45.00±0.25 GHz BGA SOCKET - direct mount, solderless Features Directly mounts to target PCB (needs tooling holes) with hardware High speed reliable elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid A A Recommended torque = 9 in-lbs ( 700-800 pins) = 10 in-lbs (800-900 pins) TOP VIEW 40.49 24.49±0.25 8.66±0.125 12.5 6.350±0.125 Customer's target PCB SECTION A-A Customer's BGA IC 34.725±0.125 backing plate Description: SG-BGA socket for 27X27mm, 0.8/1.0mm 33x33 array w/ heat sink screw SHEET: 1 OF 6
2.4375* 34.725±0.125 backing plate 33.00±0.125 Socket base 0.80 Typ *Note: BGA pattern is not symmetrical with respect to the mounting holes. 4X 1.7000 THRU ALL non plated mounting holes 2X 0.8500 THRU ALL non plated alignment holes 2.0625 12.3225±0.0250 14.8625±0.0350 (x8) 9.7825±0.0250 10.00 9.625 20.00 (x4) 25.60 (x4) Note: Full BGA pattern shown. Please adjust pattern according to individual requirements. Ball guide has a 20.00mm sqr. center pocket. Populate BGA pads within this area as needed. Description: Recommended PCB layout Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask. SHEET: 2 OF 6 SCALE: 3:1
Ball guide has a 20.00mm sqr. center pocket. Populate BGA balls within this area as needed. 27.00 A1 20.4 6.8 B 0.9620 25.60 (x4) 20.00 6.7 9.1 27.00 10.2 2.0 10.3 0.80 A underfill 4.4 0.30 Min 1. 2. Dimensions are in millimeters. Interpret dimensions and tolerances per ASME Y14.5M-1994. 0.86 2.23 C 0.50±0.05 0.25 M A B C 0.10 M C 3. 4. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane C. Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5. Parallelism measurement shall exclude any effect of mark on top surface of package. Description: BGA 27x27mm SHEET: 3 OF 6 SCALE: 3:1
19 18 16 14 15 5 2 3 17 11 8 10 ITEM NO. Description Material 1 Ghz Socket Base, 23mm IC 7075-T6 Aluminum Alloy 2 Socket Lid, 32.225 X 32.225 7075-T6 Aluminum Alloy 3 Compression Plate, 27mm IC cannes 2.5 7075-T6 Aluminum Alloy 4 Backing Plate 27mm IC 5 post 7075-T6 Aluminum Alloy 5 Compression Screw 7075-T6 Aluminum Alloy 6 Elastomer Guide 27mm IC Ultem 1000/ Cirlex 7 Dowel Pin, 1/32" x 3/16", SS Chrome Stainless Steel 8 #0-80 X.375 LG, SOC HD CAP SCREW, ALLOY STL, BLK OXIDE Alloy Steel 9 Elastomer 0.75mm thick 40 Micron gold plated filaments arranged symmetrically in a silicone rubber( 63.5 degree angle) 20 Micron dia gold plated brass filaments arranged symettrically in a silicon rubber (63.5 degree angle) 10 #0-80 Shoulder Screw, 0.090" thread length Stainless Steel (303) 11 BGA IC 27X27mm, 0.8mm 33x33 array Material <not specified> 12 Target PCB 27X27mm, 0.8mm 33x33 array FR4 Standard 13 Ball guide for 27X27mm, 0.8mm 33x33 array Kapton Polyimide/Cirlex 14 Torquing bracket, 32mm hole centers, 5mm hex 7075-T6 Alumium Alloy 15 16 Fan 40X10MM 5VDC 0.9W 7.0CFM 27 DBA 2 wire Screw, M3 x 0.5mm, 25mm lg, Low Head Cap, SS Plastic UL: 94V-0 Stainless Steel (18-8) 17 Gap Pad Vo ultimate, 0.02" thick Gap Pad VO Ultimate 18 Connector Housing 3 pos 0.100" crimp PBTP 19 Connector socket pin 26-28AWG.100" tin plating Phosphor bronze 10% D, UNS C52400 1 7 29.725 5.00 (x4) 0-80 UNF THRU ALL (x4) 13 5.00 (x4) 9 BACKING PLATE 6 34.725 3.00 4x 90 12 4 Description: Skt, Insulation Plate, Pin Det R3.17 (x4) 4x 5.00 2.35 6.35 SHEET: 4 OF 6
C 20.00 B B 27.325 Socket Base Pocket Ball Guide View 1 SECTION B-B SCALE 8 : 1 Compression Plate A1 Feature DETAIL C SCALE 4 : 1 Description: Socket(2) SHEET: 5 OF 6
E 26.90 1.24 D D 14.2 2.75 2.30 14.2 7.40 4.50 R1.6 E Compression Plate Bottom View SECTION E-E SCALE 2 : 1 SECTION D-D SCALE 2 : 1 Description: Compression plate SHEET: 6 OF 6