibility to different thickness products a. Available range from initial setting is +0.3mm of thickness of substrate or package by parameter. b. No conversion is required. Effective usage of chase and parts. 2.Decrease cleaning time of chase with release film. 3. Same Granular Compound can be used for different package type vs. troublesome pellet control management 20
6 Mass Production equipment PMC1040 appearance 21
6 Mass Production equipment Feature of PMC1040-S By using pre-cut release film method, release film usage is improved Advanced resin supply accuracy. Small foot print by using Hold Frame structure. Possible to connect maximum 4 Hold Frame module (= 8 strips) to meet mass production requirement. PMC can handle 30% wider substrate (Max 100 x 300mm) Possible to detect number of stack chip by Laser scan sensor Resin cooling ability. Molded substrate warpage compensation function equipped.
Conventional package 7 Led Lense Compression Molding Compression FFT molding, Simplify high power LED manufacturing process Die bonding Silicon lens Pre-molding Substrate (ceramics etc.) Epoxy, phosphor layer Compression FFT molding Die bonding Substrate (ceramics etc.) Compression molding Silicon, phosphor layer Lens shape No lens misalignment! 23
LED application Advantages of LED Compression FFT molding 1. Improves productivity by molding a lot of LED packages at one time. 2. Enables to miniaturize LED packages as thin package and small dia. Lens can be molded. 3. Enables to reduce LED package assembly process by making lens shape simultaneously by compression molding with silicone, instead of mounting separated lens. 4. Improves effective usage of reisn (over 95%) 5. Enables to encapsulate by phosphor mixed resin. 6. Improve reliability as release agent is not required to add in silicone resin. 7. Contributes improvement of heat radiation by wide substrate material selection (Ceramics etc.). 8. It's applicable to various lens shape not only dome type. (e.g., to make hollow on vertex of lens in order to spread light.) 24
8 Summary and Conclusion Superiority of Compression FFT Mold Larger substrate Finer wire Effective resin usage Cost reduction of CMP and other process Progress of productivity and workability Compression FFT molding method is capable for molding not only existing packages, but also for advanced packaging with the most beneficial cost reduction. 25
8 Summary and conclusion Various applications by Compression FFT molding Semiconductor / IC Complex Tooling Solar Cell Surface protection, Focus lens Mold LED Mold TOWA Compression FFT Mold The solution for difficult-to-mold packages, thin large area molding and automating. High filler contents, high adhesion, Silicone Resin (Heat proof, ultra-violets transit) Epoxy Resin ( High Adhesion etc. ) MEMS Cavity Electric Components Module Free from Vibration and Outer Conditions 26
8 Summary and conclusion Various assembly style by Compression FFT molding Strip Single /Multi Cap LED( Strip and panel size ) Wafer Level Panel Size 27
Thank you for your attention! 28