SEMICONDUCTOR TECHNICAL DATA Order this document by /D Advance Information EIA E and CCITT. The is a silicon gate CMOS IC that combines three drivers and three receivers to fulfill the electrical specifications of EIA E and CCITT. while operating from a single power supply. A voltage doubler and inverter convert the to ± 0. This is accomplished through an on board khz oscillator and four inexpensive external electrolytic capacitors. The three drivers and three receivers of the are virtually identical to those of the MC0. Therefore, for applications requiring more than three drivers and/or three receivers, an MC0 can be powered from an, since the charge pumps have been designed to guarantee ± at the output of up to six drivers. Thus, the provides a high performance, low power, stand alone solution or, with the MC0, a only, high performance two chip solution. Drivers ±. Output Swing 00 Ω Power Off Impedance Output Current Limiting TTL and CMOS Compatible Inputs Slew Rate Range Limited from /µs to 0 /µs Receivers Input Range to kω Input Impedance 0. Hysteresis for Enhanced Noise Immunity Charge Pumps to ± 0 Dual Charge Pump Architecture Supply Outputs Capable of Driving Three On Chip Drivers and Three Drivers on the MC0 Simultaneously Requires Four Inexpensive Electrolytic Capacitors On Chip khz Oscillator P SUFFIX PLASTIC DIP CASE ORDERING INFORMATION P DW DW SUFFIX SOG PACKAGE CASE D Plastic DIP SOG Package PIN ASSIGNMENT C C Rx Tx Rx Tx R R D D C C DO DI DO DI Rx R DO Tx 0 D DI D = DRIER R = RECEIER This document contains information on a new product. Specifications and information herein are subject to change without notice. RE 0/ Motorola, Inc.
FUNCTION DIAGRAM CHARGE PUMPS OSC C OLTAGE DOUBLER OLTAGE INERTER C RECEIER * kω Rx. k * Proctection circuit C C C.0. DO Tx C C C 00 Ω DRIER LEEL SHIFT DI.
MAXIMUM RATINGS (oltage polarities referenced to ) Rating Symbol alue Unit DC Supply oltages 0. to.0 Input oltage Range Rx Rx Inputs DI DI Inputs IR to 0. to ( 0.) DC Current per Pin I ± 00 ma Power Dissipation PD W Operating Temperature Range TA 0 to C Storage Temperature Range Tstg to 0 C DC ELECTRICAL CHARACTERISTICS (All polarities referenced to = 0 ; C, C, C, C = 0 µf; TA = 0 to C) Parameter Symbol Min Typ Max Unit DC Supply oltage.. Quiescent Supply Current (Outputs unloaded, inputs low) Output oltage Iload = 0 ma Iload = ma Iload = 0 ma Iload = 0 ma Iload = ma Iload = 0 ma ICC..0 ma.... RECEIER ELECTRICAL SPECIFICATIONS (oltage polarities referenced to = 0 ; = ± 0%; C, C, C, C = 0 µf; TA = 0 to C) Input Turn on Threshold DO DO = OL 0. 0.. Characteristic Symbol Min Typ Max Unit Rx Rx This device contains protection circuitry to protect the inputs against damage due to high static voltages or electric fields; however, it is advised that normal precautions be taken to avoid application of any voltage higher than maximum rated voltages to this high impedance circuit. For proper operation, it is recommended that the voltages at the DI and DO pins be constrained to the range DI and DO. Also, the voltage at the Rx pin should be constrained to ( ) Rx Rx ( ), and Tx should be constrained to Tx Tx. Unused inputs must always be tied to appropriate logic voltage level (e.g., or for DI, and for Rx). on... Input Turn off Threshold DO DO = OH Rx Rx off 0..0. Input Threshold Hysteresis (on off) Rx Rx hys 0. 0. Input Resistance Rx Rx Rin.0..0 kω High Level Output oltage Rx Rx = to IOH = µa IOH = ma DO DO OH 0. 0.. Low Level Output oltage Rx Rx = to IOL = µa IOL =. ma DO DO OL 0.0 0. 0. 0.
DRIER ELECTRICAL SPECIFICATIONS (oltage polarities referenced to = 0 : = ±0%; C, C, C, C = 0 µf; TA = 0 to C) Digital Input oltage Logic 0 Logic Input Current DI DI Characteristic Symbol Min Typ Max Unit DI DI DI DI IL IH.0 0. Iin ±.0 µa Output High oltage DI DI = Logic 0, RL =.0 kω Tx Tx Tx Tx* OH.. Output Low oltage DI DI = Logic, RL =.0 kω Tx Tx Tx Tx* OL Off Source Impedance (Figure ) Tx Tx Zoff 00 Ω Output Short Circuit Current =. Tx Tx Tx Tx shorted to ** Tx Tx shorted to ± *** * Specifications for an powering an MC0 with three additional drivers/receivers. ** Specification is for one Tx output pin to be shorted at a time. Should all three driver outputs be shorted simultaneously, device power dissipation limits could be exceeded. *** This condition could exceed package limitations. ISC.. ± 0 ± 00 SWITCHING CHARACTERISTICS ( = ± 0%; C, C, C, C = 0 µf; TA = 0 to C; See Figures and ) Drivers Propagation Delay Time Low to High RL = kω, CL = 0 pf or 00 pf High to Low RL = kω, CL = 0 pf or 00 pf Output Slew Rate Minimum Load: RL = kω, CL = 0 pf Characteristic Symbol Min Typ Max Unit Tx Tx tplh tphl 0. 0. Tx Tx SR.0 ± 0 Maximum Load: RL = kω, CL = 00 pf.0 ma µs /µs Receivers (CL = 0 pf) Propagation Delay Time DO DO Low to High tplh µs High to Low tphl Output Rise Time DO DO tr 0 00 ns Output Fall Time DO DO tf 0 00 ns
DRIERS DI DI Tx Tx RECEIERS Rx Rx DO DO DI DI DI Tx Tx Tx 0 Rout = in I in = ± Figure. Power Off Source Resistance tphl DRIERS Tx Tx 0% 0% 0% 0% tphl tf tf 0% tplh tplh Figure. Switching Characteristics tslh 0% 0% Figure. Slew Rate Characterization tr tr tshl SLEW RATE (SR) = ( ) OR ( ) tslh tshl 0 OH OL 0 OH OL PIN DESCRIPTIONS Digital Power Supply (Pin ) The digital supply pin, which is connected to the logic power supply. This pin should have a 0. µf capacitor to ground. Ground (Pin ) Ground return pin is typically connected to the signal ground pin of the EIA E connector (Pin ) as well as to the logic power supply ground. Positive Power Supply (Pin ) This is the positive output of the on chip voltage doubler and the positive power supply input of the driver/receiver sections of the device. This pin requires an external storage capacitor to filter the 0% duty cycle voltage generated by the charge pump. Negative Power Supply (Pin ) This is the negative output of the on chip voltage doubler/ inverter and the negative power supply input of the driver/receiver sections of the device. This pin requires an external storage capacitor to filter the 0% duty cycle voltage generated by the charge pump. C, C, C, C oltage Doubler and Inverter (Pins,,, ) These are the connections to the internal voltage doubler and inverter, which generate the and voltages. Rx, Rx, Rx Receive Data Input (Pins,, ) These are the EIA E receive signal inputs. A voltage between and is decoded as a space and causes the corresponding DO pin to swing to ground (0 ). A voltage between and is decoded as a mark, and causes the DO pin to swing up to. DO, DO, DO Data Output (Pins,, ) These are the receiver digital output pins, which swing from to. Each output pin is capable of driving one LSTTL input load. DI, DI, DI Data Input (Pins,, ) These are the high impedance digital input pins to the drivers. Input voltage levels on these pins must be between and. Tx, Tx, Tx Transmit Data Output (Pins,, 0) These are the EIA E transmit signal output pins, which swing toward and. A logic at a DI input causes the corresponding Tx output to swing toward. A logic 0 causes the output to swing toward. The actual levels and slew rate achieved will depend on the output loading (RL C L).
APPLICATIONS INFORMATION ESD CONSIDERATIONS ESD protection on IC devices that have their pins accessible to the outside world is essential. High static voltages applied to the pins when someone touches them either directly or indirectly can cause damage to gate oxides and transistor junctions by coupling a portion of the energy from the I/O pin to the power supply busses of the IC. This coupling will usually occur through the internal ESD protection diodes. The key to protecting the IC is to shunt as much of the energy to ground as possible before it enters the IC. Figure shows a technique which will clamp the ESD voltage at approximately using the MMBZDLT. Any residual voltage which appears on the supply pins is shunted to ground through the capacitors. OPERATION WITH SMALLER ALUE CHARGE PUMP CAPS The is characterized in the electrical tables DTMF INPUT TIP RING 0 kω RDSI kω * BYPASS TLA CDSI RTLA DSI TxA RxA RTx 0 µf 00 00:00 BYPASS CCDT CFB 0 ExI FB AG CDT MC RxA OR MC Xin Xout CD TxD RxD SQT LB MODE CDA. MHz 0 kω 0 kω 0 kω CCDA using 0 µf charge pump caps to illustrate its capability in driving a companion MC0 or MC0. If there is no requirement to support a second interface device and/or the charge pump is not being used to power any other components, the is capable of complying with EIA E and. with smaller value charge pump caps. Table summarizes driver performance with both. µf and.0 µf charge pump caps. Table. Typical Performance Parameter. µf.0 µf Tx OH @ C.. Tx OH @ C.. Tx OL @ C.. Tx OL @ C..0 Tx Slew Rate @ C.0 /µs.0 /µs Tx Slew Rate @ C.0 /µs.0 /µs.0 µf.0 µf C DI DO DI C DD CC C DI.0 µf C Tx Rx Tx Rx Rx.0 µf EIA E DB CONNECTOR * Line protection circuit Figure., 00 Baud Modem with EIA E Interface
DD C 0 µf C Rx DO 0 µf 0 µf Tx DI C C Rx DO MC0 Tx DI Rx DO Rx DO Tx DI Tx 0 DI Rx DO Tx DI 0 µf Rx DO 0 Tx DI Figure. MC0/ Only Solution for up to Six EIA E Drivers and Receivers 0 C C C C 0 C C Figure. Two Supply Configuration ( Generates Only) TO CONNECTOR MMBZDLT C C C C Rx Tx Rx Tx Rx Tx 0 C C DO DI DO DI DO DI C C Figure. ESD Protection Scheme
PACKAGE DIMENSIONS -A- -T- SEATING PLANE G E 0 A F 0 B D PL X D 0.00 (0.) M T A S B S X G K C N B K C 0. (0.00) M T A M 0X P 0.00 (0.) M T SEATING PLANE P SUFFIX PLASTIC DIP CASE 0 L J PL DW SUFFIX SOG PACKAGE CASE D 0 J F B M M M 0. (0.00) M T B M R X NOTES:. DIMENSIONING AND TOLERANCING PER ANSI Y.M,.. CONTROLLING DIMENSION: INCH.. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL.. DIMENSION B DOES NOT INCLUDE MOLD FLASH. DIM A B C D E F G J K L M N INCHES MIN MAX.00.00 0.0 0. 0.0 0.0 0.0 0.0 0.00 BSC 0.00 0.00 0.00 BSC 0.00 0.0 0.0 0.0 0.00 BSC 0 0.0 0.00 MILLIMETERS MIN..0. 0. MAX..0. 0.. BSC... BSC 0. 0..0.. BSC 0 0..0 NOTES:. DIMENSIONING AND TOLERANCING PER ANSI Y.M,.. CONTROLLING DIMENSION: MILLIMETER.. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.. MAXIMUM MOLD PROTRUSION 0.0 (0.00) PER SIDE.. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0. (0.00) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION. MILLIMETERS INCHES DIM MIN MAX MIN MAX A.. 0. 0.0 B.0.0 0. 0. C.. 0.0 0.0 D 0. 0. 0.0 0.0 F 0.0 0.0 0.0 0.0 G. BSC 0.00 BSC J 0. 0. 0.00 0.0 K 0.0 0. 0.00 0.00 M 0 0 P 0.0 0. 0. 0. R 0. 0. 0.00 0.0 Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Typical parameters can and do vary in different applications. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. How to reach us: USA/EUROPE: Motorola Literature Distribution; JAPAN: Nippon Motorola Ltd.; Tatsumi SPD JLDC, Toshikatsu Otsuki, P.O. Box ; Phoenix, Arizona 0. 00 F Seibu Butsuryu Center, Tatsumi Koto Ku, Tokyo, Japan. 0 HONG KONG: Motorola Semiconductors H.K. Ltd.; B Tai Ping Industrial Park, I Ting Kok Road, Tai Po, N.T., Hong Kong. /D