A unique 3D Silicon Capacitor with outstanding performances in terms of DC leakage and reliability performances. Catherine Bunel R&D Director

A unique 3D Silicon Capacitor with outstanding performances in terms of DC leakage and reliability performances. Catherine Bunel R&D Director

Agenda Introduction Ipdia core technology Application overview The IPDIA 3D Silicon capacitor Performances Reliability Conclusion 27/09/2011 2

Introduction Miniaturization Performances Cost of solutions Miniaturization is a key growth driver Reliability and performance are key considerations for the Medical Customers Satisfaction Need to provide cost effective products 27/09/2011 3

IPDIA Technology Single IPD die A highly efficient way to integrate several passive components such as resistors, capacitors,inductors, ESD diodes in a single die. 27/09/2011 4

PICS process Passive Integration Connecting Substrate Silicon Substrate 3D Capacitor 27/09/2011 5

Ipdia Core Technology C 0 S e S 27/09/2011 6

Ipdia Core Technology This Technology holds the world record in performance with 250nF/mm² in production 27/09/2011 7

Billions of Products using IPDIA technology Automotive Smart card Wireless Oil exploration Military avionic e-metering Pacemaker High Brightness LED protection Medical Sensor Brain stimulation Learning pacing 27/09/2011 8

PICS Amazing miniaturization 25 mm 7 mm After, 1 component 49mm2, h=0.85mm Before 2 active dies+ 100 components PCB=600mm2, h= 2mm 9

PICS Amazing miniaturization 25 mm 7 mm DC feeds Magnification Decoupling, PLL filter PA Tx balun PA matching Transceiver Band Filter Zoom on SIP in HVQFN56 Rx balun 10

PICS Amazing miniaturization E-Pill, temperature sensor Sensor TX WLP module including : 3 active dies flipped over an IPD Substrate 96 SMD components are integrated and composed of RF capacitors, decoupling capacitors, resistors, inductors, and PIN diode µctrl 11

6.45 mm 8 mm PICS Amazing miniaturization SMD & PCB technology 14 mm Complete RF Module 112 mm² 1.6mm height RF Transceiver XO SAW Filter 400MHz & 2.4GHz Matching network with integrated coils Decoupling capacitances 11.2 mm PICS technology Using PICS technology : 40 % area decrease! 25 % height decrease! 72 mm² 1.2mm height 27/09/2011 12

SILICON Capacitors as Pin to Pin replacement of Ceramic and Tantalum Capacitors A breakthrough solution for: 1. High reliability Industries such as Medical, Avionics, Defense etc. 2. High Temperature industries such as Oil and Gaz Explorations, Geothermal energy etc. 250 m 480 m{ 230 m Capacitor array Application PCB 27/09/2011 13

Low Profile Silicon Capacitor (LPSC) Typical 100nF Capacitor Thickness Volume comparison of 1206 Case size capacitors 6 Times smaller More than 2 times smaller 27/09/2011 14

Oustanding performance for High Temperature applications For X7R 402 100nF capacitors the cumulated derating @ 200 C is -77% For 3D Silicon capacitor, it is < 2% Extreme stability Exceptional low derating 15

IPDIA 3D Silicon Capacitors DC Voltage Stability tt 27/09/2011 16

IPDIA 3D Silicon Capacitors Temperature stability Cp (nf) 100 nf, Capacitance Measurements @ 3V On wafer 5 areas 104.0 102.0 100.0 98.0 96.0 94.0 92.0 90.0 88.0 86.0 84.0 PCM1 PCM2 PCM3 PCM4 PCM5 ~50 ppm/ C [85-250 C] 50 100 150 200 250 300 Temperature ( C) 27/09/2011 17

DC leakage current (pa @ 3V) vs Time & Temperature C= 100nF I(120s) < 20pA @ 25 C Ip (A) 5.0E-09 4.5E-09 4.0E-09 3.5E-09 3.0E-09 2.5E-09 2.0E-09 1.5E-09 1.0E-09 5.0E-10 0.0E+00 Ip 85 Ip 200 C Ip 250 C Ip 275 C Ip 300 C 0 20 40 60 80 100 120 Time (s) I(120s) < 2 na @ 300 C 27/09/2011 18

Leakage Current (A) DC leakage current (A),25 C C= 12µF 10,0E-3 1,0E-3 IL(120s) = 55 na IL(120s) = 4 na IL(5v) IL(3,6v) 100,0E-6 10,0E-6 1,0E-6 Ta capacitors 100,0E-9 10,0E-9 1,0E-9 100,0E-12 0 20 40 60 80 100 120 Time (s) 27/09/2011 19

Reliability Failure In Time Predicted MTTF ( yrs) 6,00E+00 450000 5,00E+00 400000 350000 4,00E+00 300000 3,00E+00 250000 200000 2,00E+00 150000 1,00E+00 100000 50000 0,00E+00 X7R Ta PICS 0 X7R Ta PICS Maximum Operating Voltage @ 37 C 50% Operating Voltage @ 85 C 27/09/2011 20

Failure Rate 'ppm' Reliability 600 500 400 Projected Failure Rate in 10 Years 491 The 3D Capacitors have the lowest Failure rate compared to Tantalum & X7R capacitors Only 2 Units failed on a Million after 10 Years operation time 300 200 187 100 0 2 3D-Si Capacitor X7R Tantalum 27/09/2011 21

Conclusion Passive integration technologies bring differentiation and miniaturization IPDIA 3D Silicon Capacitor has many advantages over the other types of capacitors : Very high stability. Withstands temperature up to 300 C Extremely low failure rate.no catastrophic failure.no burning test needed. Very Low leakage. By replacing Ta & MLCC capacitors with Silicon Capacitors, Operating Time could be increased by more than 30. It s also a smart way to reduce the application volume and increase the IP protection level. 27/09/2011 22

We want to continue to make the difference Can t do it alone as an SME IPDiA and its partners launched a 4 year cooperative R&D program

Thanks for your attention 27/09/2011 24