Typical Applications The HMC62LP / HMC62LPE Wideband LNA is ideal for: Telecom Infrastructure Microwave Radio & VSAT Military EW, ECM & C 3 I Test Instrumentation Fiber Optics Functional Diagram Features Noise Figure: 2. db @ 1 GHz Gain: 13 db P1dB Output Power: +1. dbm @ 1 GHz Self-Biased: +V @ 66mA Ohm Matched Input/Output 2 mm 2 Leadless SMT Package General Description The HMC62LP & HMC62LPE are GaAs MMIC phemt Low Noise Distributed Amplifiers in leadless x mm surface mount packages which operate between 2 and GHz. The self-biased amplifier provides 13 db of gain, 2. to 3. db noise figure and +1. dbm of output power at 1 db gain compression while requiring only 66 ma from a single +V supply. Gain flatness is excellent from 6-1 GHz making the HMC62LP & HMC62LPE ideal for EW, ECM RADAR and test equipment applications. The wideband amplifier I/Os are internally matched to Ohms and are internally DC blocked. Electrical Specifications, T A = +2 C, Vdd= V Parameter Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Units Frequency Range 2-6 6-1 1 - GHz Gain 12 1 11 13 1 12 db Gain Flatness ±. ±. ±. db Gain Variation Over Temperature.1.2.2.3.3. db/ C Noise Figure 3.. 2... 6. db Input Return Loss 1 13 11 db Output Return Loss 12 12 db Output Power for 1 db Compression (P1dB) 12 1 11 1 9 12 dbm Saturated Output Power (Psat) 17 16 1 dbm Output Third Order Intercept (IP3) 26 2 22 dbm Supply Current (Idd) (Vdd= V) 1 66 1 66 1 66 ma 1
Gain & Return Loss RESPONSE (db) 1 1 - -1-1 - -2-3 2 6 1 12 1 16 1 22 S21 S11 S22 Input Return Loss vs. Temperature INPUT RETURN LOSS (db) - -1-1 - -2 Gain vs. Temperature GAIN (db) 16 12 2 6 1 12 1 16 1 22 +2 C + C - C Output Return Loss vs. Temperature OUTPUT RETURN LOSS (db) - -1-1 -3 2 6 1 12 1 16 1 22-2 6 1 12 1 16 1 22 +2 C + C - C +2 C + C - C Reverse Isolation vs. Temperature Noise Figure vs. Temperature 1 REVERSE ISOLATION (db) -1 - -3 - - NOISE FIGURE (db) 6 2-6 2 6 1 12 1 16 1 22 2 6 1 12 1 16 1 22 +2C +C -C +2 C + C - C 2
P1dB vs. Temperature Psat vs. Temperature P1dB (dbm) 17 1 11 2 6 1 12 1 16 1 22 +2 C + C - C Output IP3 vs. Temperature IP3 (dbm) 3 27 2 21 1 1 2 6 1 12 1 16 1 22 Psat (dbm) 17 1 11 2 6 1 12 1 16 1 22 +2 C + C - C Gain, Power, Noise Figure & Supply Current vs. Supply Voltage @ 1 GHz GAIN (db), P1dB (dbm), Noise Figure (db) 22 1 16 1 12 1 6 2.. Vdd (V) 72 7 6 66 6 62 6 6 2 Idd (ma) +2 C + C - C Gain P1dB Noise Figure Idd Absolute Maximum Ratings Typical Supply Current vs. Vdd Drain Bias Voltage (Vdd) +9 Vdc Vdd (V) Idd (ma) RF Input Power (RFIN)(Vdd = + Vdc) +1 dbm Channel Temperature 1 C Continuous Pdiss (T = C) (derate mw/ C above C) Thermal Resistance (channel to ground paddle) 3.2 W 2 C/W Storage Temperature -6 to +1 C +. 66 +. 67 +. 6 +7. 71 +. 72 +. 73 Operating Temperature - to + C ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS 3
Outline Drawing NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS] 3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.. PAD BURR LENGTH SHALL BE.1mm MAXIMUM. PAD BURR HEIGHT SHALL BE.mm MAXIMUM.. PACKAGE WARP SHALL NOT EXCEED.mm. 6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND. 7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED LAND PATTERN. Package Information Part Number Package Body Material Lead Finish MSL Rating Package Marking [3] [1] H62 HMC62LP Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 XXXX [2] H62 HMC62LPE RoHS-compliant Low Stress Injection Molded Plastic 1% matte Sn MSL1 XXXX [1] Max peak reflow temperature of 23 C [2] Max peak reflow temperature of 26 C [3] -Digit lot number XXXX
Pin Descriptions Pin Number Function Description Interface Schematic 1 -, 6 -, 22-29, 31, 32 N/C RFIN 21 RFOUT 3 Vdd No connection. These pins may be connected to RF ground. Performance will not be affected. This pad is AC coupled and matched to Ohms. This pad is AC coupled and matched to Ohms. Power supply voltage for the amplifier. External bypass capacitors are required. Ground Paddle GND Ground paddle must be connected to RF/DC ground.
Evaluation PCB List of Materials for Evaluation PCB 133 [1] Item J1 - J2 J3 C1 C2 C3 U1 PCB [2] Description PCB Mount SMA Connector 2 mm Molex Header 1 pf Capacitor, 2 Pkg. 1 pf Capacitor, 63 Pkg..7 µf Capacitor, Tantalum HMC62LP / HMC62LPE 1971 Evaluation PCB [1] Reference this number when ordering complete evaluation PCB [2] Circuit Board Material: Rogers 3 The circuit board used in the application should use RF circuit design techniques. Signal lines should have Ohm impedance while the package ground leads and package bottom should be connected directly to the ground plane similar to that shown. A sufficient number of via holes should be used to connect the top and bottom ground planes. The evaluation board should be mounted to an appropriate heat sink. The evaluation circuit board shown is available from Hittite upon request. 6