AQ4 Series.5pF, 3A Discrete TVS Diode RoHS Pb GREEN Description The AQ4 components integrate low capacitance steering diodes with one or two avalanche breakdown diodes for unidirectional or bidirectional protection, respectively, to protect against ESD and lightning induced surge events. These components can safely absorb up to 3A per IEC 61-4-5 nd edition (t p =8/μs without performance degradation and a minimum ±3kV ESD per IEC 61-4- International Standard. The low loading capacitance and high surge capability make it ideal for protecting telecommunication ports such as Ethernet and other high speed data interfaces. Pinout Features Pin 1 ESD, IEC 61-4-, ±3kV contact, ±3kV air EFT, IEC 61-4-4, 4A (5/5ns Unidirectional and bidirectional configuration Small SOD33 package fits 85 footprints Lightning, IEC 61-4-5 nd edition, 3A (t P =8/μs Low capacitance of.5pf (@ V R =V Low leakage current of.1μa at 3.3V AEC-Q11 Qualified Moisture Sensitivity Level(MSL -1 Halogen free, lead free and RoHS compliant Pin Functional Block Diagram Applications 1 1 1/1/1 Ethernet Instrumentation T1/E1/T3/E3 Medical Equipment USB 1.1/. CAN Bus protection Power Ports Automotive applications Computers and Peripherals Unidirectional Bidirectional AQ4-1FTG SP4-1FTG AQ4-1FTG-C SP4-1FTG-C Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated.
Lightning Surge Protection- SP4 AQ4 Series Absolute Maximum Ratings Symbol Parameter Value Units Peak Current (t p =8/μs 3 A P Pk Peak Pulse Power (t p =8/μs 735 W T OP Operating Temperature -4 to 15 C T STOR Storage Temperature -55 to 15 C Notes: CAUTION: Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (T OP =5ºC Parameter Symbol Test Conditions Min Typ Max Units Breakdown Voltage V BD I R =ua 3.5 V Reverse Standoff Voltage V RWM I R 1μA 3.3 V Leakage Current I LEAK V R =3.3V.1.5 μa Clamp Voltage 1 V C =1A, t p =8/µs, Fwd 14. V I =1A, t PP =8/µs, Fwd p 6.6 V =3A, t P =8/μs, Fwd 4.5 V Dynamic Resistance R DYN TLP, t P =1ns, I/O to GND.4 Ω ESD Withstand Voltage 1 V ESD IEC 61-4- (Contact Discharge ±3 kv IEC 61-4- (Air Discharge ±3 kv Diode Capacitance 1 C D Reverse Bias=V, f=1mhz.5 pf Note: 1. Parameter is guaranteed by design and/or component characterization.. Transmission Line Pulse (TLP with 1ns width, ns rise time, and average window t1=7ns to t= 9ns 8/μs Pulse Waveform Normalized Capacitance vs. Bias Voltage 11% 1% 1.4 SP4-1FTG-C AQ4-1FTG-C AQ4-1FTG SP4-1FTG 9% 1. Percent of 8% 7% 6% 5% 4% Capacitance 1..8.6 3%.4 % 1% %. 5. 1. 15.. 5. 3. Time (μs....3.6.9 1. 1.5 1.8.1.4.7 3. 3.3 Bias Voltage (V
Temperature TVS Diode Arrays (SPA Diodes Postive Transmission Line Pulsing (TLP Plot Negative Transmission Line Pulsing (TLP Plot TLP Current (A 18 16 14 1 1 8 6 4 3 6 9 1 15 TLP Voltage (V TLP Current (A - -4-6 -8-1 -1-14 -16-18 - -15-1 -9-6 -3 TLP Voltage (V Clamping Voltage vs. 5 Clamp Voltage (V C 15 1 5 5 1 15 5 3 Peak Pulse Current - (A Soldering Parameters Reflow Condition Pre Heat Pb Free assembly - Temperature Min (T s(min 15 C - Temperature Max (T s(max C - Time (min to max (t s 6 18 secs T P T L T S(max Ramp-up t P t L Critical Zone TL to TP Average ramp up rate (Liquidus Temp (T L to peak T S(max to T L - Ramp-up Rate 3 C/second max 3 C/second max T S(min t S Preheat Ramp-down - Temperature (T L (Liquidus 17 C Reflow - Temperature (t L 6 15 seconds Peak Temperature (T P 6 +/-5 C 5 time to peak temperature Time Time within 5 C of actual peak Temperature (t p 4 seconds Ramp-down Rate 6 C/second max Time 5 C to peak Temperature (T P 8 minutes Max. Do not exceed 6 C
c. D b TVS Diode Arrays (SPA Diodes Part Marking System Product Characteristics AQ4-1FTG SP4-1FTG Lead Plating Matte tin 3 1 Lead Material Lead Coplanarity Substrate material Copper Alloy.4 inches (.1mm Silicon AQ4-1FTG-C SP4-1FTG-C 3C 1 Body Material Molded Compound UL Recognized compound meeting Flammability flammability rating V- Notes : 1. All dimensions are in millimeters. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. Part Numbering System Automotive Grade TVS Diode Arrays (SPA Diodes Series Number of Channels AQ4 1 F T G C G= Green T= Tape & Reel Package F: SOD33 Blank = Unidirectional C= Bidirectional Ordering Information Part Number Package Marking Min. Order Qty. AQ4-1FTG SOD33 3 3 AQ4-1FTG-C SOD33 3C 3 Package Dimensions -SOD33 E A1 A SOD33 Symbol Millimeters Inches Min Max Min Max A.8 1..31.39 A1..1..4 A.8.9.31.35 E1 A b.5.35.1.14 c.8.15.3.6 L1.45 Recommended Solder Pad.49 1.79 1.14 D 1. 1.4.47.55 E 1.6 1.8.63.71 E1.5.7.98.16 L1.5.4.1.16.8.77 Unit: mm
Embossed Carrier Tape & Reel Specification SOD33 Symbol Millimeters Component Orientation in Tape A 1.46+/-.1 B.9+/-.1 W 8.+.3/-.1 D 1.5+.1 D1.45min/1.15max E1 1.75+/-.1 E - F 3.5+/-.1 P 4.+/-.1 P 4.+/-.1 P1.+/-.5 K 1.5+/-.1 T.54+/-. Pin1 8mm TAPE AND REEL Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics.