STPS34 Power Schottky rectifier Datasheet - production data Description K A NC Single chip Schottky rectifier suited for switch mode power supplies and high frequency DC to DC converters. A DPAK STPS34B A Packaged in DPAK, SMC, SMB, and SMBflat, this device is intended for use in low and medium voltage operation, high frequency inverters, free wheeling and polarity protection applications where low switching losses are required. K K Table 1. Device summary SMB STPS34U SMC STPS34S I F(AV) 3 A V RRM 4 V T j (max) 15 C V F (max).57 V A K SMBflat STPS34UF Features Very small conduction losses Negligible switching losses Low forward voltage drop Low thermal resistance Extremely fast switching Surface mounted device Avalanche capability specified ECOPACK 2 compliant component, STPS34UF April 214 DocID3624 Rev 1 1/13 This is information on a product in full production. www.st.com
Characteristics STPS34 1 Characteristics Table 2. Absolute Ratings (limiting values) Symbol Parameter Value Unit V RRM Repetitive peak reverse voltage 4 V I F(RMS) Forward rms current DPAK 6 A T c = 135 C δ =.5 DPAK I F(AV) Average forward current T L = 15 C δ =.5 SMB/SMC 3 A T L = 115 C δ =.5 SMBflat I FSM Surge non repetitive forward current t p =1 ms sinusoidal 75 A P ARM Repetitive peak avalanche power t p = 1 µs T j = 25 C 13 W T stg Storage temperature range -65 to + 15 C T j Operating junction temperature (1) 15 C 1. dptot --------------- dtj 1 Rth( j a) condition to avoid thermal runaway for a diode on its own heatsink Table 3. Thermal resistance Symbol Parameter Value Unit SMB 25 R th(j-l) Junction to lead SMBflat 15 C/W SMC 2 R th(j-c) Junction to case DPAK 5.5 C/W Table 4. Static electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit I R (1) V F (1) Reverse leakage current Forward voltage drop T j = 25 C 2 µa V R = V RRM T j = 125 C 2 1 ma T j = 25 C.63 I F = 3 A T j = 125 C.52.57 T j = 25 C.84 I F = 6 A T j = 125 C.63.72 V 1. Pulse test: t p = 38 µs, δ < 2% To evaluate the conduction losses use the following equation: P =.42 x I F(AV) +.5 I F 2 (RMS) 2/13 DocID3624 Rev 1
STPS34 Characteristics Figure 1. Average forward power dissipation versus average forward current (per diode) Figure 2. Average forward current versus ambient temperature (δ =.5, per diode) (DPAK / SMB / SMC) 2.5 2. P F(AV) (W) δ =.5 δ =.1 δ =.2 δ =.5 3.5 3. I F(AV) (A) R th(j-a) =Rth(j-l) DPAK δ = 1 2.5 1.5 2. R th(j-a) =65 C/W SMB / SMC 1. 1.5.5. T I F(AV) (A) δ=tp/t tp..5 1. 1.5 2. 2.5 3. 3.5 4. 1. T.5 δ=tp/t tp. T amb( C) 25 5 75 1 125 15 3.5 3. 2.5 2. 1.5 1..5. Figure 3. Average forward current versus ambient temperature (δ =.5, per diode) (SMBflat) I F(AV) (A) δ=tp/t T tp R th(j-a) =Rth(j-l) T amb( C) SMB flat R th(j-a) =4 C/W 2. S CU=2.5 cm 25 5 75 1 125 15 Figure 4. Non repetitive surge peak forward current versus overload duration (maximum values) (DPAK) 6 5 4 3 2 1 I (A) M IM t δ=.5 t(s) DPAK T c=25 C T c=75 C T c=125 C 1.E-3 1.E-2 1.E-1 1.E+ Figure 5. Non repetitive surge peak forward current versus overload duration (maximum values) (SMB) 1 9 8 7 6 5 4 3 2 1 I (A) M IM t δ=.5 t(s) T a=25 C T a=75 C T a=125 C 1.E-3 1.E-2 1.E-1 1.E+ SMB Figure 6. Non repetitive surge peak forward current versus overload duration (maximum values) (SMC) 12 11 1 9 8 7 6 5 4 3 2 1 I (A) M IM t δ=.5 t(s) SMC T a=25 C T a=75 C T a=125 C 1.E-3 1.E-2 1.E-1 1.E+ DocID3624 Rev 1 3/13 13
Characteristics STPS34 Figure 7. Non repetitive surge peak forward current versus overload duration (maximum values) SMBflat Figure 8. Normalized avalanche power derating versus pulse duration 25 2 I (A) M SMB flat 1 P ARM(t p) P ARM(1µs) 15 T L=25 C.1 1 5 IM t δ=.5 t(s) T L=75 C T L=125 C 1.E-3 1.E-2 1.E-1 1.E+.1.1.1.1 1 t p(µs) 1 1 1 Figure 9. Normalized avalanche power derating versus junction temperature Figure 1. Relative variation of thermal impedance junction to ambient versus pulse duration (DPAK) 1.2 P ARM( Tj) P ARM(25 C) 1..9 Z th(j-a) /Rth(j-a) DPAK 1.8.7.8.6.6.4.2 T ( C) j 25 5 75 1 125 15.5.4.3.2.1. Single pulse t (s) p δ=tp/t 1.E-3 1.E-2 1.E-1 1.E+ T tp Figure 11. Relative variation of thermal impedance junction to ambient versus pulse duration (SMB) Figure 12. Relative variation of thermal impedance junction to ambient versus pulse duration (SMC) 1. Z th(j-a) /Rth(j-a) 1. Z th(j-a) /Rth(j-a).9 SMB.9 SMC.8.8.7.7.6.6.5.5.4.4.3.2.1. Single pulse t (s) p δ=tp/t 1.E-2 1.E-1 1.E+ 1.E+1 1.E+2 1.E+3 T tp.3.2.1. Single pulse t (s) p δ=tp/t 1.E-2 1.E-1 1.E+ 1.E+1 1.E+2 1.E+3 T tp 4/13 DocID3624 Rev 1
STPS34 Characteristics Figure 13. Relative variation of thermal impedance junction to lead versus pulse duration - SMBflat Figure 14. Reverse leakage current versus reverse voltage applied (typical values) 1..9.8 Z th(j-l) /Rth(j-l) SMB flat 1.E+1 1.E+ I (ma) R T j =15 C T j =125 C.7 T j=1 C.6 1.E-1 T j =75 C.5.4 1.E-2.3.2.1. Single pulse t (s) p 1.E-4 1.E-3 1.E-2 1.E-1 1.E+ 1.E+1 1.E-3 1.E-4 T j=25 C V (V) R 5 1 15 2 25 3 35 4 Figure 15. Junction capacitance versus reverse voltage applied (typical values) 1 C(pF) F=1MHz V OSC=3mVRMS T j=25 C Figure 16. Forward voltage drop versus forward current I FM(A) 1. 1. T j =125 C (Maximum values) 1 T j=125 C (Typical values).1 T j =25 C (Maximum values) 1 V (V) R 1 1 1 V FM(V).1..1.2.3.4.5.6.7.8.9 1. DocID3624 Rev 1 5/13 13
Characteristics STPS34 Figure 17. Thermal resistance junction to ambient versus copper surface under each lead (DPAK) Figure 18. Thermal resistance junction to ambient versus copper surface under each lead (SMB / SMC) 1 9 8 7 6 5 4 3 2 1 R th(j-a) ( C/W) Printed circuit board FR4 copper thickness = 35 µm S CU(cm²) DPAK..5 1. 1.5 2. 2.5 3. 3.5 4. 4.5 5. 11 1 9 8 7 6 5 4 3 2 1 R th(j-a) ( C/W) Printed circuit board FR4 copper thickness = 35 µm S CU(cm²) SMB / SMC..5 1. 1.5 2. 2.5 3. 3.5 4. 4.5 5. Figure 19. Thermal resistance junction to ambient versus copper surface under each lead (SMBflat) 11 1 9 8 7 6 R th(j-a) ( C/W) Printed circuit board FR4 copper thickness = 35 µm 5 SMBflat 4 3 2 1 S CU(cm²)..5 1. 1.5 2. 2.5 3. 3.5 4. 4.5 5. 6/13 DocID3624 Rev 1
STPS34 Package Information 2 Package Information Band indicates cathode on SMB, SMBflat and SMC Epoxy meets UL94, V In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. DocID3624 Rev 1 7/13 13
Package Information STPS34 Ref. Table 5. DPAK dimension values Millimeters Dimensions Inches Min. Typ. Max. Min. Typ. Max. A 2.18 2.4.85.94 A1.9 1.1.35.43 A2.3.23.1.1 b.64.9.25.35 b4 4.95 5.46.195.215 c.46.61.18.24 c2.46.6.18.24 D 5.97 6.22.235.245 E 6.35 6.73.25.265 e1 4.4 4.7.173.185 H 9.35 1.34.368.47 L 1. 1.78.39.7 L2 1.27.5 L4.6 1.2.24.4 V2 8 8 Figure 2. DPAK footprint dimensions (in mm) 1.7 6.1 2.8 6.3 4.572 A B 1.5 This footprint ensures insultation up to 63 V rms (according to IEC 664-1) The device must be positioned within.5 A B 8/13 DocID3624 Rev 1
STPS34 Package Information Table 6. SMB dimensions E1 Ref. Dimensions Millimeters Inches Min. Max. Min. Max. D A1 1.9 2.45.75.96 C E L A1 A2 b A2.5.2.2.8 b 1.95 2.2.77.87 c.15.4.6.16 E 5.1 5.6.21.22 E1 4.5 4.6.159.181 D 3.3 3.95.13.156 L.75 1.5.3.59 Figure 21. SMB footprint (dimensions in mm) 1.62 2.6 1.62 2.18 5.84 DocID3624 Rev 1 9/13 13
Package Information STPS34 Table 7. SMBflat dimensions Ref. Millimeters Dimensions Inches E E1 D b A L L c L2 L1 Min. Typ. Max. Min. Typ. Max. A.9 1.1.35.43 b (1) 1.95 2.2.77.87 c (1).15.4.6.16 D 3.3 3.95.13.156 E 5.1 5.6.2.22 E1 4.5 4.6.189.181 L.75 1.5.29.59 L1.4.16 L2.6.24 1. Applies to plated leads Figure 22. SMBflat footprint (dimensions in mm) 5.84 2.7 1.2 3.44 1.2 1/13 DocID3624 Rev 1
STPS34 Package Information Table 8. SMC package dimensions E1 Ref Dimensions Millimeters Inches Min. Max. Min. Max. D A1 1.9 2.45.75.96 A2.5.2.2.8 b 2.9 3.2.114.126 E c.15.41.6.16 C E2 L A1 A2 b E 7.75 8.15.35.321 E1 6.6 7.15.26.281 E2 4.4 4.7.173.185 D 5.55 6.25.218.246 L.75 1.4.3.63 Figure 23. Footprint dimensions (in millimeters) 1.54 5.3 1.54 3.15 8.11 DocID3624 Rev 1 11/13 13
Ordering information STPS34 3 Ordering information Table 9. Ordering information Order code Marking Package Weight Base qty Delivery mode STPS34U U34 SMB.17 g 25 STPS34S S34 SMC.243 g 25 Tape and reel STPS34B 75 Tube S34 DPAK.3 g STPS34B-TR 25 Tape and reel STPS34UF FU34 ECOPACK 2 SMBflat.5 g 5 Tape and reel 4 Revision history Table 1. Document revision history Date Revision Description of changes Jul-23 7B Last update. Feb-25 8 Layout update. No content change. 8-Feb-27 9 16-Apr-214 1 Reformatted to current standard. Added ECOPACK statement. Added SMBflat package. Updated ECOPACK statement. Corrected Y axis in Figure 16 and Section 2: Package Information. 12/13 DocID3624 Rev 1
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