N-channel 100 V, Ω typ., 12 A, STripFET VII DeepGATE Power MOSFET in a PowerFLAT 5x6 package. Features. Description. Table 1.

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Transcription:

STL60N10F7 N-channel 100 V, 0.013 Ω typ., 12 A, STripFET VII DeepGATE Power MOSFET in a PowerFLAT 5x6 package Features Datasheet - production data 1 2 3 4 PowerFLAT 5x6 Figure 1. Internal schematic diagram Order code V DS R DS(on) max Ultra low on-resistance 100% avalanche tested Applications Switching applications Description This device is an N-channel Power MOSFET developed using the 7 th generation of STripFET DeepGATE technology, with a new gate structure. The resulting Power MOSFET exhibits the lowest R DS(on) in all packages. I D P TOT STL60N10F7 100 V 0.0165 Ω 12 A 5 W Table 1. Device summary Order code Marking Package Packaging STL60N10F7 60N10F7 PowerFLAT 5x6 Tape and reel May 2013 DocID024453 Rev 2 1/14 This is information on a product in full production. www.st.com 14

Contents STL60N10F7 Contents 1 Electrical ratings............................................ 3 2 Electrical characteristics..................................... 4 3 Test circuits.............................................. 6 4 Package mechanical data..................................... 7 5 Packaging mechanical data.................................. 11 6 Revision history........................................... 13 2/14 DocID024453 Rev 2

STL60N10F7 Electrical ratings 1 Electrical ratings Table 2. Absolute maximum ratings Symbol Parameter Value Unit V DS Drain-source voltage 100 V V GS Gate-source voltage ± 20 V I (1) D Drain current (continuous) at T C = 25 C 60 A I (1) D Drain current (continuous) at T C = 100 C 40 A (2) I D Drain current (continuous) at T pcb = 25 C 12 A (2) I D Drain current (continuous) at T pcb =100 C 9 A I (2)(3) DM Drain current (pulsed) 48 A (1) P TOT Total dissipation at T c = 25 C 72 W (2) P TOT Total dissipation at T pcb = 25 C 5 W T J T stg Operating junction temperature Storage temperature 1. This value is rated according to R thj-c. 2. This value is rated according to R thj-pcb. 3. Pulse width limited by safe operating area. -55 to 175 C Table 3. Thermal resistance Symbol Parameter Value Unit (1) R thj-pcb Thermal resistance junction-pcb 31 C/W R thj-c Thermal resistance junction-case 2.08 C/W 1. When mounted on FR-4 board of 1inch², 2oz Cu, t < 10 sec DocID024453 Rev 2 3/14

Electrical characteristics STL60N10F7 2 Electrical characteristics (T CASE =25 C unless otherwise specified) Table 4. On/off states Symbol Parameter Test conditions Min. Typ. Max. Unit V (BR)DSS I DSS I GSS Drain-source breakdown voltage (V GS = 0) Zero gate voltage drain current (V GS = 0) Gate body leakage current (V DS = 0) I D = 250 µa 100 - V V DS = 100 V V DS = 100 V; T C =125 C - 1 100 µa µa V GS = ±20 V - ±100 na V GS(th) Gate threshold voltage V DS = V GS, I D = 250 µa 2.5 3.5 4.5 V R DS(on) Static drain-source onresistance V GS = 10 V, I D = 6 A 0.013 0.0165 Ω Table 5. Dynamic Symbol Parameter Test conditions Min. Typ. Max. Unit C iss Input capacitance - 1650 - pf C oss Output capacitance V DS =50 V, f=1 MHz, - 360 - pf C rss V GS =0 Reverse transfer capacitance - 25 - pf Q g Total gate charge V DD =50 V, I D = 12 A - 25 - nc Q gs Gate-source charge V GS =10 V - 5.1 - nc Q gd Gate-drain charge Figure 3-12.2 - nc Table 6. Switching times Symbol Parameter Test conditions Min. Typ. Max. Unit t d(on) Turn-on delay time - 15.2 - ns t V DD =50 V, I D = 6 A, r Rise time - 16.8 - ns R G =4.7 Ω, V GS = 10 V t d(off) Turn-off delay time Figure 2-24 - ns t f Fall time - 8 - ns 4/14 DocID024453 Rev 2

STL60N10F7 Electrical characteristics Table 7. Source drain diode Symbol Parameter Test conditions Min Typ. Max Unit I SD Source-drain current - 12 A I (1) SDM Source-drain current (pulsed) - 48 A V (2) SD Forward on voltage I SD = 12 A, V GS =0-1.1 V t rr Reverse recovery time I SD = 12 A, - 44.8 ns Q rr Reverse recovery charge di/dt = 100 A/µs, - 51.5 nc I RRM Reverse recovery current V DD =50 V, T j =150 C - 2.3 A 1. Pulse width limited by safe operating area 2. Pulsed: pulse duration=300 µs, duty cycle 1.5% DocID024453 Rev 2 5/14

Test circuits STL60N10F7 3 Test circuits Figure 2. Switching times test circuit for resistive load Figure 3. Gate charge test circuit VDD VGS VD RG RL D.U.T. 2200 μf 3.3 μf VDD Vi=20V=VGMAX 2200 μf 12V IG=CONST 2.7kΩ 47kΩ 100Ω 100nF D.U.T. 1kΩ VG PW 47kΩ PW 1kΩ AM01468v1 AM01469v1 Figure 4. Test circuit for inductive load switching and diode recovery times Figure 5. Unclamped inductive load test circuit 25 Ω G A D D.U.T. S B A FAST DIODE B A B D L=100μH 3.3 1000 μf μf VDD VD ID L 2200 μf 3.3 μf VDD G RG S Vi D.U.T. AM01470v1 Pw AM01471v1 Figure 6. Unclamped inductive waveform Figure 7. Switching time waveform V(BR)DSS ton toff VD tdon tr tdoff tf ID IDM 0 90% 10% VDS 10% 90% VDD VDD VGS 90% AM01472v1 0 10% AM01473v1 6/14 DocID024453 Rev 2

STL60N10F7 Package mechanical data 4 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. DocID024453 Rev 2 7/14

Package mechanical data STL60N10F7 Table 8. PowerFLAT 5x6 type S-R mechanical data Dim. mm Min. Typ. Max. A 0.80 1.00 A1 0.02 0.05 A2 0.25 b 0.30 0.50 D 5.00 5.20 5.40 E 5.95 6.15 6.35 D2 4.11 4.31 E2 3.50 3.70 e 1.27 L 0.60 0.80 K 1.275 1.575 8/14 DocID024453 Rev 2

STL60N10F7 Package mechanical data Figure 8. PowerFLAT 5x6 type S-R drawing 5 8 Bottom View Pin 1 identification 4 1 Side View 8 5 Pin 1 identification. 1 4 Top View 8231817_Rev.F_Ribbon type S-R DocID024453 Rev 2 9/14

Package mechanical data STL60N10F7 Figure 9. PowerFLAT 5x6 recommended footprint (dimensions are in mm) Footprint 10/14 DocID024453 Rev 2

REF.R0.50 STL60N10F7 Packaging mechanical data 5 Packaging mechanical data Figure 10. PowerFLAT 5x6 tape (a) T (0.30 ±0.05) Do Ø1.55±0.05 Y P 2 2.0±0.1 (I) P 0 4.0±0.1 (II) E1 1.75±0.1 C L Bo (5.30±0.1) D1 Ø1.5 MIN. REF 0.20 F(5.50±0.1)(III) W(12.00±0.3) Y Ko (1.20±0.1) P1(8.00±0.1) Ao(6.30±0.1) SECTION Y-Y (I) Measured from centerline of sprocket hole to centerline of pocket. (II) Cumulative tolerance of 10 sprocket holes is ± 0.20. (III) Measured from centerline of sprocket hole to centerline of pocket. Base and bulk quantity 3000 pcs 8234350_Tape_rev_C Pin 1 identification Figure 11. PowerFLAT 5x6 package orientation in carrier tape. a. All dimensions are in millimeters. DocID024453 Rev 2 11/14

Packaging mechanical data STL60N10F7 Figure 12. PowerFLAT 5x6 reel R0.60 PART NO. 1.90 2.50 W3 11.9/15.4 W2 18.4 (max) R25.00 4.00 ØN 178(±2.0) ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES A 330 (+0/-4.0) 2.50 77 ESD LOGO 06 PS ØA W1 12.4 (+2/-0) 128 R1.10 Ø21.2 2.20 13.00 All dimensions are in millimeters CORE DETAIL 8234350_Reel_rev_C 12/14 DocID024453 Rev 2

STL60N10F7 Revision history 6 Revision history Table 9. Document revision history Date Revision Changes 29-Mar-2013 1 First release. 23-May-2013 2 Document status promoted from target data to production data Modified: V GS(th) values in Table 4 DocID024453 Rev 2 13/14

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