Introduction SAMWHA s CB, CBA, CM, CPI series of chip components consist of compact, high performance beads and inductors. Their innovative components and case structures mean low DC resistance and outstanding high frequency characteristics. These series are designed for a variety of applications, facilitating component selection for individual circuit requirements. Products Guide Product Name Application Material Part Number Impedance / Inductance Range Dimensions Signal line(g) General Frequency(A) CB GA CB GK CB GM 10~2000 10~2000 5~1000 1005 1608 2012 Chip Ferrite Beads Power Signal line(p) Ultra Power Signal line(u) Medium Frequency(K, J) High Frequency(M) Very High Frequency(V) CB GV CB PA CB PK CB PM CB UA CB UM 5~1000 5~600 5~600 5~300 5~120 5~120 3216 1608 2012 3216 2012 3216 A CBA GA 30~1000 Chip Ferrite Beads Array Signal Line K, J M CBA GK CBA GM 30~1000 30~1000 3216 V CBA GV 30~1000 Chip Ferrite Inductors Signal Line Ferrite(F) CM F 0.047~33 H 1608 2012 Chip Power Low DCR Use(L) Ferrite + CPI LZ 0.1~4,.7 H Inductors High Ldc Use(H) Ceramic(Z) CPI HZ 0.1~10 H 2016 2520 3216 3225
How to Order(Product Identification) CB 1608 G A 102 T CM 1608 F R22 K T CBA 3216 G A 102 N4 E CPI 2520 L Z 4R7 M E Mark CB CBA CM CPI Product Name Chip Ferrite Beads Chip Ferrite Beads Array Chip Ferrite Inductors Chip Power Inductors Mark Dimension Mark Dimension 1005 1.0 mm 0.5 mm 1608 1.6 mm 0.8 mm 2012 2.0 mm 1.25 mm 2016 2.0 mm 1.60 mm 2520 2.5 mm 2.0 mm 3216 3.2 mm 1.6 mm 3225 3.2 mm 2.5 mm Mark G P U Applications Signal Line High Power Line Ultra High Power Line Mark Material A General Frequency K, J Medium Frequency M High Frequency 300 = 30 201 = 200 601 = 600 102 = 1000 L Low DCR Type V Very High Frequency H High Ldc Type F Ferrite Z Ferrite + Ceramic R22 = 0.22 H 2R2 = 2.2 H 4R7 = 4.7 H 100 = 10 H Mark Tolerance K 10 % M 20 % N 30 % Mark T E Packaging Tape & Reel Pack Embossed Tape Pack N4 = 4 array
Chip Ferrite Beads Features Various size(1005~4532) High impedance characteristics Low Rdc, High Current characteristics Good reliability(monolithic structure) Magnetically shielded Fast mounting speed RoHS compliant Applications High frequency noise removal of digital equipment PDP/LCD Monitor, Digital TV/VCR etc. Shape & Dimensions (Unit : mm) Size L W T B 1005 1.0 0.10 0.5 0.10 0.5 0.10 0.25 0.1 1608 0.8 0.15 1.6 0.15 0.8 0.15 1608S 0.6 0.15 0.30 0.2 2012 2.0 0.20 1.25 0.20 0.85 0.20 1.25 0.2 0.50 0.3 3216 3.2 0.20 1.6 0.20 1.1 0.20 0.50 0.3 4516 4.5 0.25 1.6 0.20 1.3 0.20 0.50 0.3 4532 4.5 0.25 3.2 0.25 1.3 0.20 0.50 0.3 How to Order(Product Identification) Typical Material Characteristics CB 1608 G A 102 T Temperature Range Operating Temp. -55 ~ +125 Storage Temp. -55 ~ +125 CB : Chip Ferrite Beads The first two digits : Length(mm) The last two digits : Width(mm) G : Signal Line P : High Current Line U : Ultra High Current Line
Chip Ferrite Beads A : General Frequency K, J : Medium Frequency M : High Frequency V : Very High Frequency The first two digits represents significant The last digit is the number of zeros following ex) 121 = 120( ) T : Reel Paper Packaging E : Reel Embossed Tape Packaging Specifications Part No. Impedance25% DC ResistanceMax. Rated Current Max. Test Frequency CB1005GA100 10 0.05 1000 CB1005GA200 20 0.10 900 CB1005GA300 30 0.10 900 CB1005GA600 60 0.20 600 CB1005GA121 120 0.25 500 CB1005GA221 220 0.30 500 CB1005GA301 300 0.45 400 CB1005GA601 600 0.60 400 CB1005GA102 1000 1.00 200 CB1005GK300 30 0.10 900 CB1005GK600 60 0.20 600 CB1005GK800 80 0.20 600 CB1005GK121 120 0.30 500 CB1005GK221 220 0.35 500 CB1005GK301 300 0.45 400 CB1005GK471 470 0.55 300 100 CB1005GK601 600 0.60 300 CB1005GK102 1000 0.95 250 CB1005GM300 30 0.20 600 CB1005GM600 60 0.20 600 CB1005GM121 120 0.30 500 CB1005GV080 8 0.10 500 CB1005GV320 32 0.25 500 CB1005GV470 47 0.30 400 CB1005GV600 60 0.30 400 CB1005GV750 75 0.35 300 CB1005GV121 120 0.55 300 CB1005GV221 220 0.80 200 Measuring Equipment : Z : HP4291B / E4991A Rdc : HP4338B
Electrical Characteristics
Chip Ferrite Beads Specifications Part No. Impedance25% DC ResistanceMax. Rated Current Max. Test Frequency CB1608GA100 10 0.05 1000 CB1608GA180 18 0.05 1000 CB1608GA200 20 0.05 1000 CB1608GA300 30 0.05 1000 CB1608GA600 60 0.10 800 CB1608GA121 120 0.15 600 CB1608GA151 150 0.20 500 CB1608GA221 220 0.30 400 CB1608GA301 300 0.35 400 CB1608GA451 450 0.40 400 CB1608GA471 470 0.40 400 CB1608GA601 600 0.50 300 CB1608GA102 1000 0.70 250 CB1608GJ300 30 0.70 1000 CB1608GJ600 60 0.80 800 CB1608GJ121 120 0.20 500 CB1608GK300 30 0.07 1000 CB1608GK600 60 0.09 800 CB1608GK101 100 0.15 600 CB1608GK121 120 0.15 600 CB1608GK221 220 0.20 500 CB1608GK301 300 0.30 400 CB1608GK471 470 0.40 400 100 CB1608GK601 600 0.40 400 CB1608GK102 1000 0.50 400 CB1608GK202 2000 1.00 200 CB1608GK252 2500 1.50 150 CB1608GM300 30 0.07 1000 CB1608GM470 47 0.08 900 CB1608GM600 60 0.09 800 CB1608GM800 80 0.10 700 CB1608GM121 120 0.12 500 CB1608GM151 150 0.15 500 CB1608GM221 220 0.20 500 CB1608GM301 300 0.30 400 CB1608GM471 470 0.40 400 CB1608GM601 600 0.50 400 CB1608GM102 1000 0.60 300 CB1608GM222 2200 0.85 200 CB1608GV100 10 0.05 1000 CB1608GV300 30 0.10 700 CB1608GV600 60 0.10 700 CB1608GV121 120 0.25 500 CB1608GV151 150 0.30 400 CB1608GV221 220 0.40 400 Measuring Equipment : Z - HP4291B / E4991A Rdc - HP4338B
Electrical Characteristics
Chip Ferrite Beads Electrical Characteristics
Specifications Part No. Impedance25% DC Resistance Max. Rated Current Max. Test Frequency CB1005PK100 10 0.05 1000 CB1005PA121 120 0.25 800 CB1608PA100 10 0.05 2000 CB1608PA300 30 0.05 2000 CB1608PA600 60 0.08 1500 CB1608PA800 80 0.08 1500 CB1608PA121 120 0.10 800 CB1608PA181 180 0.09 1500 CB1608PA221 220 0.20 1000 CB1608PA301 300 0.30 900 CB1608PA501 500 0.40 600 CB1608PA601 600 0.40 600 CB1608PK100 10 0.05 2000 CB1608PK300 30 0.05 2000 CB1608PK600 60 0.08 1500 100 CB1608PK100 10 0.05 2000 CB1608PK121 120 0.08 1000 CB1608PK181 180 0.12 1000 CB1608PK221 220 0.20 1000 CB1608PK301 300 0.30 900 CB1608PK501 500 0.25 800 CB1608PK601 600 0.25 800 CB1608PJ300 30 0.05 2000 CB1608PJ600 60 0.10 1500 CB1608PJ121 120 0.12 1000 CB1608PM300 30 0.06 2000 CB1608PM600 60 0.08 1500 CB1608PM121 120 0.12 800 Measuring Equipment : Z : HP4291B / E4991A Rdc : HP4338B
Chip Ferrite Beads Electrical Characteristics
Specifications Part No. Impedance25% DC Resistance Max. Rated Current Max. Test Frequency CB2012GA150 10 0.010 1000 CB2012GA300 30 0.025 1000 CB2012GA500 50 0.06 600 CB2012GA600 60 0.06 600 CB2012GA121 120 0.10 300 CB2012GA151 150 0.10 300 100 CB2012GA221 220 0.12 200 CB2012GA301 300 0.15 200 CB2012GA471 470 0.15 200 CB2012GA601 600 0.25 200 CB2012GA102 1000 0.30 200 CB2012GA202 2000 0.50 200 40 CB2012GK150 15 0.02 1000 CB2012GK500 50 0.06 600 CB2012GK121 120 0.10 300 CB2012GK151 150 0.10 300 CB2012GK221 220 0.12 300 100 CB2012GK301 300 0.15 300 CB2012GK471 470 0.25 300 CB2012GK601 600 0.25 300 CB2012GK102 1000 0.30 300 CB2012GK202 2000 0.50 300 40 CB2012GJ300 30 0.02 1000 CB2012GJ600 60 0.06 600 CB2012GM300 30 0.02 1000 CB2012GM600 60 0.06 600 CB2012GM800 80 0.08 500 CB2012GM121 120 0.10 300 CB2012GM151 150 0.10 300 CB2012GM221 220 0.12 300 100 CB2012GM301 300 0.15 300 CB2012GM601 600 0.25 300 CB2012GM102 1000 0.30 300 CB2012GV080 8 0.05 1000 CB2012GV121 120 0.20 300 CB2012GV221 220 0.30 300 Measuring Equipment : Z : HP4291B / E4991A Rdc : HP4338B
Chip Ferrite Beads Electrical Characteristics
Electrical Characteristics
Chip Ferrite Beads Specifications Part No. Impedance25% DC ResistanceMax. Rated Current Max. Test Frequency CB2012PA110 11 0.010 3000 CB2012PA300 30 0.02 3000 CB2012PA500 50 0.03 3000 CB2012PA600 60 0.03 3000 CB2012PA800 80 0.03 3000 CB2012PA101 100 0.05 2500 CB2012PA121 120 0.05 2500 CB2012PA221 220 0.05 2000 CB2012PA301 300 0.1 2000 CB2012PA601 600 0.13 1500 CB2012PK150 15 0.020 3000 CB2012PK260 26 0.02 3000 CB2012PK300 30 0.020 3000 100 CB2012PK600 60 0.030 3000 CB2012PK800 80 0.03 3000 CB2012PK121 120 0.050 3000 CB2012PK151 150 0.05 3000 CB2012PK181 180 0.05 3000 CB2012PK221 220 0.050 2500 CB2012PK301 300 0.06 3000 CB2012PK501 500 0.06 3000 CB2012PK601 600 0.100 2000 CB2012PK102 1000 0.250 1000 CB2012PK202 2000 0.300 500 70 CB2012PJ601 600 0.100 2000 CB2012PJ102 1000 0.300 800 CB2012PM260 26 0.030 4000 CB2012PM600 60 0.030 4000 CB2012PM121 120 0.050 2500 100 CB2012PM221 220 0.050 2000 CB2012PM301 300 0.07 2000 CB2012PM601 600 0.130 1500 CB2012PM252 2500 0.400 700 70 Measuring Equipment : Z : HP4291B / E4991A Rdc : HP4338B
Electrical Characteristics
Chip Ferrite Beads Specifications Part No. Impedance25% DC ResistanceMax. Rated Current Max. Test Frequency CB3216GA330 33 0.02 600 CB3216GA350 33 0.03 600 CB3216GA500 50 0.03 600 CB3216GA600 60 0.04 600 CB3216GA700 70 0.04 600 CB3216GA101 100 0.05 500 CB3216GA121 120 0.10 300 CB3216GA151 150 0.10 300 CB3216GA201 200 0.15 300 CB3216GA301 300 0.20 250 CB3216GA601 600 0.30 200 CB3216GA102 1000 0.40 200 CB3216GK500 50 0.03 600 CB3216GK121 120 0.05 600 100 CB3216GK151 150 0.05 600 CB3216GK221 220 0.10 300 CB3216GK301 300 0.12 250 CB3216GK471 470 0.15 200 CB3216GK601 600 0.20 200 CB3216GK102 1000 0.25 200 CB3216GM121 120 0.10 300 CB3216GM151 150 0.10 300 CB3216GM201 200 0.15 300 CB3216GM301 300 0.20 250 CB3216GM601 600 0.30 200 CB3216GM102 1000 0.40 200 Measuring Equipment : Z : HP4291B / E4991A Rdc : HP4338B
Electrical Characteristics
Chip Ferrite Beads Specifications Part No. Impedance25% DC ResistanceMax. Rated Current Max. Test Frequency CB3216PA310 31 0.03 4000 CB3216PA330 33 0.03 4000 CB3216PA350 35 0.03 4000 CB3216PA500 50 0.03 4000 CB3216PA600 60 0.03 4000 CB3216PA700 70 0.03 4000 CB3216PA900 90 0.03 4000 CB3216PA101 100 0.03 3000 CB3216PA121 120 0.04 3000 CB3216PA151 150 0.05 3000 CB3216PA301 300 0.06 3000 CB3216PA391 390 0.06 3000 100 CB3216PA501 500 0.06 3000 CB3216PA500 50 0.02 4000 CB3216PA121 120 0.03 4000 CB3216PA301 300 0.06 3000 CB3216PA601 600 0.06 3000 CB3216PK501 500 0.06 3000 CB3216PK601 600 0.06 3000 CB3216PJ601 600 0.06 3000 CB3216PM121 120 0.03 3000 CB3216PM601 600 0.06 3000 Measuring Equipment : Z : HP4291B / E4991A Rdc : HP4338B
Electrical Characteristics
Chip Ferrite Beads Ultra Power Line Series Part No. Impedance25% DC ResistanceMax. Rated Current Max. Test Frequency CB1608UA600 60 0.050 2000 CB1608UA101 100 0.03 4000 CB1608UA121 120 0.050 2000 CB1608UA260 26 0.01 6000 CB1608UA260S 26 0.007 6000 CB1608UK500 50 0.030 4000 CB1608UK600 60 0.030 4000 CB2012UA300 30 0.010 5000 CB2012UA600 60 0.015 5000 CB2012UA101 100 0.020 4000 CB2012UA121 120 0.030 5000 CB2012UK400 40 0.02 5000 100 CB2012UK121 120 0.030 4000 CB2012UJ121 120 0.030 4000 CB2012UM121 120 0.030 4000 CB3216UA300 30 0.02 6000 CB3216UA350 35 0.02 6000 CB3216UA121 120 0.020 6000 CB3216UM600 60 0.010 6000 CB3216UM121 120 0.200 6000 CB4516UM600 60 0.010 6000 CB4532UK121 120 0.02 6000 CB4532UK401 400 0.04 4000 Measuring Equipment : Z : HP4291B / E4991A Rdc : HP4338B
Electrical Characteristics
Chip Ferrite Beads Arrays Chip Ferrite Beads Arrays Features Good reliability (Monolithic structure) Magnetically shielded Fast mounting speed RoHS compliant Applications CD-ROM, DVD, MD Lines Digital TVs and VTRs Shape & Dimensions (Unit : mm) Size L W T 3.2 0.2 1.6 0.2 0.9 0.2 3216 B D E 0.3 0.2 0.4 0.15 0.8 0.1 How to Order(Product Identification) Typical Material Characteristics CBA 3216 G A 102 N4 E Temperature Range Operating Temp. -55 ~ +125 Storage Temp. -10 ~ +40 CBA : Chip Ferrite Beads Array The first two digits : Length(mm) The last two digits : Width(mm) G : Signal Line P : High Current Line U : Ultra High Current Line
A : General Frequency K, J : Medium Frequency M : High Frequency V : Very High Frequency E : Reel Embossed Tape Packaging The first two digits represents significant The last digit is the number of zeros following ex) 121 = 120( ) N4 : 4 array Specifications Part No. Impedance25% DC ResistanceMax. Rated Current Max. Test Frequency CBA3216GA300N4 30 0.10 200 CBA3216GA600N4 60 0.25 200 CBA3216GA121N4 120 0.30 300 CBA3216GA221N4 220 0.35 150 CBA3216GA301N4 300 0.40 100 CBA3216GA471N4 470 0.45 100 CBA3216GA601N4 601 0.50 100 CBA3216GA102N4 100 0.70 50 CBA3216GK600N4 60 0.25 400 CBA3216GK121N4 120 0.30 350 CBA3216GK221N4 220 0.35 250 100 CBA3216GK301N4 300 0.40 250 CBA3216GK471N4 470 0.50 200 CBA3216GK601N4 600 0.60 200 CBA3216GK102N4 1000 0.75 150 CBA3216GM300N4 30 0.10 200 CBA3216GM600N4 60 0.12 200 CBA3216GM121N4 120 0.20 100 CBA3216GM301N4 300 0.45 100 CBA3216GM471N4 470 0.45 100 CBA3216GM601N4 600 0.50 100 Measuring Equipment : Z : HP4291B / E4991A Rdc : HP4338B
Chip Ferrite Beads Arrays Electrical Characteristics
Chip Giga Ferrite Beads Features Applications High impedance characteristics at GHz band PDP/LCD Monitor, DSC, DVC, Set Top Box Good reliability (Monolithic structure) Mobile phone Magnetically shielded Fast mounting speed RoHS compliant Dimensions (Unit : mm) Size L W T B 1005 1.0 0.1 0.5 0.05 0.5 0.05 0.25 0.1 1608 1.6 0.15 0.8 0.15 0.8 0.15 0.4 0.2 How to Order(Product Identification) CB 2012 G A 601 T Temperature Range Operating Temp. -55 ~ +125 Storage Temp. -55 ~ +125 GB : Giga Ferrite Beads The first two digits : length(mm) G : Signal Line The last two digits : width(mm) P : High Current Line T : Reel paper packaging E : Reel embossed tape packaging The first two digits represents significant The last digit is the number of zeros following ex) 601 = 600 ( )
Chip Giga Ferrite Beads Specifications Part No. Impedance25% DC Resistance40% DC Resistance Rated Current ma @100MHz @1GHz Max. Max. GB1005GA221 220 420 0.7 200 GB1005GA301 300 560 0.8 200 GB1005GA471 470 1000 1.0 100 GB1005GA102 1000 1700 1.6 100 GB1005GM471 470 1100 0.8 300 GB1005GM601 600 1400 0.85 300 Electrical Characteristics
Specifications Impedance25% DC Resistance40% DC Resistance Rated Current ma Part No. @100MHz @1GHz Max. Max. GB1608GA102 1000 1200 40% 1.5 50 GB1005GA152 1200 1000 40% 1.5 50 GB1005GK601 600 1000 (Typ.) 0.8 200 GB1005GK102 1000 1400 (Typ.) 1.0 100 GB1005GM601 600 1200 (Min.) 1.5 100 GB1005GV221 220 1100 40% 0.8 100 GB1005GV471 470 2100 40% 1.2 50 Measuring Equipment : Z : HP4291B / E4991A Rdc : HP4338B Electrical Characteristics
Chip Ferrite Inductors Chip Ferrite Inductors Features High Q, stable inductance in wide frequency Good reliability(monolithic structure) Magnetically shielded Fast mounting speed RoHS compliant Applications Computer and its Peripherals Hard-disk Drivers Audio/Visual Equipment Shape & Dimensions (Unit : mm) Size L W T B 1005 1.0 0.1 0.5 0.1 0.5 0.1 0.25 0.1 1608 1.6 0.15 0.8 0.15 0.8 0.15 0.3 0.2 2012 2.0 0.2 1.25 0.2 0.85 0.2 1.25 0.2 0.5 0.3 3216 3.2 0.2 1.6 0.20 1.1 0.2 0.5 0.3 How to Order(Product Identification) CM 1608 F R22 K T Temperature Range Operating Temp. -40 ~ +85 Storage Temp. -10 ~ +40 CM : Chip Ferrite Inductors The first two digits : Length(mm) F : Ferrite The last two digits : Width(mm) 22n = 22nH 2R2 = 2.2nH K : 10% M : 20% T : Reel paper packaging 220 = 22 R22 = 0.22 E : Reel embossed tape packaging
Specifications Part No. Inductance Q Test Frequency SRF DC Resistance Ratde Current T Tolerance Min. Min. Max. (ma) Max. (mm) CM1005FR10 0.10 15 25 190 0.6 25 CM1005FR12 0.12 15 25 180 0.7 25 CM1005FR15 0.15 15 25 165 0.9 25 CM1005FR18 0.18 15 25 150 1.0 25 CM1005FR22 0.22 15 25 135 1.1 25 CM1005FR27 0.27 15 25 120 1.2 25 CM1005FR33 0.33 15 25 105 1.25 25 CM1005FR39 0.39 10% 20 25 85 0.6 15 0.5 0.1 CM1005FR47 0.47 20 25 80 0.7 15 CM1005FR56 0.56 20 25 75 0.8 15 CM1005FR68 0.68 20 25 70 0.9 15 CM1005FR82 0.82 20 25 65 1.0 15 CM1005F1R0 1.0 20 10 60 1.1 15 CM1005F1R2 1.2 20 10 55 1.25 15 Measuring Equipment : Z : HP4291B / E4991A Rdc : HP4338B Electrical Characteristics
Chip Ferrite Inductors Specifications Inductance Q Test Frequency SRF DC Resistance Ratde Current T Part No. Tolerance Min. Min. Max. (ma) Max. (mm) CM1608FR18 0.18 15 25 165 0.60 50 CM1608FR22 0.22 15 25 150 0.80 50 CM1608FR27 0.27 15 25 136 0.80 50 CM1608FR33 0.33 15 25 125 0.85 35 CM1608FR39 0.39 15 25 110 1.00 35 CM1608FR47 0.47 15 25 105 1.35 35 CM1608FR56 0.56 15 25 95 1.55 35 CM1608FR68 0.68 15 25 80 1.70 35 CM1608FR82 0.82 15 25 75 2.10 35 CM1608F1R0 1.00 10% 20% 35 10 70 0.60 25 CM1608F1R2 1.20 35 10 60 0.80 25 CM1608F1R5 1.50 35 10 55 0.80 25 CM1608F1R8 1.80 35 10 50 0.95 25 CM1608F2R2 2.20 35 10 45 1.15 15 CM1608F2R7 2.70 35 10 40 1.35 15 CM1608F3R3 3.30 35 10 38 1.55 15 CM1608F3R9 3.90 35 10 36 1.70 15 CM1608F4R7 4.70 35 10 33 2.10 15 CM1608F100 10.0 35 2 17 2.55 5 Measuring Equipment : Z : HP4291B / E4991A Rdc : HP4338B 0.8 0.15
Specifications Inductance Q Test Frequency SRF DC Resistance Ratde Current T Part No. Tolerance Min. Min. Max. (ma) Max. (mm) CM2012FR22 0.22 20 25 170 0.50 250 CM2012FR27 0.27 20 25 150 0.50 250 CM2012FR33 0.33 20 25 145 0.55 250 CM2012FR47 0.47 25 25 125 0.65 200 CM2012FR56 0.56 25 25 115 0.75 150 CM2012FR68 0.68 25 25 105 0.80 150 CM2012FR82 0.82 25 25 100 1.00 150 CM2012F1R0 1.0 45 10 75 0.40 50 CM2012F1R5 1.5 45 10 60 0.50 50 CM2012F1R8 1.8 45 10 55 0.60 50 CM2012F2R2 2.2 20% 45 10 50 0.65 30 CM2012F2R7 2.7 10% 45 10 45 0.75 30 CM2012F3R3 3.3 45 10 41 0.80 30 CM2012F3R9 3.9 45 10 38 0.90 30 CM2012F4R7 4.7 45 10 35 1.00 30 CM2012F5R6 5.6 50 4 32 0.90 15 CM2012F6R8 6.8 50 4 29 1.00 15 CM2012F8R2 8.2 50 4 26 1.10 15 CM2012F100 10 50 2 24 1.15 15 CM2012F120 12 50 2 22 1.25 15 CM2012F150 15 30 1 19 0.80 5 CM2012F220 22 30 1 16 1.10 5 CM3216F1R0 1.0 45 10 75 0.40 100 CM3216F1R5 1.5 45 10 60 0.50 50 CM3216F1R8 1.8 45 10 55 0.50 50 CM3216F2R2 2.2 45 10 50 0.60 50 CM3216F3R3 3.3 45 10 41 0.70 50 CM3216F4R7 4.7 45 10 35 0.80 50 CM3216F5R6 5.6 10% 50 4 32 0.60 25 CM3216F6R8 6.8 50 4 29 0.60 25 CM3216F8R2 8.2 50 4 26 0.90 25 CM3216F100 10 50 2 24 0.70 25 CM3216F120 12 50 2 22 1.05 25 CM3216F150 15 35 1 19 1.10 25 Measuring Equipment : Z : HP4291B / E4991A Rdc : HP4338B 0.85 1.25 0.2 1.10 0.2
Chip Power Inductors Chip Power Inductors Features Low DC resistance and High DC Biased products in the class. Completely lead-free product and support lead-free solders. Low thickness and high current density products. Complex products of co-fired ceramic and magnetic materials. Applications DC-DC converters and power modules used for the following equipments. Compact electrical instruments such as cellular phones, PDA, DVC, DSC and HDD. Shape & Dimensions (Unit : mm) Size L W T B 1608 1.6 0.15 0.8 0.15 1.0max 0.3 0.2 2012 2.0 0.20 1.25 0.2 1.0max 0.5 0.3 2016 2.0 0.20 1.6 0.2 1.0max 0.5 0.3 2520 2.5 0.20 2.0 0.2 1.0max 0.5 0.3 3216 3.2 0.20 1.6 0.20 0.6max 0.5 0.3 3225 3.2 0.20 2.5 0.20 1.0max 0.5 0.3 How to Order(Product Identification) CPI 2520 N H L 4R7 M E Measurement Equipments Agilent 4284A(Precision LCR Meter) Agilent 42841A(Bias Current Source) Temperature Range Operating Temp. -40 ~ +85 Storage Temp. -10 ~ +40 CPI : Chip Power Inductors The First two digits : length (mm) S : 0.6mm D : 0.8mm The Last two digits : Width (mm) N : 1.0mm T : 1.2mm
L : Low DCR type H : High Current type U : Very High Current type K : 10% M : 20% N : 30% 2R2 : 2.2 4R7 : 4.7 100 : 10.0 T : Real paper packaging E : Real embossed tape packaging B : BulK packaging Characteristics - High Current Type Part No. Thickness (mm) Inductance at 1 MHz DC Resistance ( ) Rated Current(A) CPI2012NHL1R0MT 1.0 max 1.0 20% 0.20 30% 1.0 CPI2012NHL1R5MT 1.0 max 1.5 20% 0.23 30% 0.9 CPI2012NHL2R2MT 1.0 max 2.2 20% 0.23 30% 0.9 CPI2012NHL3R3MT 1.0 max 3.3 20% 0.25 30% 0.8 CPI2012NHL4R7MT 1.0 max 4.7 20% 0.30 30% 0.6 Part No. Thickness (mm) Inductance at 1 MHz DC Resistance ( ) Rated Current(A) CPI2012SHL1R0MT 0.6 max 1.0 20% 0.30 30% 0.60 CPI2012SHL1R5MT 0.6 max 1.5 20% 0.35 30% 0.55 CPI2012SHL2R2MT 0.6 max. 2.2 20% 0.40 30% 0.50 CPI2012SHL3R3MT 0.6 max. 3.3 20% 0.45 30% 0.40 CPI2012SHL4R7MT 0.6 max. 4.7 20% 0.55 30% 0.30 Part No. Thickness (mm) Inductance at 1 MHz DC Resistance ( ) Rated Current(A) CPI2016NHL1R0ME 1.0 max 1.0 20% 0.12 30% 1.30 CPI2016NHL1R5ME 1.0 max 1.5 20% 0.12 30% 1.30 CPI2016NHL2R2ME 1.0 max 2.2 20% 0.14 30% 1.20 CPI2016NHL3R3ME 1.0 max 3.3 20% 0.18 30% 1.00 CPI2016NHL4R7ME 1.0 max 4.7 20% 0.23 30% 0.90
Chip Power Inductors Characteristics - High Current Type Part No. Thickness (mm) Inductance at 1 MHz DC Resistance ( ) Rated Current(A) CPI3225NHL1R0ME 1.0 max 1.0 20% 0.10 30% 1.30 CPI3225NHL1R5ME 1.0 max 1.5 20% 0.12 30% 1.30 CPI3225NHL2R2ME 1.0 max 2.2 20% 0.15 30% 1.20 CPI3225NHL3R3ME 1.0 max 3.3 20% 0.17 30% 1.10 CPI3225NHL4R7ME 1.0 max 4.7 20% 0.20 30% 1.00 CPI3225NHL6R8ME 1.0 max 6.8 20% 0.28 30% 0.90 CPI3225NHL100ME 1.0 max 10.0 20% 0.35 30% 0.80
Characteristics - Low DC Resistance Yype Part No. Thickness (mm) Inductance at 1 MHz DC Resistance ( ) Rated Current(A) CPI1608NLLR47MT 1.0 max 0.47 20% 0.15 30% 1.10 CPI1608NLLR68MT 1.0 max 0.68 20% 0.17 30% 1.05 CPI1608NLL1R0MT 1.0 max 1.0 20% 0.20 30% 1.00 CPI1608NLL1R5MT 1.0 max 1.5 20% 0.25 30% 0.90 CPI1608NLL2R2MT 1.0 max 2.2 20% 0.30 30% 0.80 Part No. Thickness (mm) Inductance at 1 MHz DC Resistance ( ) Rated Current(A) CPI2012NLLR47MT 1.0 max 0.47 20% 0.08 30% 1.30 CPI2012NLL1R0MT 1.0 max 1.0 20% 0.11 30% 1.20 CPI2012NLL1R5MT 1.0 max 1.5 20% 0.14 30% 1.10 CPI2012NLL2R2MT 1.0 max 2.2 20% 0.16 30% 1.00 CPI2012NLL3R3MT 1.0 max 3.3 20% 0.22 30% 0.80 CPI2012NLL4R7MT 1.0 max 4.7 20% 0.26 30% 0.70 Part No. Thickness (mm) Inductance at 1 MHz DC Resistance ( ) Rated Current(A) CPI2520NLL1R0ME 1.0 max 1.0 20% 0.07 30% 1.50 CPI2520NLL1R5ME 1.0 max 1.5 20% 0.07 30% 1.50 CPI2520NLL2R2ME 1.0 max 2.2 20% 0.08 30% 1.30 CPI2520NLL3R3ME 1.0 max 3.3 20% 0.10 30% 1.20 CPI2520NLL4R7ME 1.0 max 4.7 20% 0.12 30% 1.10 Part No. Thickness (mm) Inductance at 1 MHz DC Resistance ( ) Rated Current(A) CPI3225NLL4R7ME 1.0 max 4.7 20% 0.10 30% 1.10 CPI3225NLL100ME 1.0 max 10.0 20% 0.23 30% 0.90
Chip Power Inductors Characteristics - High Efficiency Type Part No. Thickness (mm) Inductance at 1 MHz DC Resistance ( ) Rated Current(A) EPI2012NLYR24MT 1.0 max 0.24 20% 0.027 30% 3.2 EPI2012NLYR33MT 1.0 max 0.33 20% 0.032 30% 3.0 EPI2012NLYR47MT 1.0 max 0.47 20% 0.040 30% 2.6 EPI2012NLYR56MT 1.0 max 0.56 20% 0.050 30% 2.2 Part No. Thickness (mm) Inductance at 1 MHz DC Resistance ( ) Rated Current(A) EPI2016NLYR15ME 1.0 max 0.15 20% 0.020 30% 3.5 EPI2016NLYR24ME 1.0 max 0.24 20% 0.025 30% 3.2 EPI2016NLYR33ME 1.0 max 0.33 20% 0.030 30% 3.0 EPI2016NLYR47ME 1.0 max 0.47 20% 0.040 30% 2.6 EPI2016NLYR56ME 1.0 max 0.56 20% 0.045 30% 2.5 Part No. Thickness (mm) Inductance at 1 MHz DC Resistance ( ) Rated Current(A) EPI2520NLYR47ME 1.0 max 0.47 20% 0.04 30% 3.2 EPI2520NLYR68ME 1.0 max 0.68 20% 0.05 30% 3.0 EPI2520NLY1R0ME 1.0 max 1.00 20% 0.07 30% 2.7
Characteristics - High Current Type
Chip Power Inductors Characteristics - High Current Type
Characteristics - Low DC Resistance Type
Chip Power Inductors Characteristics - High Efficiency Type
Reliability and Test Conditions Operating Temperature Range Storage Temperature Range 55 ~ 125 40 ~ 85 40 Max., 70% RH Max. Chip Beads Item Requirements Test Conditions at Packing Condition Chip Inductors Solderability Resistance to Soldering Heat Reflow Soldering More than 90% of the terminal electrode shall be covered with new solder 1. No damage such as cracks should be caused in chip element 2. More than 75% of the terminal electrode shall be covered with new solder 3. Impedance shall not change more than 30 % 4. Inductance shall not change more than 10 % 5. Q shall not change more than 20 % More than 50% of the terminal electrode shall be covered with new solder - Preheat Temperature : 100~150 - Preheat Time : 60sec. - Solder Temperature : 245 5 260 5 - Soldering Time : 10sec. - Preheat Temperature : 100~150 - Preheat Time : 60sec. - Solder Temperature : 270 10 - Soldering Time : 10 0.5sec. - Preheat Temperature : 150 - Preheat Time : 60sec. - Solder Temperature : 245 5 260 5 - Soldering Time : 10sec. Max. (Reflow Soldering Profile) High Temperature Resistance High Temperature Load Resistance 1. No mechanical damage 2. Impedance shall not change more than 30 % 3. Inductance shall not change more than 10 % 4. Q shall not change more than 20 % - Temperature : 125 3 85 3 - Time : 500 12hours - Measurement at room ambient temperature after placing for 24 hours - Temperature : 125 3 85 3 - Applied Current : Rated Current - Time : 1000 12hours - Measurement at room ambient temperature after placing for 24 hours Humidity Resistance - Temperature : 40 2 - Humidity : 90 2%RH - Time : 500 12hours - Measurement at room ambient temperature after placing for 24 hours
Chip Beads Chip Inductors Item Requirements Test Conditions Humidity Load Resistance Low Temperature Resistance Thermal Shock Vibration 1. No mechanical damage 2. Impedance shall not change more than 30 % 3. Inductance shall not change more than 10 % 4. Q shall not change more than 20 % - Temperature : 40 2 - Humidity : 90 2% RH - Applied Current : Rated Current - Time : 500 12 hours - Measurement at room ambient temperature after placing for 24 hours - Temperature : 55 3 40 3 - Time : 1000 12 hours - Measurement at room ambient temperature after placing for 24 hours 1. 55 3 for 30minutes 40 3 for 30minutes 2. 125 3 for 30minutes 85 3 for 30minutes 3. Repeat 100 Cycle - Frequency : 10~55Hz - Amplitude : 1.5mm - Direction : X, Y, Z - Sweep Time : 2hours for each axis Drop Flexure Strength No Mechanical Damage Type 1005 1608 2012 3216 4516 4532 A(mm) 0.7 1.0 1.0 1.3 1.5 1.5 B(mm) 0.5 0.8 1.0 1.5 3.6 3.6 C(mm) 0.7 1.3 1.3 3.0 3.0 3.0 W(kgf) 0.7 2.0 4.0 5.0 5.0 5.0 Drop 10 times on a concrete floor from a height of 100cm Bending Strength The terminal electrode shall be neither break off nor the chip damage
Item Requirements Test Conditions Operating Temperature Range Storage Temperature Range -55 ~+125 40 Max., 70% RH Max. at Packing Condition Solderability Resistance to Soldering heat More than 90% of the terminal electrode shall be covered with new solder 1. No damage such as cracks should be caused in chip element 2. More than 75% of the terminal electrode shall be covered with new solder 3. Impedance shall not change more than 30 % - Preheat Temperature : 100~150 - Preheat Time : 60sec. - Solder Temperature : 245 5 - Soldering Time : 10 1sec. - Preheat Temperature : 100~150 - Preheat Time : 60sec. - Solder Temperature : 270 10 - Soldering Time : 10 0.5 sec. Reflow Soldering More than 50% of the terminal electrode shall be covered with new solder - Preheat Temperature : 150 - Preheat Time : 60sec. - Solder Temperature : 245 5 - Soldering Time : 10sec. Max. (Reflow Soldering Profile) High Temperature Resistance - Temperature : 125 3 - Time : 500 12hours - Measurement at room ambient temperature after placing for 24 hours High Temperature Load Resistance 1. No mechanical damage 2. Impedance shall not change more than 30 % - Temperature : 125 3 - Applied Current : rated Current - Time : 1000 12hours - Measurement at room ambient temperature after placing for 24 hours Humidity Resistance - Temperature : 40 2 - Humidity : 90 2% RH - Time : 500 12hours - Measurement at room ambient temperature after placing for 24 hours
Item Requirements Test Conditions Humidity Load Resistance - Temperature : 40 2 - Humidity : 90 2% RH - Applied Current : Rated Current - Time : 500 12hours - Measurement at room ambient temperature after placing for 24 hours Low Temperature Resistance Thermal Shock Vibration 1. No mechanical damage 2. Impedance shall not change more than 30 % - Temperature : 55 3 - Time : 1000 12 hours - Measurement at room ambient temperature after placing for 24 hours 1. 55 3 for 30minutes 2. 125 3 for 30minutes 3. repeat 100 Cycle - Frequency : 10~55Hz - Amplitude : 1.5mm - Direction : X, Y, Z - Sweep Time : 2hours for each axis Drop Drop 10 times on a concrete floor from a height of 100cm Flexure Strength No Mechanical Damage Type 4 Array A(mm) 0.8 B(mm) 0.8 C(mm) 3.0 W(kgf) 0.4 Bending strength The terminal electrode shall be neither break off nor the chip damage
Item Requirements Test Conditions Operating Temperature Range Storage Temperature Range 40 ~ 125 10~40 Max., 70% RH Max. at Packing Condition Solderability Resistance to Soldering heat More than 90% of the terminal electrode shall be covered with new solder 1. No damage such as cracks should be caused in chip element 2. More than 75% of the terminal electrode shall be covered with new solder 3. Impedance shall not change more than 20 % - Preheat Temperature : 100~150 - Preheat Time : 60sec. - Solder Temperature : 245 5 - Soldering Time : 10 1sec. - Preheat Temperature : 100~150 - Preheat Time : 60sec. - Solder Temperature : 270 10 - Soldering Time : 10 0.5sec. Reflow Soldering More than 50% of the terminal electrode shall be covered with new solder - Preheat Temperature : 150 - Preheat Time : 60sec. - Solder Temperature : 245 5 - Soldering Time : 10sec. Max. (Reflow Soldering Profile) High Temperature Resistance - Temperature : 83 2 - Time : 500 12hours - Measurement at room ambient temperature after placing for 24 hours High Temperature Load Resistance 1. No mechanical damage 2. Impedance shall not change more than 20 % - Temperature : 85 3 - Applied Current : Rated Current - Time : 500 12hours - Measurement at room ambient temperature after placing for 24 hours Humidity Resistance - Temperature : 40 2 - Humidity : 90 2% RH - Time : 500 12hours - Measurement at room ambient temperature after placing for 24 hours
Item Requirements Test Conditions Humidity Load Resistance - Temperature : 40 2 - Humidity : 90 2% RH - Applied Current : rated Current - Time : 500 12 hours - Measurement at room ambient temperature after placing for 24 hours Low Temperature Resistance Thermal Shock Vibration 1. No mechanical damage 2. Inductance shall not change more than 20 % - Temperature : 40 3 - Time : 1000 12 hours - Measurement at room ambient temperature after placing for 24 hours 1. 40 3 for 30minutes 2. 85 3 for 30minutes 3. repeat 100 Cycle - Frequency : 10~55Hz - Amplitude : 1.5mm - Direction : X, Y, Z - Sweep Time : 2hours for each axis Drop Drop 10 times on a concrete floor from a height of 100cm Flexure Strength No Mechanical Damage Item 1608 2012 2016 2520 3216 3225 A (mm) 0.7 1.1 1.1 1.2 1.2 1.2 B (mm) 0.7 0.6 0.6 1.0 1.7 1.7 C (mm) 1.1 1.6 2.1 2.5 2.1 3.0 W (kgf) 2.0 4.0 4.0 5.0 1.5 5.0 Bending Strength The terminal electrode shall be neither break off nor the chip damage
Soldering Profile Specifications which provide more details for the proper and safe use described product are available upon request. All specifications are subject to change without notice.
Wire-Wound Power Inductors Wire-Wound Power Inductors Features Metallic materials base provides large saturation current Low DC resistance and High DC biased products. Completely lead-free product and support lead-free solders. Price is low compared to the same products Applications DC-DC converters and Power modules used for the following equipment's. Smartphones, tablet PCs, digital cameras, etc. Shape & Dimensions (Unit : mm) Size L W T B 1608 1.6 0.2 0.8 0.2 1.0 max. 0.45 0.15 2012 2.0 0.2 1.25 0.2 1.0 max. 0.5 0.2 2520 2.5 0.2 2.0 0.2 1.2 max. 0.5 0.2 How to Order(Product Identification) WCC 2520 HP 4R7 M E Measurement Equipments Agilent 4284A (Precision LCR Meter) Agilent 42841A (Bias Current Source) Temperature Range Operating Temp. -40 ~ +105 Storage Temp. -40 ~ +105 (After mounting) WCC : Wire-Wound Power The first two digits : Length(mm) LP : Low DCR type Inductor The last two digits : Width(mm) HP : High Current type 2R2 = 2.2 4R7 = 4.7 100 = 10.0 K : 10% M : 20% N : 30% T : Reel paper packaging E : Reel embossed tape packaging B : Bulk packaging
Characteristics - High Current Type Parts Number Inductance ( H) DC Resistance ( ) Max Saturationcurrent (A)_Idc1 Temperature Rise Current, (A)_Idc2 Typ. Max. Typ. Max. Typ. Max. Measuring frequency (MHz) WCC1608HPR24N 0.24 30% 0.043 0.049 1.80 2.50 1.65 2.30 1 WCC1608HPR47N 0.47 30% 0.090 0.104 1.20 1.50 1.10 1.40 1 WCC1608HPR68N 0.68 30% 0.105 0.120 1.05 1.30 0.95 1.20 1 WCC1608HP1R0M 1.0 20% 0.130 0.150 0.90 1.25 0.80 1.15 1 WCC1608HP1R5M 1.5 20% 0.175 0.200 0.72 1.10 0.65 1.00 1 WCC1608HP2R2M 2.2 20% 0.300 0.345 0.58 0.85 0.52 0.75 1 WCC1608HP3R3M 3.3 20% 0.445 0.512 0.49 0.65 0.45 0.60 1 WCC1608HP4R7M 4.7 20% 0.635 0.730 0.41 0.55 0.37 0.50 1 DC Resistance Saturationcurrent Temperature Rise Measuring Inductance ( ) Parts Number Max (A)_Idc1 Current, (A)_Idc2 frequency ( H) Typ. Max. Typ. Max. Typ. Max. (MHz) WCC2012HPR24N 0.24 30% 0.036 0.041 3.30 2.70 3.00 2.40 1 WCC2012HPR47N 0.47 30% 0.068 0.078 2.20 1.75 2.00 1.65 1 WCC2012HPR68N 0.68 30% 0.078 0.090 1.90 1.70 1.80 1.50 1 WCC2012HP1R0M 1.0 20% 0.092 0.106 1.60 1.55 1.50 1.45 1 WCC2012HP1R5M 1.5 20% 0.150 0.173 1.25 1.20 1.20 1.10 1 WCC2012HP2R2M 2.2 20% 0.250 0.290 1.00 0.95 0.90 0.85 1 WCC2012HP3R3M 3.3 20% 0.435 0.500 0.75 0.70 0.70 0.65 1 WCC2012HP4R7M 4.7 20% 0.535 0.615 0.70 0.65 0.60 0.60 1 Parts Number Inductance ( H) DC Resistance ( ) Max Saturationcurrent (A)_Idc1 Temperature Rise Current, (A)_Idc2 Typ. Max. Typ. Max. Typ. Max. Measuring frequency (MHz) WCC2520HPR24N 0.24 30% 0.020 0.026 5.20 4.75 3.90 3.50 1 WCC2520HPR47N 0.47 30% 0.035 0.042 4.25 3.90 2.90 2.60 1 WCC2520HPR68N 0.68 30% 0.048 0.058 3.55 3.15 2.40 2.15 1 WCC2520HP1R0M 1.0 20% 0.060 0.072 2.60 2.35 2.05 1.85 1 WCC2520HP1R5M 1.5 20% 0.092 0.106 2.25 2.05 1.70 1.50 1 WCC2520HP2R2M 2.2 20% 0.138 0.159 1.95 1.80 1.40 1.25 1 WCC2520HP3R3M 3.3 20% 0.225 0.260 1.60 1.40 1.05 0.97 1 WCC2520HP4R7M 4.7 20% 0.330 0.380 1.30 1.15 0.90 0.80 1 Idc1 is the DC current value having inductance decrease down to 30% Idc2 is the DC current value having temperature increase up to 40
Wire-Wound Power Inductors Characteristics - High Current Type
Chip Common Mode Filters Features Effective for suppressing common mode at high frequency from several MHz to GHz. MV/H suppresses high frequency noise that was unable to be suppressed with existing common mode choke coils. U Suitable for high speed differential transmission line DPS-140408 Applications USB, HDMI, DVI lines of PC, LCD-TV LVDS lines of Note-PC, LCDs MDDI, MIPI, MHL of Mobile phone Dimensions & Land Pattern (Size : mm) Size A B C E P 0605 0.65 0.05 0.50 0.05 0.30 0.05 0.15 0.10 0.12 0.10 0806 0.85 0.05 0.65 0.05 0.40 0.05 0.27 0.10 0.50 0.10 1210 1.00 0.15 1.25 0.15 0.55 0.10 0.30 0.10 0.55 0.10 2010 2.00 0.15 1.0 0.15 0.45 0.10 0.25 0.15 0.50 0.10 Type A B C D 0605 0.40 0.20~0.26 0.27~0.33 0.17~0.23 0806 0.50 0.25~0.35 0.25~0.35 0.25~0.35 1210 0.55 0.25~0.35 0.45~0.55 0.70~0.80 2010 0.50 0.20~0.30 0.50~0.60 0.50~0.60
Chip Common mode Filters How to Order(Product Identification) CMH 0806 G M 900 N2 E Temperature Range Operating Temp. -40 ~ +85 Storage Temp. -40 ~ +85 (After mounting) CMH /CMV : Chip Common The first two digits : Length(mm) Mode Filter The last two digits : Width(mm) T : Reel paper packaging E : Reel embossed tape packaging 900 : 90 121 : 20 N2 : Single N4 : Array Characteristics Parts Number No. of Lines Impedance at 100MHz ( ) DC Resistance ( ) Max. Rated Current [A] Max. Rated Voltage [V] Max. Insulation resistance [M ] Min. CMH0605GM120N2 2 12 5 2.5 0.05 5 100 CMH0605GM350N2 2 35 20% 6.5 0.05 5 100 CMH0605GM600N2 2 60 25% 4.75 0.05 5 100 CMH0605GM900N2 2 90 25% 6.5 0.05 5 100 Parts Number No. of Lines Impedance at 100MHz ( ) DC Resistance ( ) Max. Rated Current [A] Max. Rated Voltage [V] Max. Insulation resistance [M ] Min. CMH0806GM120N2 2 12 5 2.5 0.13 5 100 CMH0806GM330N2 2 33 20% 2.5 0.10 5 100 CMH0806GM470N2 2 47 20% 5.0 0.10 5 100 CMH0806GM900N2 2 90 20% 6.5 0.10 5 100
Characteristics Parts Number No. of Lines Impedance at 100MHz ( ) DC Resistance ( ) Max. Rated Current [A] Max. Rated Voltage [V] Max. Insulation resistance [M ] Min. CMV1210GM400N2 2 40 25% 2.5 0.10 5 100 CMV1210GM900N2 2 90 25% 4.5 0.10 5 100 Parts Number No. of Lines Impedance at 100MHz ( ) DC Resistance ( ) Max. Rated Current [A] Max. Rated Voltage [V] Max. Insulation resistance [M ] Min. CMH2010GM900N4 4 90 4.5 0.10 5 100
Chip Common mode Filters Characteristics
Characteristics
Appendix
SMD Type Packing Reel Packing 4000 pcs(standard) per Reel(option) 10 Reels per Inner BOX 6 Inner BOXES per Out BOX Appendix Mark SIZE A B C D E W 7 REEL 0603~3225 178 2 150Min. 10 0.5 21 0.8 2 0.5 10 1.5 4520~4532 180 00 60 0, 1 13 0.2 57 0 1 3 0.2 13 0.5 13 REEL 1005~3225 330 2 70Min. 13 0.5 21 0.8 2 0.5 10 1.5 Number of Packages Type EIA CODE 7 QT/REEL 13 QT/REEL CS0603 CC0201 15,000 CS1005 CC0402 10,000 50,000 CS1608 CC0603 4,000 16,000 CS2012 CC0805 3,000~4,000 10,000 CS3216 CC1206 2,000~4,000 6,000~10,000 CS3225 CC1210 1,000~3,000 4,000~10,000 CS4520 CC1808 1,500~3,000 - CS4532 CC1812 500~1000 - Tape Dimensions TYPE EIA CODE A B C D E F G H J CS0603 CC0201 0.67 0.05 0.37 0.05 8.0 0.3 3.5 0.005 1.75 0.1 2.0 0.05 2.0 0.1 4.0 0.1 1.5 0.1 CS1005 CC0402 1.15 0.1 0.65 0.1 8.0 0.3 3.5 0.005 1.75 0.1 2.0 0.05 2.0 0.1 4.0 0.1 1.5 0.1 CS1608 CC0603 1.9 0.2 1.10 0.2 8.0 0.3 3.5 0.005 1.75 0.1 4.0 0.1 2.0 0.1 4.0 0.1 1.5 0.1 CS2012 CC0805 2.4 0.2 1.65 0.2 8.0 0.3 3.5 0.005 1.75 0.1 4.0 0.1 2.0 0.1 4.0 0.1 1.5 0.1 CS3216 CC1206 3.6 0.2 2.00 0.2 8.0 0.3 3.5 0.005 1.75 0.1 4.0 0.1 2.0 0.1 4.0 0.1 1.5 0.1 CS3225 CC1210 3.6 0.2 2.80 0.2 8.0 0.3 3.5 0.005 1.75 0.1 4.0 0.1 2.0 0.1 4.0 0.1 1.5 0.1 4.0 0.1 8.0 0.1 CS4520 CC1808 4.8 0.2 2.3 0.2 12.0 0.3 5.5 0.1 1.75 0.1 2.0 0.1 4.0 0.1 1.5 0.1 CS4532 CC1812 4.9 0.2 3.6 0.2 12.0 0.3 5.5 0.1 1.75 0.1 8.0 0.1 2.0 0.1 4.0 0.1 1.5 0.1
SMD Type Packing Typical Performance Characteristics Appendix
Chip B/I Packing Standard Quantity Chip Beads Chip Inductors Chip Power Inductors Appendix Size Q TY(PCS) Remarks Section 1005 10,000 1608 4,000 4,000 0.85 T size 2012 3,000 1.25 T size 3216 4,000 0.60 T size 3,000 3225 3,000 4516 2,000 4532 1,000 Reel Packing A B C 178 2 50 Min. 13 0.5 D E W 4 0.8 2 0.2 9 1.5 Leader & Blank Portion
Chip B/I Packing Tape Dimensions (Unit:mm) Type A 0.1 B 0.1 P 0.1 S 0.1 T(max.) 1005 1.15 0.65 2.0 1.0 0.8 1608 1.80 1.00 4.0 2.0 1.1 2012 2.30 1.55 4.0 2.0 1.1 Chip Beads Chip Inductors Chip Power Inductors Type A 0.1 B 0.1 C 0.1 D 0.1 Section 2.25 1.45 1.50 0.23 2012 1.20 2016 2.50 2.00 1.20 0.22 2520 2.74 2.29 1.14 0.23 3.50 1.85 1.25 0.23 3216 0.73 3225 3.56 2.80 1.25 0.23 4516 4.90 1.90 1.35 0.30 4532 4.85 3.60 1.40 0.30 Appendix
Memo