STPS47C-Y Automotive high voltage power Schottky rectifier Features High junction temperature capability Low leakage current Good trade off between leakage current and forward voltage drop Low thermal resistance High frequency operation Avalanche specification AEC-Q qualified Description Dual center tab Schottky rectifier suited for high frequency switched mode power supplies. Packaged in D PAK, these devices are intended for use to enhance the reliability of the application in automotive segment. Table. Symbol Device summary Value I F(AV) x A V RRM 7 V T j 75 C V F (max) A A K D PAK STPS47CGY-TR K A A.75 V November Doc ID 796 Rev /7 www.st.com 7
Characteristics STPS47C-Y Characteristics Table. Absolute ratings (limiting values, per diode) Symbol Parameter Value Unit V RRM Repetitive peak reverse voltage 7 V I F(RMS) Forward rms current 6 A I F(AV) Average forward current T c = 5 C δ =.5 When the diodes and are used simultaneously : ΔT j (diode ) = P(diode) x R th(j-c) (Per diode) + P(diode ) x R th(c) Per diode Per device I FSM Surge non repetitive forward current t p = ms sinusoidal 5 A P ARM Repetitive peak avalanche power t p = µs T j = 5 C 4 W T stg Storage temperature range -65 to + 75 C T j Operating junction temperature () -4 to + 75 C dv/dt Critical rate of rise reverse voltage V/µs dptot. < condition to avoid thermal runaway for a diode on its own heatsink dtj Rth(j-a) Table 3. Thermal resistance parameters Symbol Parameter Value Unit R th (j-c) Junction to case Per diode. Total.85 C/W R th (c) Coupling.5 Table 4. Static electrical characteristics (per diode) Symbol Parameter Tests conditions Min. Typ. Max. Unit 4 A I R () V F () Reverse leakage current Forward voltage drop T j = 5 C 3 µa V R = V RRM T j = 5 C 7 3 ma T j = 5 C.9 I F = A T j = 5 C.69.75 V T j = 5 C. I F = 4 A T j = 5 C.79.86. Pulse test: t p = 5 ms, δ < %. Pulse test: t p = 38 µs, δ < % To evaluate the conduction losses use the following equation : P =.64 x I F(AV) +.55 I F (RMS) /7 Doc ID 796 Rev
STPS47C-Y Characteristics Figure. Average forward power dissipation versus average forward current (per diode) Figure. Average forward current versus ambient temperature (δ =.5, per diode) 8 6 4 8 6 4 P F(AV) (W) =.5 =. =. =.5 = I F(AV)(A) =t p/t 4 6 8 4 6 8 4 6 8 T tp 8 6 4 8 6 4 I F(AV) (A) =t p/t T tp R th(j-a) =R th(j-c) R th(j-a) =5 C/W T amb( C) 5 5 75 5 5 75 Figure 3. Normalized avalanche power derating versus pulse duration Figure 4. Normalized avalanche power derating versus junction temperature P P ARM ARM (tp) (µs) P ARM(T) j P ARM(5 C)...8.6..4.... t (µs) T j( C) p 5 5 75 5 5 Figure 5. Non repetitive surge peak forward current versus overload duration (maximum values, per diode) Figure 6. Relative variation of thermal impedance junction to case versus pulse duration 5 I M (A). Z th(j-c) /R th(j-c).9.8 5 T C =5 C.7.6 =.5 T C =75 C.5.4 =. T C =5 C 5 IM t t(s) =.5.E-3.E-.E-.E+.3... =. Single pulse t P(s) =t p/t.e-3.e-.e-.e+ T tp Doc ID 796 Rev 3/7
Characteristics STPS47C-Y Figure 7. Reverse leakage current versus reverse voltage applied (typical values, per diode) Figure 8. Junction capacitance versus reverse voltage applied (typical values, per diode).e+5 I R (µa) C(pF) F=MHz.E+4 T j=5 C V OSC=3mV RMS T j =5 C T j =5 C.E+3 T j= C.E+ T j =75 C.E+ T j =5 C T j=5 C.E+ V R(V).E- 3 4 5 6 7 8 9 3 4 5 6 7 V R(V) Figure 9. Forward voltage drop versus forward current (per diode, low level) Figure. Forward voltage drop versus forward current (per diode, high level) I FM (A) I FM (A) 8 6 4 8 6 Tj=5 C Tj=5 C (Typical values) Tj=5 C Tj=5 C (Typical values) Tj=5 C 4 Tj=5 C V FM(V)....3.4.5.6.7.8.9. V FM(V)...4.6.8...4.6.8 Figure. Thermal resistance junction to ambient versus copper surface under tab 8 7 6 R th(j-a) ( C/W) epoxy printed board, FR4, Cu = 35 µm D²PAK 5 4 3 S CU(cm²) 5 5 5 3 35 4 4/7 Doc ID 796 Rev
STPS47C-Y Package information Package information Epoxy meets UL94, V. Cooling method: by conduction (C) In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. Table 5. D PAK dimensions Ref. Millimeters Dimensions Inches Min. Max. Min. Max. A 4.4 4.6.73.8 L E C A A.49.69.98.6 A.3.3..9 B.7.93.7.37 L L3 B B A C R D B.4.7.45.67 C.45.6.7.4 C.3.36.48.54 D 8.95 9.35.35.368 G E..4.393.49 M A * V * FLAT ZONE NO LESS THAN mm G 4.88 5.8.9.8 L 5. 5.85.59.64 L.7.4.5.55 L3.4.75.55.69 M.4 3..94.6 R.4 typ..6 typ. V 8 8 Figure. Footprint (dimensions in mm) 6.9.3 5.8.3 8.9 3.7 Doc ID 796 Rev 5/7
Ordering information STPS47C-Y 3 Ordering information Table 6. Ordering information Order code Marking Package Weight Base qty Delivery mode STPS47CGY-TR STPS47CGY D PAK.48 g Tape and reel 4 Revision history Table 7. Revision history Date Revision Changes 3-Nov- Initial release. 6/7 Doc ID 796 Rev
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