BCR... NPN Silicon Digital Transistor Switching circuit, inverter, interface circuit, driver circuit Built in bias resistor (R =4.7kΩ, R =4.7kΩ) Pbfree (RoHS compliant) package Qualified according AEC Q BCR BCRW C R R B E EHA784 Type Marking Pin Configuration Package BCR BCRW WFs WFs =B =B =E =E =C =C SOT SOT Maximum Ratings Parameter Symbol Value Unit Collectoremitter voltage V CEO 5 V Collectorbase voltage V CBO 5 Input forward voltage V i(fwd) Input reverse voltage V i(rev) Collector current I C ma Total power dissipation BCR, T S C BCRW, T S 4 C P tot mw 5 Junction temperature T j 5 C Storage temperature T stg 65... 5 95
BCR... Thermal Resistance Parameter Symbol Value Unit Junction soldering point ) R thjs K/W BCR BCRW 4 5 For calculation of R thja please refer to Application Note AN77 (Thermal Resistance Calculation) Electrical Characteristics at T A = 5 C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. DC Characteristics Collectoremitter breakdown voltage I C = µa, I B = V (BR)CEO 5 V Collectorbase breakdown voltage I C = µa, I E = Collectorbase cutoff current V CB = 4 V, I E = Emitterbase cutoff current V EB = V, I C = DC current gain ) I C = 5 ma, V CE = 5 V Collectoremitter saturation voltage ) I C = ma, I B =.5 ma Input off voltage I C = µa, V CE = 5 V Input on voltage I C = ma, V CE =. V V (BR)CBO 5 I CBO na I EBO.6 ma h FE V CEsat. V V i(off).8.5 V i(on).5 Input resistor R. 4.7 6. kω Resistor ratio R /R.9. AC Characteristics Transition frequency I C = ma, V CE = 5 V, f = MHz Collectorbase capacitance V CB = V, f = MHz f T 4 MHz C cb pf Pulse test: t < µs; D < % 95
BCR... DC current gain h FE = ƒ(i C ) V CE = 5 V (common emitter configuration) Collectoremitter saturation voltage V CEsat = ƒ(i C ), I C /I B =.5 V.4.5 hfe Vcesat. 4 C 5 C 5 C 85 C 5 C.5..5. 4 C 5 C 5 C 85 C 5 C.5 4 A I C Input on Voltage Vi (on) = ƒ(i C ) V CE =.V (common emitter configuration) A I C Input off voltage V i(off) = ƒ(i C ) V CE = 5V (common emitter configuration) Vi(on) V 4 C 5 C 5 C 85 C 5 C Vi(off) V 4 C 5 C 5 C 85 C 5 C 5 4 A I C 5 4 A I C 95
BCR... Total power dissipation P tot = ƒ(t S ) BCR Total power dissipation P tot = ƒ(t S ) BCRW mw mw 5 5 5 5 Ptot 75 Ptot 75 5 5 5 5 75 75 5 5 5 5 5 45 6 75 9 5 C 5 5 45 6 75 9 5 C 5 T S T S Permissible Pulse Load R thjs = ƒ(t p ) BCR Permissible Pulse Load P totmax /P totdc = ƒ(t p ) BCR RthJS K/W.5...5...5 D = Ptotmax / PtotDC D =.5...5...5 6 5 4 s t p 6 5 4 s t p 4 95
BCR... Permissible Puls Load R thjs = ƒ (t p ) BCRW Permissible Pulse Load P totmax /P totdc = ƒ(t p ) BCRW RthJS K/W.5...5...5 D = Ptotmax / PtotDC D =.5...5...5 6 5 4 s t p 6 5 4 s t p 5 95
Package SOT BCR... Package Outline +. ).4.5.9 ±..9 B C.95.4 ±.5.5 MIN. MAX. ±.. MAX....8 MAX..8...5. ±. A.5 M BC. M A Foot Print ) Lead width can be.6 max. in dambar area.8.8..9..9 Marking Layout (Example) EH s Manufacturer 5, June Date code (YM) Pin BCW66 Type code Standard Packing Reel ø8 mm =. Pieces/Reel Reel ø mm =. Pieces/Reel 4.9. 8..65 Pin.5.5 6 95
Package SOT BCR... Package Outline ±.. +..5 x. M. MAX...9 ±. A.65.65.±.. MIN..5 +..5.5 ±.. M A Foot Print.6 Marking Layout (Example) Standard Packing Reel ø8 mm =. Pieces/Reel Reel ø mm =. Pieces/Reel 4.. 8.8.6.65.65 Manufacturer 5, June Date code (YM) Pin BCR8W Type code Pin.5. 7 95
BCR... Edition 96 Published by Infineon Technologies AG 876 Munich, Germany 9 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of noninfringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (<www.infineon.com>). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in lifesupport devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that lifesupport device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 8 95