CRYSTAL OSCILLATOR (Programmable) SPREAD SPECTRUM OUTPUT: CMOS SG - 9 series Frequency range :.67 MHz ~ 7 MHz ( ppm Step) Supply voltage :.6 V ~.6 V Function : Output enable (OE) or Standby (ST ) Down or Center spread modulation Configurable spreading modulation profile (Hershey-kiss, Sine-wave, Triangle), modulation frequency, 6 spread percentage Package :. x.,. x.,. x., 7. x. (mm) PLL technology to enable short lead time Available field oscillator programmer SG-Writer II Product Number (please contact us) SG-9CA: XGxxxxx SG-9CB: XGxxxxx SG-9CE: XGxxxxx SG-9CG: XG9xxxxx CG CE CB CA Specifications (characteristics) Item Symbol Specifications Conditions/Remarks Supply voltage V CC.8 V Typ.. V Typ.. V Typ..6 V ~.98 V.98 V ~. V. V ~.8 V.7 V ~.6 V - Output frequency range f O.67 MHz ~ 7 MHz Storage temperature T_stg - ºC ~ + ºC Storage as single product. Operating temperature T_use - ºC ~ +8 ºC - ºC ~ + ºC Current consumption I CC. ma Max.. ma Max..6 ma Max..7 ma Max. T_use = + ºC.9 ma Typ.. ma Typ.. ma Typ. T_use = + ºC No load, f O = MHz.7 ma Max. 6. ma Max. 6.9 ma Max. 8. ma Max. T_use = + ºC.9 ma Typ..9 ma Typ. 7. ma Typ. T_use = + ºC No load, f O = 7 MHz Output disable current I_dis. ma Max.. ma Max.. ma Max..7 ma Max. OE = GND, f O = 7 MHz Standby current I_std.9 µa Max.. µa Max.. µa Max.. µa Max. T_use = + ºC. µa Typ.. µa Typ.. µa Typ.. µa Typ. T_use = + ºC ST = GND Symmetry SYM % ~ % % V CC Level I OH/I OL Conditions [ma] Rise/Fall time Vcc *A *B *C *D V OH 9 % V CC Min. Default (f O > MHz), I OH -. -. -. -. Fast I OL.... Output voltage I (DC characteristics) Default (f O MHz) OH -. -. -. -. I OL.... I Slow OH -. -. -. -. V OL % V CC Max. I OL.... *A.6 V ~.98 V, *B.98 V ~. V, *C. V ~.8 V, *D.7 V ~.6 V Output load condition L_CMOS pf Max. - Input voltage V IH 7 % V CC Min. OE or ST V IL % V CC Max.. ns Max. f O > MHz Default Rise and Fall 6. ns Max. f O MHz % - 8 % V tr/tf CC, time Fast. ns Max. f O =.67 MHz ~ 7 MHz L_CMOS = pf Slow. ns Max. f O =.67 MHz ~ MHz Measured from the time OE or ST pin crosses % Disable Time t_stp µs Max. Enable Time t_sta µs Max. Measured from the time OE pin crosses 7 % V CC Resume Time t_res ms Max. Measured from the time ST pin crosses 7 % V CC Start-up time t_str ms Max. Measured from the time V CC reaches its rated minimum value,.6 V Spread spectrum configuration C: Center spread Code 7 modulation Spread percentage ±. % ±. % ±.7 % ±. % ±. % ±. % D: Down spread Code modulation Spread percentage -. % -. % -. % -. % -. % -. % Modulation frequency:. khz (default), 6. khz, 8. khz,.7 khz Modulation profile: Hershey-kiss (default), Sine-wave, Triangle Product Name SG-9CG 7.MHz C P H A A A Model Package type Frequency Spread type Spread percentage code Function Operating temperature Modulation frequency Modulation profile Rise/Fall time V CC Package Type Spread type Operating temperature Modulation profile CA: 7. mm x. mm C: Center spread G: - C ~ +8 C A: Hershey-kiss (default) CB:. mm x. mm D: Down spread H: - C ~ + C B: Sine-wave CE:. mm x. mm C: Triangle CG:. mm x. mm Function Modulation frequency P: Output enable A:. khz (default) Rise/Fall time S: Standby B:.7 khz A: Default C: 8. khz B: Fast D: 6. khz C: Slow
Pin description Pin Name I/O type Function OE Input Output enable High: Specified frequency output from OUT pin Low: Out pin is low (weak pull down), only output driver is disabled. High: Specified frequency output from OUT pin ST Input Standby Low: Out pin is low (weak pull down), Device goes to standby mode. Supply current reduces to the least as I_std. GND Power Ground OUT Output Clock output V CC Power Power supply External dimensions (Unit: mm) Footprint (Recommended) (Unit: mm) SG-9CG SG-9CG SG-9CE SG-9CE SG-9CB SG-9CB SG-9CA SG-9CA Notes: In order to achieve optimum jitter performance, the. µf capacitor between V CC and GND should be placed. It is also recommended that the capacitors are placed on the device side of the PCB, as close to the device as possible and connected together with short wiring pattern.
Specification GraphTypical supplemental specification. Unless otherwise specified T_use =, L_CMOS = pf Current Consumption 8 L_CMOS = No load L_CMOS = pf 7 6 Icc (ma) Vcc =. V Vcc =. V Vcc =.8 V Icc (ma) 8 6 Vcc =. V Vcc =. V Vcc =.8 V Output disable current Standby current. I_dis (ma)... Vcc =. V Vcc =. V Vcc =.8 V Notes: Spead percentage : ±. %, Modulation frequency :. khz, Modulation profile : Hershey-kiss Specification GraphTypical supplemental specification. Unless otherwise specified T_use =, L_CMOS = pf Cycle-to-Cycle Jitter Peak-Peak CycletoCycleJitter Peak -Peak (ps) 8 6 8 6 Vcc=.8 V Rise/Fall time = Default Rise/Fall time = Fast Rise/Fall time = Slow CycletoCycleJitter Peak -Peak (ps) 8 6 8 6 Vcc=. V Rise/Fall time = Default Rise/Fall time = Fast Rise/Fall time = Slow CycletoCycleJitter Peak -Peak (ps) 8 6 8 6 Vcc=. V Rise/Fall time = Default Rise/Fall time = Fast Rise/Fall time = Slow 6 8 6 8 6 8 6 8 6 8 6 8 Notes: Spead percentage : ±. %, Modulation frequency :. khz, Modulation profile : Hershey-kiss
Spread Spectrum Specification Graph Spread Spectrum Profile fo : 7 MHz / Spread spectrum : ±. % / Modulation frequency :. khz Hershey-kiss Sine-wave Triangle Harmonics Specification Graph Typical supplemental specification. Unless otherwise specified T_use =, L_CMOS = pf, Vcc =. V Harmonics spectrum ( fo = MHz ) No spread spectrum Center spread ±. %, Hershey-kiss,. khz Power (dbm) - - - - - -6-7 -8 8 6 8 6 frequency (MHz) Power (dbm) - - - - - -6-7 -8 8 6 8 6 frequency (MHz) Modulation profile Modulation frequency - - - - - fo = MHz Hershey-kiss fo = MHz Sine-wave fo = MHz Triangle - - - - - fo = MHz. khz fo = MHz 6. khz -6-6 -7 7 9-7 7 9 Spread percentage Output frequency - - - - - fo = MHz ±. % fo = MHz ±. % fo = MHz ±. % - - - - - fo = 7 MHz fo = MHz fo = MHz Tr/Tf = fast -6-6 -7 7 9-7 7 9 Notes: Hermonics order attenuation is normalizing to no-spread spectrum mode.
Specification GraphTypical supplemental specification. Unless otherwise specified T_use =, L_CMOS = pf Rise/Fall Time (fo = MHz) Rise Time(ns)..... Rise time L_CMOS = pf Tr/Tf mode = Slow Tr/Tf mode = Default Tr/Tf mode = Fast..... Vcc (V) Fall Time(ns)..... Fall time L_CMOS = pf Tr/Tf mode = Slow Tr/Tf mode = Default Tr/Tf mode = Fast..... Vcc (V) Rise Time(ns)..... Rise time L_CMOS = pf Tr/Tf mode = Slow Tr/Tf mode = Default Tr/Tf mode = Fast..... Vcc (V) Harmonics comparison Center spread ±. %, Hershey-kiss,. khz - - - - - - - - - Rise/Fall time = Fast fo = MHz Vcc =. V fo = MHz Vcc =. V fo = MHz Vcc =.8 V - 7 9 - - - - - - - - - Fall Time(ns)..... Fall time L_CMOS = pf Tr/Tf mode = Slow Tr/Tf mode = Default Tr/Tf mode = Fast..... Vcc (V) Rise/Fall time = Slow fo = MHz Vcc =. V fo = MHz Vcc =. V fo = MHz Vcc =.8 V - 7 9 Attenuation (dbc) - - - - - - - - - comparation of Rise/Fall time Vcc =. V fo = MHz, Rise/Fall time=fast fo = MHz Rise/Fall time=default fo = MHz, Rise/Fall time=slow - 7 9 HarmonicsOdd Order Normalize to Vcc =.V. Normalize to Vcc =.V. Normalize to Rise/Fall time = Fast. Notes: frequency slow default fast.67 M M See Slow See Default See Fast M M - See Default See Fast M 7 M - See Fast See Fast
Simulation Model IBIS Model is available upon request. Please contact us. Information Required: Oscillator operating condition (i.e. Power Supply, Rise/Fall Time, Temperature) ESD Rating Test items Human Body Model (HBM) Machine Model (MM) Charged Device Model (CDM) Breakdown voltage V V 7V Device Material & Environmental Information Model Package Dimensions # of Pins Reference Weight (Typ.) Terminal Material Terminal Plating Complies With EU RoHS SMD products Reflow profile(example) The availability of the heat resistance for reflow conditions of JEDEC-STD-D. is judged individually. Please inquire. Pb Free MSL Rating Peak Temp. (Max) SG-9CG.x.x.7mm mg W Au Yes Yes 6 C SG-9CE.x.x.mm mg W Au Yes Yes 6 C SG-9CB.x.x.mm mg W Au Yes Yes 6 C SG-9CA 7.x.x.mm mg W Au Yes Yes 6 C Temperature [ C ] TP ; +6 C OVER + C TL ; +7 C Ts max ; + C Ramp-up rate + C/s Max. tl 6 s to s tp ; at least s Ramp-down rate -6 C/s Max. Ts min ; + C ts 6 s to s Time + C to Peak 6 8 6 8 6 66 7 78 Time [ s ] Pb free. Complies with EU RoHS directive. About the products without the Pb-free mark. Contains Pb in products exempted by EU RoHS directive. (Contains Pb in sealing glass, high melting temperature type solder or other.)
Device Marking Model Factory Programmed Part Marking Field Programmable Part Marking (Blank Samples) SG-9CG SG-9CE SG-9CB SG-9CA Standard Packing Specification SMD products are packed in the shipping carton as below table in accordance with taping standards EIA-8 and IEC-686 Marking Marking Standard Packing Quantity & Dimension(Unit mm) Model Reel Dimension Career Tape Dimension Direction of Quantity Feed (L= Left (pcs/reel) a b W A B C D Direction) SG-9CG Φ8 Φ6 9. 8. L SG-9CE Φ8 Φ6 9. 8. L SG-9CB Φ8 Φ6 8 7.. L SG-9CA Φ Φ 7. 8 9. 6. L
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