STPS2H-Y Automotive power Schottky rectifier Features Negligible switching losses High junction temperature capability Low leakage current Good trade-off between leakage current and forward voltage drop Avalanche capability specified ECOPACK 2 compliant component AEC-Q qualified A K STPS2HAY K A STPS2HUY Description Schottky rectifiers designed for high frequency miniature switched mode power supplies such as adaptators and on board DC/DC converters. Available in and. Table. Device summary Symbol Value I F(AV) 2 A V RRM V T j (max) 75 C V F (max).65 V December 2 Doc ID 7944 Rev /9 www.st.com 9
Characteristics STPS2H-Y Characteristics Table 2. Absolute ratings (limiting values) Symbol Parameter Value Unit V RRM Repetitive peak reverse voltage V I F(AV) Average forward current / T L = 3 C δ =.5 2 A I FSM Surge non repetitive forward current t p = ms sinusoidal 75 A P ARM Repetitive peak avalanche power t p = µs T j = 25 C 24 W T stg Storage temperature range -65 to +75 C T j Operating junction temperature range () -4 to +75 C. dptot < condition to avoid thermal runaway for a diode on its own heatsink dtj Rth(j-a) Table 3. Thermal resistance Symbol Parameter Value Unit R th(j-l) Junction to lead 3 25 C/W Table 4. Static electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit I R () V F (2) Reverse leakage current Forward voltage drop T j = 25 C - - µa V R = V RRM T j = 25 C -.4 ma T j = 25 C - -.79 I F = 2 A T j = 25 C -.6.65 V T j = 25 C - -.88 I F = 4 A T j = 25 C -.69.74. Pulse test: t p = 5 ms, δ < 2% 2. Pulse test: t p = 38 µs, δ < 2% To evaluate the conduction losses use the following equation: P =.56 x I F(AV) +.45 I F 2 (RMS) 2/9 Doc ID 7944 Rev
STPS2H-Y Characteristics Figure. Average forward power dissipation versus average forward current Figure 2. Average forward current versus ambient temperature (δ =.5) ( / ).7.6.5.4.3.2...9.8.7.6.5.4.3.2.. P F(AV) (W) δ =.5 δ =. I F(AV) (A) δ =.2 δ =.5 δ=tp/t δ =..2.4.6.8..2.4.6.8 2. 2.2 T tp 2.2 2..8.6.4.2..8.6.4.2. I F(AV) (A) δ=tp/t R th(j-a) = C/W S (CU) =.5cm2 T tp R th(j-a) =Rth(j-I) R th(j-a) =8 C/W S (CU) =.5cm2 T amb( C) 25 5 75 25 5 75 Figure 3. Normalized avalanche power derating versus pulse duration Figure 4. Normalized avalanche power derating versus junction temperature P ARM(tp) P ARM( µs).2 P ARM(Tj) P ARM(25 C)..8.6..4... t (µs) p.2 T ( C) j 25 5 75 25 5 Figure 5. Non repetitive surge peak forward current versus overload duration (maximum values) () Figure 6. Non repetitive surge peak forward current versus overload duration (maximum values) () I (A) M I (A) M 9 9 8 8 7 7 T a=25 C 6 T a=25 C 6 5 4 T a=75 C 5 4 T a=75 C 3 T a=25 C 3 T a=25 C 2 IM 2 IM t δ=.5 t(s).e-3.e-2.e-.e+ t δ=.5 t(s).e-3.e-2.e-.e+ Doc ID 7944 Rev 3/9
Characteristics STPS2H-Y Figure 7.. Z th(j-a) /Rth(j-a) Relative variation of thermal impedance junction to ambient versus pulse duration ( / ) Figure 8..E+4 I (µa) R Reverse leakage current versus reverse voltage applied (typical values).9.8.7.6.e+3.e+2 T j =5 C T j=25 C T j= C.5.E+ T j =75 C.4.3.2.. Single pulse t (s) p δ=tp/t.e-2.e-.e+.e+.e+2.e+3 T tp.e+.e-.e-2 T j=5 C T j =25 C V (V) R 2 4 6 8 Figure 9. Junction capacitance versus reverse voltage applied (typical values) Figure. Forward voltage drop versus forward current (low level) C(pF) F=MHz V OSC=3mVRMS T j=25 C I FM(A) 2..8.6 T j=25 C (Maximum values).4.2. T j=25 C (Typical values).8.6 T j=25 C (Maximum values).4 V (V) R.2 V FM(V)....2.3.4.5.6.7.8.9...2 4/9 Doc ID 7944 Rev
STPS2H-Y Characteristics Figure. I FM(A) Forward voltage drop versus forward current (high level) T j =25 C (Maximum values) T j=25 C (Typical values) T j =25 C (Maximum values) V FM(V).4.5.6.7.8.9...2.3.4.5.6.7.8 Figure 2. 3 2 9 8 7 6 5 4 3 2 R th(j-a) ( C/W) Thermal resistance junction to ambient versus copper surface under each lead () Epoxy printed circuit board FR4, Copper thickness = 35 µm S CU(cm²)..5..5 2. 2.5 3. 3.5 4. 4.5 5. Figure 3. Thermal resistance junction to ambient versus copper surface under each lead () R th(j-a) ( C/W) 9 8 7 6 5 4 3 2 Epoxy printed circuit board FR4, Copper thickness = 35 µm S CU(cm²)..5..5 2. 2.5 3. 3.5 4. 4.5 5. Doc ID 7944 Rev 5/9
Package information STPS2H-Y 2 Package information Epoxy meets UL94, V Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. Table 5. dimensions E Ref. Dimensions Millimeters Inches Min. Max. Min. Max. D A.9 2.45.75.94 A2.5.2.2.8 E b.25.65.49.65 c.5.4.6.6 A D 2.25 2.9.89.4 C L A2 b E 4.8 5.35.89.2 E 3.95 4.6.56.8 L.75.5.3.59 Figure 4. footprint (dimensions in mm).4 2.63.4.64 5.43 6/9 Doc ID 7944 Rev
STPS2H-Y Package information Table 6. dimensions Dimensions E Ref. Millimeters Inches Min. Max. Min. Max. D A.9 2.45.75.96 C E L A A2 b A2.5.2.2.8 b.95 2.2.77.87 c.5.4.6.6 E 5. 5.6.2.22 E 4.5 4.6.59.8 D 3.3 3.95.3.56 L.75.5.3.59 Figure 5. footprint (dimensions in mm).62 2.6.62 2.8 5.84 Doc ID 7944 Rev 7/9
Ordering information STPS2H-Y 3 Ordering information Table 7. Ordering information Order code Marking Package Weight Base qty Delivery mode STPS2HAY S2Y.68 g 5 Tape and reel STPS2HUY G2Y.7 g 25 Tape and reel 4 Revision history Table 8. Document revision history Date Revision Changes 3-Dec-2 Initial release. 8/9 Doc ID 7944 Rev
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