Green 3.W SURFACE MOUNT POWER ENER DIODE Features Mechanical Data 3.W Power Dissipation Case: SMB Ideally Suited for Automated Assembly Case Material: Molded Plastic. UL Flammability Classification 3.3V - 2V Nominal ener Voltage Range Rating 94V- Standard V Tolerance is ± 5% Moisture Sensitivity: Level per J-STD-2 ESD Rating of Class 3 (>6kV) per Human Body Model Copper Alloy Leadframe with Lead-Free Plating (Matte Tin Lead-Free Finish; RoHS Compliant (Notes & 2) Finish). Solderable per MIL-STD-22, Method 28 Halogen and Antimony Free. Green Device (Note 3) Polarity: Cathode Band Weight:.96 grams (Approximate) SMB Top View Bottom View Ordering Information (Note 4) Device* Packaging Shipping SMB59xxB-3 SMB 3,/Tape & Reel *x = Device Voltage, e.g., SMB592B-3. Notes:. EU Directive 22/95/EC (RoHS) & 2/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied. 2. See http:///quality/lead_free.html for more information about Diodes Incorporated s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green products are defined as those which contain <9ppm bromine, <9ppm chlorine (<5ppm total Br + Cl) and <ppm antimony compounds. 4. For packaging details, go to our website at http ///products/packages.html. Marking Information SMB YWW B9xx B9xx = Product Type Marking Code (See Electric Characteristics Table) = Manufacturers Code Marking YWW = Date Code Marking Y = Last Digit of Year (ex: 4 for 24) WW = Week Code ( - 53) of 6 December 24
Maximum Ratings (@T A = +25 C, unless otherwise specified.) Characteristic Symbol Value Unit Forward Voltage @ I F = 2mA V F.5 V ener Current (See Page 3) I M P D / V ma Thermal Characteristics Characteristic Symbol Value Unit Power Dissipation @T L = +75 C 3. W P Derate Above +75 C (Note 5) D 4 mw/ C Thermal Resistance - Junction to Terminal (Note 5) R JT 25 C/W Power Dissipation @T A = +25 C 55 mw P Derate Above +25 C (Note 5) D 4.4 mw/ C Thermal Resistance - Junction to Ambient (Note 5) R JA 226 C/W Operating and Storage Temperature Range T J, T STG -65 to +5 C Note: 5. Device mounted on FR-4 PCB; pad layout as shown on Diodes Inc. suggested pad layout document AP2, which can be found on our website at http://. 2 of 6 December 24
Electrical Characteristics (@T A = +25 C, unless otherwise specified.) Type Number Marking Code ener Voltage Range (Note 6) Test Current Maximum ener Impedance (Note 7) Maximum Reverse Current (Note 6) V @ I T I T T @ I T K @ I K I R @ V R Min (V) Typ (V) Max (V) ma Ω Ω ma µa V ma SMB593B B93 3.3 3.3 3.47 3.6 5 454 SMB594B B94 3.42 3.6 3.78 4.2 9 5 75 46 SMB595B B95 3.7 3.9 4. 96. 7.5 5 25 384 SMB596B B96 4.8 4.3 4.52 87.2 6 5 5 348 SMB597B B97 4.46 4.7 4.94 79.8 5 5 5.5 39 SMB592B B92 5.89 6.2 6.5 6.5 2 2 5 4 24 SMB592B B92 6.46 6.8 7.4 55. 2.5 2 5 5.2 22 SMB5922B B922 7.2 7.5 7.88 5 3 4.5 5 6 2 SMB5923B B923 7.79 8.2 8.6 45.7 3.5 4.5 5 6.5 82 SMB5924B B924 8.64 9. 9.56 4.2 4 5.5 5 7 64 SMB5925B B925 9.5.5 37.5 4.5 5.25 5 8 5 SMB5926B B926.45.55 34. 5.5 55.25 8.4 36 SMB5927B B927.4 2 2.6 3.2 6.5 55.25 9. 25 SMB5928B B928 2.35 3 3.65 28.8 7 55.25 9.9 5 SMB5929B B929 4.25 5 5.75 25 9 6.25.4 SMB593B B93 5.2 6 6.8 23.4 6.25 2.2 93 SMB593B B93 7. 8 8.9 2.8 2 65.25 3.7 83 SMB5932B B932 9 2 2 8.7 4 65.25 5.2 75 SMB5933B B933 2.9 22 23. 7 7.5 65.25 6.7 68 SMB5934B B934 22.8 24 25.2 5.6 9 7.25 8.2 62 SMB5935B B935 25.65 27 28.35 3.9 23 7.25 2.6 55 SMB5936B B936 28.5 3 3.5 2.5 28 75.25 22.8 5 SMB5937B B937 3.35 33 34.65.4 33 8.25 25. 45 SMB5938B B938 34.2 36 37.8.4 38 85.25 27.4 4 SMB5939B B939 37.5 39 4.95 9.6 45 9.25 29.7 38 SMB594B B94 4.85 43 45.5 8.7 53 95.25 32.7 34 SMB594B B94 44.65 47 49.35 8 67.25 35.8 3 SMB5942B B942 48.45 5 53.55 7.3 7.25 38.8 29 SMB5943B B943 53.2 56 58.8 6.7 86 3.25 42.6 26 SMB5944B B944 58.9 62 65. 6 5.25 47. 24 SMB5945B B945 64.6 68 7.4 5.5 2 7.25 5.7 22 SMB5946B B946 7.25 75 78.75 5 4 2.25 56 2 SMB5947B B947 77.9 82 86. 4.6 6 25.25 62.2 8 SMB5948B B948 86.45 9 95.55 4. 2 3.25 69.2 6 SMB5949B B949 95 5 3.7 25 3.25 76 5 SMB595B B95 4.5 5.5 3.4 3 4.25 83.6 3 SMB595B B95 4 2 28 3. 38 45.25 9.2 2 SMB5952B B952 23.5 3 36.5 2.9 45 5.25 98.8 SMB5953B B953 42.5 5 57.5 2.5 6 6.25 4 SMB5954B B954 52 6 68 2.3 7 65.25 2.6 9 SMB5955B B955 7 8 89 2. 9 7.25 36.8 8 SMB5956B B956 9 2 2.9 2 8.25 52 7 Notes: 6. Short duration pulse test used to minimize self-heating effect. 7. ENER IMPEDANCE ( ) DERIVATION T and K are measured by dividing the AC voltage drop across the device by the AC current applied. The specified limits are for I (AC) =. I (DC) with the AC frequency = 6 Hz. I M Max 3 of 6 December 24
, DYNAMIC IMPEDANCE ( ), DYNAMIC IMPEDANCE ( ) I, ENER CURRENT (ma) I, ENER CURRENT (ma) NEW PRODUCT P D, MAXIMUM POWER DISSIPATION (W) TC of V, TEMPERATURE COEFFICIENT OF ENER VOLTAGE (mv/ C) 6 25 5 4 Note 5 2 3 2 T L 5 5 T A 25 5 75 25 5 T A, AMBIENT TEMPERATURE ( C) Figure Power Dissipation vs. Ambient Temperature 5 5 2 V, ENER VOLTAGE (V) Figure 2 Typical Temperature Coefficient of ener Voltage vs. ener Voltage 6.2V 3V 5V 39V 2V. 2 3 4 5 V, ENER VOLTAGE (V) Figure 3 Typical ener Breakdown Characteristics. 5 5 2 25 V, ENER VOLTAGE (V) Figure 4 Typical ener Breakdown Characteristics 2V ma 3.3V ma 3V 2mA V, ENER VOLTAGE (V) Figure 5 Effect of ener Voltage 6.2V. I, ENER TEST CURRENT (ma) Figure 6 Effect of ener Current 4 of 6 December 24
I P, PEAK PULSE CURRENT (%I pp ) P PK, PEAK PULSE POWER (kw) NEW PRODUCT C T, TOTAL CAPACITANCE (pf) I PP, PEAK PULSE CURRENT (%I pp ) 8 6 f = MHz 4 Peak Value I pp 2 8 6 V = V R 5 Half Value I /2 pp 4 V = V R /2 2 V, NOMINAL ENER BREAKDOWN VOLTAGE (V) Figure 7 Typical Total Capacitance vs. Nominal ener Breakdown Voltage t p 8x2 Waveform as defined by R.E.A. 2 4 6 t, TIME ( s) Figure 8 Pulse Waveform Peak Value I pp Half Value I /2 pp 5. t p X Waveform as defined by R.E.A. 2 3 t, TIME (ms) Figure 9 Pulse Waveform... t d, PULSE DURATION (ms) Figure Max. Peak Pulse Power vs. Pulse Duration Package Outline Dimensions Please see AP22 at http:///datasheets/ap22.pdf for the latest version. B A J C D SMB Dim Min Max A 3.3 3.94 B 4.6 4.57 C.96 2.2 D.5.3 E 5. 5.59 G.5.2 H.76.52 J 2. 2.5 All Dimensions in mm H E G 5 of 6 December 24
Suggested Pad Layout Please see AP22 at http:///datasheets/ap22.pdf for the latest version. Y X X G Dimensions Value (in mm) C 4.3 G.8 X 2.5 X 6.8 Y 2.3 C IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which:. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright 24, Diodes Incorporated 6 of 6 December 24