Enhancement Mode N-Channel Power MOSFET

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Transcription:

SFG170N10xF_Datasheet Enhancement Mode N-Channel Power MOSFET Features Low RDS(on) & FOM Extremely low switching loss Excellent stability and uniformity Fast switching and soft recovery Applications Consumer electronic power supply Motor control Synchronous-rectification Isolated DC/DC convertor Invertors

General Description SFG170N10xF use advanced SFGMOS TM technology to provide low R DS(ON), low gate charge, fast switching and excellent avalanche characteristics. This device is specially designed to get better ruggedness and suitable to use in motor control applications. V DS, min, pulse R DS(ON), max @ VGS=10 V Q g V 510 A 3 mω 114.5 nc Schematic and Package Information SCHEMATIC DIAGRAM PIN ASSIGNMENT TOP VIEW TO220 SFG170N10PF TO263 SFG170N10KF Absolute Maximum Ratings at T j=25 unless otherwise noted Parameter Symbol Value Unit Drain source voltage V DS V Gate source voltage V GS ±20 V Continuous drain current 1) 170 A Pulsed drain current 2), pulse 510 A Power dissipation 3) P D 340 W Single pulsed avalanche energy 4) E AS 540 mj Operation and storage temperature T stg,t j -55 to 150 Oriental Semiconductor Copyright reserved 2018 2 / 10

Thermal Characteristics Parameter Symbol Value Unit Thermal resistance, junction-case R θjc 0.37 /W Thermal resistance, junction-ambient 5) R θja 62 /W Electrical Characteristics at T j=25 unless otherwise specified Parameter Symbol Min. Typ. Max. Unit Test condition Drain-source breakdown voltage BV DSS V V GS=0 V, =250 μa Gate threshold voltage V GS(th) 2.0 4.0 V V DS=V GS, =250 μa Drain-source on-state resistance R DS(ON) 2.8 3.0 mω V GS=10 V, =30 A Gate-source leakage current I GSS V GS=20 V na - V GS=-20 V Drain-source leakage current SS 1 μa V DS= V, V GS=0 V Dynamic Characteristics Parameter Symbol Min. Typ. Max. Unit Test condition Input capacitance C iss 9644.2 pf Output capacitance C oss 1300.4 pf Reverse transfer capacitance C rss 24.6 pf Turn-on delay time t d(on) 43.7 ns Rise time t r 19.7 ns Turn-off delay time t d(off) 102.3 ns Fall time t f 22.5 ns V GS=0 V, V DS=50 V, ƒ= khz V GS=10 V, V DS=50 V, R G=2 Ω, =20 A Oriental Semiconductor Copyright reserved 2018 3 / 10

Gate Charge Characteristics Parameter Symbol Min. Typ. Max. Unit Test condition Total gate charge Q g 114.5 nc Gate-source charge Q gs 34.8 nc Gate-drain charge Q gd 23.2 nc Gate plateau voltage V plateau 4.6 V =20 A, V DS=50 V, V GS=10 V Body Diode Characteristics Parameter Symbol Min. Typ. Max. Unit Test condition Diode forward current I S 170 Pulsed source current I SP 510 A V GS<V th Diode forward voltage V SD 1.3 V I S=30 A, V GS=0 V Reverse recovery time t rr 105 ns Reverse recovery charge Q rr 414.7 nc Peak reverse recovery current I rrm 6.6 A I S=20 A, di/dt= A/μs Note 1) Calculated continuous current based on maximum allowable junction temperature. 2) Repetitive rating; pulse width limited by max. junction temperature. 3) Pd is based on max. junction temperature, using junction-case thermal resistance. 4) V DD=50 V, R G=50 Ω, L=0.3 mh, starting T j=25. 5) The value of R θja is measured with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with T a=25. Oriental Semiconductor Copyright reserved 2018 4 / 10

Electrical Characteristics Diagrams 300 0 T j = 25 V DS = 10 V, Drain current (A) 250 200 150 10 V 6.5 V 6 V 5.5 V, Drain current(a) 10 T j = 25 1 50 V GS = 5 V 0 0 1 2 3 4 5 V DS, Drain-source voltage (V) 0.1 2 4 6 8 10 V GS, Gate-source voltage(v) Figure 1, Typ. output characteristics Figure 2, Typ. transfer characteristics 10 5 f = khz 10.0 = 20 A C, Capacitance (pf) 10 4 10 3 10 2 V GS = 0 V C iss C oss V GS, Gate-source voltage(v) 7.5 5.0 2.5 V DS = 50 V C rss 10 1 0 20 40 60 80 V DS, Drain-source voltage (V) 0.0 0 30 60 90 120 Q g, Gate charge(nc) Figure 3, Typ. capacitances Figure 4, Typ. gate charge 120 6.0m BV DSS, Drain-source breakdown voltage (V) 115 110 105 95 = 250 μa V GS = 0 V -50 0 50 150 R DS(ON), On-resistance(Ω) 5.0m 4.0m 3.0m 2.0m 1.0m = 30 A V GS = 10 V -50 0 50 150 T j, Junction temperature ( ) T j, Junction Temperature ( ) Figure 5, Drain-source breakdown voltage Figure 6, Drain-source on-state resistance Oriental Semiconductor Copyright reserved 2018 5 / 10

T j = 25 40.0m I S, Source current (A) 10 1 R DS(ON), On-resistance(Ω) 30.0m 20.0m 10.0m V GS =5 V 5.5 V 6 V 0.6 0.9 1.2 1.5 V SD, Source-Drain voltage (V) 0.0 50 150 200 250 300, Drain current(a) 10 V Figure 7, Forward characteristic of body diode Figure 8, Drain-source on-state resistance 180 0, Drain current (A) 150 120 90 60, Drain current(a) 10 1 R DS(ON) Limited 10 μs μs 1 ms 10 ms DC 30 0.1 0 0 20 40 60 80 120 140 T C, Case Temperature ( ) 0.01 0.01 0.1 1 10 V DS, Drain-source voltage(v) Figure 9, Drain current Figure 10, Safe operation area T C=25 Oriental Semiconductor Copyright reserved 2018 6 / 10

Test circuits and waveforms Figure 1, Gate charge test circuit & waveform Figure 2, Switching time test circuit & waveforms Figure 3, Unclamped inductive switching (UIS) test circuit & waveforms Figure 4, Diode reverse recovery test circuit & waveforms Oriental Semiconductor Copyright reserved 2018 7 / 10

Package Information Figure1, TO220 package outline dimension SYMBOL mm MIN NOM MAX A 4.37 4.57 4.70 A1 1.25 1.30 1.40 A2 2.20 2.40 2.60 b 0.70 0.80 0.95 b2 1.17 1.27 1.47 c 0.45 0.50 0.60 D 15.10 15.60 16.10 D1 8.80 9.10 9.40 D2 5.50 - - E 9.70 10.00 10.30 E3 7.00 - - e e1 H1 6.25 2.54 BSC 5.08 BSC 6.50 6.85 L 12.75 13.50 13.80 L1-3.10 3.40 ΦP 3.40 3.60 3.80 Q 2.60 2.80 3.00 Oriental Semiconductor Copyright reserved 2018 8 / 10

Package Information Figure2, TO263 package outline dimension SYMBOL mm MIN NOM MAX A 4.37 4.57 4.77 A1 1.22 1.27 1.42 A2 2.49 2.69 2.89 A3 0.00 0.13 0.25 b 0.70 0.81 0.96 b1 1.17 1.27 1.47 c 0.30 0.38 0.53 D1 8.50 8.70 8.90 D4 6.60 - - E 9.86 10.16 10.36 E5 7.06 - - e H 14.70 2.54 BSC 15.10 15.50 H2 1.07 1.27 1.47 L 2.00 2.30 2.60 L1 1.40 1.55 1.70 L4 0.25 BSC Oriental Semiconductor Copyright reserved 2018 9 / 10

Ordering Information Package Units/Tube Tubes/Inner Box Units/Inner Box Inner Box/Carton Box Units/Carton Box TO220 50 20 0 6 6000 Package Units/Reel Reels/Inner Box Units/Inner Box Inner Box/Carton Box Units/Carton Box TO263 800 1 800 5 4000 Product Information Product Package Pb Free RoHS Halogen Free SGF170N10PF TO220 yes yes yes SGF170N10KF TO263 yes yes yes Oriental Semiconductor Copyright reserved 2018 10 / 10