Contents Corporate Principles 3 Organization 4 Milestones 5 Company Information 6 Okayama Technology Center 7 TAZMO Apprecia Formosa Inc. 8 TAZMO Apprecia Electronics (Shanghai) Inc. 9 Products 10 Our company name "Apprecia" is named after "Appreciation" Revision: 2018/03/16 2
Corporate Principles From a Human Perspective With human kindness and outstanding creativity, and through an inexhaustible spirit, to contribute to the creation of an abundant future society - That is Apprecia Technology's management philosophy. As a development corporation, Apprecia Technology is constantly pursuing the leading technology for the good of people. Spirit The unwavering spirit that compels us to pursue every possibility and push through any circumstance without giving up is the spirit of Apprecia Technology that supports our growth as a corporation. The creative spirit that is always developing new products through technical innovation and lays the foundation for Apprecia Technology's strength as a corporation that will continue to constantly evolve. We consider the spirit of technology for people that contributes to the prosperity of society and the enrichment of Apprecia Technology's social responsibility as a corporation. 3
Organization Board of Directors President Engineering 1 Engineering 2 Engineering 3 Sales Okayama General Administration and Logistics General Administration TAZMO Apprecia Formosa Inc. Taiwan Subsidiary TAZMO Apprecia Electronics (Shanghai) Inc. China Subsidiary Board of Directors Directors President Toshio Ikeda Senior Managing Director Managing Director Director Director Shigeo Kameyama Shuji Ueda Yasuyuki Sato Rui Mitamura Auditor Auditor Shoji Yamamoto Toshio Ikeda / President 4
Milestones 1991 Aug. Established m FSI Ltd. as FSI International representative in Japan 1999 Jul. Became an exclusive distributor in Japan for the CMP slurry distribution products of BOC Edwards (current Air Liquide Electronics U.S. LP) Built Okayama Technology Center equipped class 10 cleanroom 2000 Sep. Shipped the first MX2000 Slurry Distribution System 2003 Jun. Acquired semiconductor equipment division of Nisso Engineering 2007 Feb. Shipped the first PSYRION Phosphoric Acid Reclaim System Jun. Shipped the first isis 1200J Slurry Distribution System 2007 Sep. Shipped the first NISON Vesper SiN Etching Control System 2008 Jan. Named Apprecia Technology Inc. replacing m FSI 2009 Jul. Established TAZMO Apprecia Formosa Inc. (formerly Apprecia Formosa Inc.) in Taiwan 2010 May Shipped the first TIGRIS 200 Cassetteless Wet Station Oct. Shipped the first TIGRIS 300 Cassetteless Wet Station 2011 Nov. Established TAZMO Apprecia Electronics(Shanghai)Inc. (formerly Apprecia Electronics (Shanghai) Inc.) in China 2013 Jan. Joined TAZMO group 2014 Dec. Merged TAZMO Taiwan with Apprecia Formosa Inc. Started distribution of the TAZMO products and maintenance service 2015 Apr. Delivered large capacity PSYRION System to a major device manufacturer 2016 Mar. Released the VAP200 /VAP300 Lift Off Systems 5
Company Information Company Name Head Office Okayama Technology Center Yokkaichi Support Center Apprecia Technology Inc. Ichigo Takadanobaba Building 5F, 1-29-8 Takadanobaba, Shinjuku-ku, Tokyo 169-0075, Japan Tel. +81-3-6233-9150 Fax. +81-3-6233-9730 Okayama Research Park, 5311, Haga, Kita-ku, Okayama-shi, Okayama 701-1221, Japan Tel. +81-86-286-9300 Fax. +81-86-286-9400 3-16-803, Kunoshiro-cho, Yokkaichi-shi, Mie 510-0072, Japan Tel.059-337-8337 Foundation 1991/9/1 President Toshio Ikeda Employees 90 Capital Major Business Major Products Major Share Holder Subsidiaries JPY 100 million Sale, Manufacturing and R&D of process technology for Semiconductor Equipments Cleaning / Surface conditioning equipments etc. TAZMO CO.,LTD. TAZMO Apprecia Formosa Inc. TAZMO Apprecia Electronics (Shanghai) Inc. Overseas Network 6
Okayama Technology Center Okayama Technology Center provides semiconductor process development and product demonstration capabilities as well as design/prototyping/verification activities with the latest metrology tools in class 10 / 450m 2 clean room environment. Here we bring the best solutions to customers through the latest value-added technology development (on a daily basis). Address Okayama Research Park, 5311, Haga, Kita-ku, Okayama-shi, Okayama 701-1221 Site Area 8,554m 2 Total Floor Area 3,614m 2 Inspection room Cleanroom (Class 10) Inspection room This is for 300mm-based product demonstration and process development/characterization utilizing a variety of measurement and inspection tools such as particle and film thickness measurement tools. Cleanroom (C10) This class 10 cleanroom is for customer demonstration and process development activities. Research & Development Room This is for product maintenance training class for customers or verification tests for electrical/ control systems. Cleanroom (C1000) This class 1000 cleanroom is for customer demonstration and in-house tests of CMP slurry delivery systems and hardware verification tests for primary Apprecia products. 7
TAZMO Apprecia Formosa Inc. Location 8F-1, No.100, Sec. 1, Jiageng 11th Rd., Zhubei City, Hsingchu County, Taiwan (R.O.C) Foundation July, 2009 Tel. +886-3-550-0141 Fax. +886-3-550-0142 Business Products Sales and Technology Service for Semiconductor equipment Coater, Developer, Bonder, Debonder,, EFEM, Single Cleaning System, Batch Cleaning System, H3PO4 Reclaim System, Employees 25 A variety of remodeling work for cleaning system Site Office / Taichung City and Tainan City Sales Branch 8
TAZMO Apprecia Electronics (Shanghai) Inc. Location Room 316A, Cimic Tower, 800th. Shangcheng Rd., Shanghai City, China Foundation November, 2011 TEL:+86-21-22065398 FAX:+86-21-22065399 Business Products Semiconductor, electronic products and accessories sales and technology service Coater, Developer, Bonder, Debonder, EFEM, Single Cleaning System, Batch Cleaning System, H3PO4 Reclaim System, A variety of remodeling work for cleaning system 9
Products Apprecia Technology offers a variety of clean and etch products including NISON series and PSYRION for semiconductor and wafer manufacturers worldwide. Phosphoric Acid Reclaim System PSYRION H3PO4 life-cycle management is critical due to Si compounds precipitation over time by consecutive SiN etch process. PSYRION provides H3PO4 reclaim capability by removing the Si compounds with Apprecia s unique technology and contribute to environmental measure and COO improvement. SiN Etching Processor NISON 1800 NISON 1800 is highly valued from market as critical high-temp chemical circulation system for SiN etch process. It provides digitized process control for better accuracy. 10
Products Single Wafer Etching/Cleaning System CENOTE CENOTE is a multipurpose single wafer cleaning system with the multiple cup design. It provides high-purity wafer surface cleaning and precise etching by continuously dispensing ultra clean fluid as well as accurate controls of variable chemicals, blending ratios, flow rates and temperatures. A simultaneous treatment on both sides of wafer prevents backside contamination and enables to skip post-treatment processes for backside of the wafer. The continuous processing at each cup with the multipule cup design provides high throughput. The processing modules for acid chemicals, base chemicals and organic solvents are available and its configuration can be flexibly designed in accordance with customers needs. CENOTE can be configured with the atomized spray, the ultrasonic spray etc. and is compatible with wide range of wafer diameters such as 3-inch to 12-inch. Lift Off System VAP200 /VAP300 VAP200 /VAP300 system has an unique process design with the batch immersion cleaning modules and the single wafer cleaning modules and is suitable for stripping of photoresists and other films. A combination of batch cleaning at the immersion tanks and precision cleaning at the single wafer processing chambers enables efficient tact time and clean strip processing. It also provides high temperature chemical processing and high pressure spray processing. An explosionproof design which is compatible with variable organic solvents is available and enables efficient cleaning processing with intermediate rinse with the isopropyl alcohol (IPA) etc. VAP200 /VAP300 is compatible with wide range of wafer diameters such as 4-inch to 12-inch. Batch Immersion Etching/Cleaning System TIGRIS /CIMANTO TIGRIS 300 and TIGRIS 200 are high-performance batch type 200mm/300mm immersion cleaning and etching system, added our original technology to specifications of the industrystandard. Process management using variety of monitors realizes high quality process. In addition, NISON VESPER or PSYRION, phosphoric acid reclaiming system which are environmental friendly and achieve reduction of chemical usage, both systems can be combined as an option. Further, to meet a wide range of needs, its process module can be lay out flexibly. CIMANTO is the lineup for Si wafer production, and/or wafers under 8 ". 11