POWER. LGA50D Standard Profile Series Dual O/P Non-isolated 50 A Digital DC/DC Converter. Electrical Specifications. PROPOSED PRODUCT Data Sheet

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POWER PROPOSED PRODUCT Data Sheet Total Current: 50 A (single) 25 A (dual) Input Voltage: 7.5-14 Vdc Variable Output: 0.6-5.0 V (standard profile) LGA50D Standard Profile Series Dual O/P Non-isolated 50 A Digital DC/DC Converter Special features Two-phase design Dual or single output configuration possible High efficiency up to 95.5% Size 1 x 0.5 x 0.48 (JJ) or 0.42"(JSBJ) No minimum load requirement Wide operating temperature range Exceptional power density Analog or digital control Automatic loop compensation IPC9592B compliant @ Vin = 13.2 Vdc Tape and reel packaging Reflow compatible Possible to stack up to 4 for 200 A I-mon and T-mon suported Two (2) variants supported: - Block pin termination - Solder bump termination Two year shelf life SAFETY Designed to meet EN60950-1 and 62368-1 Electrical Specifications Input Input voltage range Max input current 7.5-14 Vdc (0.6 Vo Vo 3.3 Vo) 10-14 Vdc (3.3 Vo < Vo 5.0 Vo) @ 800 KHz 20 A Input capacitor (internal) 28.2 µf Input capacitor (external) minimum 88 µf (See Note 1, Page 2) Input capacitor (external) 208 µf (See Note 1, Page 2) Output Independent output 1 and 2 0.6-1 V 1.8 V 2.5 V 3.3 V 5.0 V Combined output 1 and 2 0.6-1 V 1.8 V 2.5 V 3.3 V 5.0 V Efficiency @ Vin=12 V, Freq=571 KHz & Ta=25 C 1.0 V 1.8 V 2.5 V 3.3 V 5.0 V (Freq = 800Khz) Max output power Output capacitor (external) required LGA50D-01DADJJ LGA50D-01DADJSBJ Min 87.5% 91% 92.5% 93.5% 94% Standard profile 25 A V 22.5 A 20 A 17.5 A 12 A Standard profile 50 A 45 A 40 A 35 A 24 A Standard profile 120 W Nom 88.2% 92.2% 93.7% 94.6% 95.5% 2,200 µf, dual O/P mode Vo1 & Vo2 2,400 µf in single O/P mode (See Note 2, Page 2)

Electrical Specifications (continued) Control and ambient temperatures Operating ambient temperature -40 C to +85 C Storage temperatures -40 C to +125 C Switching frequency 571 KHz @ 0.6 Vo Vo 3.3 Vo 800 KHz @ 3.3 Vo < Vo 5 Vo Note 1: Minimum: 4 x 22 µf/16 V ceramic cap (C2012X6S1C226M125AC or equivalent) Recommended: 1 x 120 µf/16 V polymer caps (APXS160ARA121MH 70G or equivalent) + 4 x 22 µf/16 V ceramic cap (C2012X6S1C226M125AC or equivalent) Note 2: Dual mode (2 outputs): 2 x 680 µf/6.3 V Polymer Tan caps (T530X687M006ATE010 or equivalent) + 8 x 100 µf/6.3 V ceramic caps (GRM32EC80J107ME20L or equivalent) + 4 x 10 µf/10 V ceramic caps (GRM31CR71A106KA01L or equivalent) Single mode (1 output): 2 x 680 µf/6.3 V Polymer Tan caps (T530X687M006ATE010 or equivalent) + 10 x 100 µf/6.3 V ceramic caps (GRM32EC80J107ME20L or equivalent) + 4 x 10 µf/10 V ceramic caps (GRM31CR71A106KA01L or equivalent) Model Numbers Model Number Input Voltage Output Voltage Set Point Output Current Efficiency LGA50D-01DADJJ 7.5-14 Vdc 0.6-5.0 V 50 A max See table LGA50D-01DADJSBJ 7.5-14 Vdc 0.6-5.0 V 50 A max See table Ordering Information Product Family Rated Output Current Performance Input Voltage Number of Outputs Output Type Pin Termination Type Protection Mode RoHS Compliance LGA 50 D - 01 D ADJ Blank, SB Blank J Series Name Digital POL Blank; Latching Rated output current = 50 A 7.5-14.0 V input voltage range Dual Outputs Adjustable output Blank = Standard metal-block SB = Standard solder bump Pb free (RoHS 6/6 compliant)

Block Diagrams Single Unit, Single O/P Configuration Single Unit, Dual O/P Configuration

Block Diagrams Two Units, Single O/P Configuration Pin Assignments Single Output Pin # Function Pin # Function 1 Vin 15 CFG 2 GND 16 Vtrim1 3 PG1 17 VS1+ 4 PG2 18 VS1-5 EN1 19 Vtrim2 6 EN2 20 VS2-7 SYNC 21 VS2+ 8 SHARE 22 Vo1 9 ADDR 23 Vo1 10 SCL 24 GND 11 SDA 25 Vo2 12 SALERT 26 Vo2 13 SGND 27 GND 14 ASCRCFG 28 Vin

Mechanical Drawings Side view of standard profile metal-block pin termination type (LGA50D-01DADJJ) Side view of standard profile solder bump termination type (LGA50D-01DADJSBJ)

Mechanical Drawings For standard metal-block pin termination (LGA50D-01DADJJ) FOOTPRINT DRAWING OF METAL PINS (BOTTOM VIEW) Dimensions are in millimeters Tolerances: Decimal.XX ±0.25

Mechanical Drawings For standard solder bump termination (LGA50D-01DADJSBJ) FOOTPRINT DRAWING OF SOLDER BUMP (BOTTOM VIEW) Dimensions are in millimeters Tolerances: Decimal.XX ±0.25

Mechanical Drawings Proposed solder pad macros for standard solder bump termination (LGA50D-01DADJSBJ). It is adopted for standard metal-block pin termination (LGA50D-01DADJJ) WORLDWIDE OFFICES PROPOSED PAD LAYOUT Dimensions are in millimeters Tolerances: Decimal.XX ±0.25 Dotted line represents LGA50D module outline Americas 2900 S.Diablo Way Tempe, AZ 85282 USA +1 888 412 7832 Europe (UK) Waterfront Business Park Merry Hill, Dudley West Midlands, DY5 1LX United Kingdom +44 (0) 1384 842 211 Asia (HK) 14/F, Lu Plaza 2 Wing Yip Street Kwun Tong, Kowloon Hong Kong +852 2176 3333 www.artesyn.com Artesyn Embedded Technologies, Artesyn and the Artesyn Embedded Technologies logo are trademarks and service marks of Artesyn Embedded Technologies, Inc. All other names and logos referred to are trade names, trademarks, or registered trademarks of their respective owners. Specifications are subject to change without notice. 2019 Artesyn Embedded Technologies, Inc. All rights reserved. For full legal terms and conditions, please visit www.artesyn.com/legal. For more information: www.artesyn.com/power For support: productsupport.ep@artesyn.com LGA50D Standard Profile Series DS 10Jan2019