Low-Jitter, 8kHz Reference Clock Synthesizer Outputs MHz

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19-3530; Rev 0; 1/05 Low-Jitter, 8kHz Reference General Description The low-cost, high-performance clock synthesizer with an 8kHz input reference clock provides six buffered LVTTL clock outputs at 35.328MHz. The clock synthesizer can be used to generate the clocks for systems using T1, E1, T3, E3, and xdsl. The features a phase-lock loop (PLL) that uses a voltage-controlled crystal oscillator (VCXO). The internal PLL phase locks the external crystal (35.328MHz) to the 8kHz input reference clock. In addition, this device generates a jitter-suppressed output that provides a better source for the reference clock relay. The is available in a 24-pin TSSOP package and operates over the extended operating temperature range of -40 C to +85 C and a single +3V to +3.V power-supply range. For using lower value external crystals, refer to the MAX948 data sheet. Features 8kHz Input-Reference CLK 4ps RMS (typ) Output Jitter High-Jitter Rejection on the Reference CLK Synthesizer Locks to the 8kHz Reference with a ±100ppm Range Output Frequency: 35.328MHz Six Buffered LVTTL Low-Jitter Outputs One 8kHz Reference CLK Relay Output +3.3V Supply Operation 24-Pin TSSOP Package Applications Telecom Equipment Using T1, E1, T3, E3, and ISDN Protocols xdsl Equipment in CO with Interface to the Telecom Protocols PART Ordering Information TEMP RANGE PIN- PACKAGE PKG CODE EUG -40 C to +85 C 24 TSSOP U24-1 Pin Configuration Typical Application Circuit TOP VIEW SHDN 1 24 CLK1 R 1 C 1 REO 2 23 REIN 3 22 CLK2 C 2 P 4 21 LP1 LP2 X1 X2 P 5 20 CLK3 P X1 19 SETI CLK1 X2 7 8 18 17 CLK4 R SET CLK2 CLK3 9 1 P CLK4 LP2 LP1 10 11 15 14 CLK5 SHDN CLK5 CLK SETI 12 13 CLK REIN REO TSSOP Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-29-442, or visit Maxim s website at www.maxim-ic.com.

ABSOLUTE MAXIMUM RATINGS to...-0.3v to +4.0V P to P...-0.3V to +4.0V SHDN, REO, REIN, X1, X2, CLK_ to...-0.3v to ( + 0.3V) LP1, SETI to P...-0.3V to ( + 0.3V) LP2 Internally Connected to P Short-Circuit Duration of Outputs...Continuous Continuous Power Dissipation (T A = +70 C) 24-Pin TSSOP (derate 12.2mW/ C above +70 C)...97mW Operating Temperature Range...-40 C to +85 C Maximum Junction Temperature...+150 C Storage Temperature Range...-0 C to +150 C ESD Rating (Human Body Model)...±2kV Lead Temperature (soldering, 10s)...+300 C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS ( = P = +3.0V to +3.V, T A = -40 C to +85 C, unless otherwise noted. Typical values are at = P = +3.3V, T A = +25 C.) (Note 1) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS DIGITAL INPUTS (REIN, SHDN) Input-High Logic Level V IH 2.0 V Input-Low Logic Level V IL 0.8 V Input-Current High Level I IH V IN = 20 µa Input-Current Low Level I IL V IN = 0-20 µa DIGITAL OUTPUT CLOCKS (CLK1 CLK, REO) Output-High Logic Level V OH I OH = -4mA - 0.V V Output-Low Logic Level V OL I OL = 4mA 0.4 V POWER SUPPLY (, P ) Power-Supply Range 3.0 3. V PLL Power-Supply Range P 3.0 3. V Power-Supply Current I DD + I DDP (Note 2) 9 1 ma Shutdown Supply Current I SHDN 7.5 30 µa 2

AC ELECTRICAL CHARACTERISTICS ( = P = +3.0V to +3.V, C L = 20pF, T A = -40 C to +85 C, unless otherwise noted. Typical values are at = P = +3.3V, T A = +25 C.) (Note 3) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS DIGITAL OUTPUT CLOCKS (CLK1 CLK) Frequency Range f OUT 35.328 MHz Clock Rise Time t R1 20% to 80% 1.8 ns Clock Fall Time t F1 80% to 20% 1.8 ns Duty Cycle 40 50 0 % Period Jitter J P1 Peak-to-peak 83 ps J P2 RMS 4 ps RMS Output Skew t S Peak-to-peak 185 ps REFERENCE CLOCK OUTPUT (REO) Frequency f REF 8 khz Clock Rise Time t R2 1.8 ns Clock Fall Time t F2 1.8 ns Duty Cycle 40 50 0 % VCXO Crystal Frequency f XTL 35.328 MHz Crystal Accuracy Including frequency accuracy and temperature range ±25 ppm VCXO Pulling Range (Note 4) -100 +100 ppm Input Reference CLK Pulse Width t W Measured at high or low states 10 ns Note 1: Specifications are 100% tested at T A = +25 C. Specifications over temperature are guaranteed by design and characterization. Note 2: No load on clock outputs. Note 3: Guaranteed by design. Note 4: Crystal loading capacitance is 14pF. 3

( = P = +3.3V, T A = +25 C, unless otherwise noted.) OUTPUT WAVEFORM 10ns/div toc01 OUTPUT CLOCK JITTER (ps) OUTPUT CLOCK JITTER ( P-P ) vs. TEMPERATURE 150 140 130 120 110 100 90 80 70 0 50 40 30-40 -15 10 35 0 85 TEMPERATURE ( C) Typical Operating Characteristics toc02 OUTPUT CLOCK JITTER (ps) 7 5 4 3 2 1 OUTPUT CLOCK JITTER (RMS) vs. TEMPERATURE 0-40 -15 10 35 0 85 TEMPERATURE ( C) toc03 OUTPUT CLOCK JITTER (ps) 100 90 80 70 0 50 40 OUTPUT CLOCK JITTER ( P-P ) vs. SUPPLY VOLTAGE toc04 OUTPUT CLOCK JITTER (ps) 7 5 4 3 2 1 OUTPUT CLOCK JITTER (RMS) vs. SUPPLY VOLTAGE toc05 OUTPUT FREQUENCY VARIATION (ppm) 125 100 75 50 25 0-25 -50-75 -100 OUTPUT FREQUENCY VARIATION vs. INPUT REFERENCE FREQUENCY CENTERED AT 35.328MHz toc0 30 3.0 3.1 3.2 3.3 3.4 3.5 3. SUPPLY VOLTAGE (V) 0 3.0 3.1 3.2 3.3 3.4 3.5 3. SUPPLY VOLTAGE (V) -125 7.9990 7.9994 7.9998 8.0002 8.000 INPUT REFERENCE FREQUENCY (khz) 8.0010 SUPPLY CURRENT (ma) 14 12 10 8 SUPPLY CURRENT (I DD + I DDP ) vs. SUPPLY VOLTAGE T A = +25 C T A = -40 C T A = +85 C toc07 SUPPLY CURRENT (μa) 12 11 10 9 8 7 SHUTDOWN SUPPLY CURRENT vs. SUPPLY VOLTAGE T A = +25 C T A = +85 C T A = -40 C toc08 4 3.0 3.1 3.2 3.3 3.4 3.5 3. SUPPLY VOLTAGE (V) 5 3.0 3.1 3.2 3.3 3.4 3.5 3. SUPPLY VOLTAGE (V) 4

PIN NAME FUNCTION 1 SHDN Active-Low Shutdown Input 2 REO Reference Clock Output. REO is an 8kHz reference clock output with jitter suppression. 3 REIN Reference Input 4 P Phase-Lock Loop (PLL) Power Supply. Bypass P with 0.1µF and 0.001µF capacitors to P. 5 P PLL Ground X1 Crystal Input 1. Connect X1 to a fundamental mode crystal for the VCXO. 7, 1, 19, 21 Digital Power Supply. Bypass with 0.1µF and 0.001µF capacitors to. 8 X2 Crystal Input 2. Connect X2 to a fundamental mode crystal for the VCXO. 9, 14, 18, 23 10 LP2 11 LP1 12 SETI Ground External Filter 2. Connect the loop filter capacitors and a resistor between LP1 and LP2 (see the Typical Application Circuit). LP2 is internally connected to P. External Filter 1. Connect the loop filter capacitors and a resistor between LP1 and LP2 (see the Typical Application Circuit). Charge-Pump Current-Setting Input. Connect a resistor from SETI to P to set PLL charge-pump current (see the Detailed Description section). 13 CLK Clock Output at 35.328MHz 15 CLK5 Clock Output 5 at 35.328MHz 17 CLK4 Clock Output 4 at 35.328MHz 20 CLK3 Clock Output 3 at 35.328MHz 22 CLK2 Clock Output 2 at 35.328MHz 24 CLK1 Clock Output 1 at 35.328MHz Pin Description 5

SETI REIN LP1 /441 LP2 PHASE DETECTOR AND CHARGE PUMP Functional Diagram X1 X2 P P CLK1 CLK2 VCXO CLK3 PLL CLK4 CLK5 of the reference CLK. However, if in a three-cycle time window the monitor counts two or three transitions, it considers the input reference clock as present. When the monitor detects the absence of the 8kHz reference clock, the outputs are operating at the center frequency of the crystal oscillator. However, when the monitor detects the return of the reference clock, the PLL locks to the reference clock. The ratio between the external crystal and the input reference clock is 441. Clock Outputs (CLK1 to CLK) and REO The uses a 35.328MHz crystal and a reference clock (REIN) to generate six identical outputs, CLK1 to CLK, at 35.328MHz. All CLK_ outputs are LVTTL with a typical skew of 185ps. The also regenerates the 8kHz reference CLK at REO output. SHDN REFERENCE CLK MONITOR Detailed Description The is a high-performance clock synthesizer with an 8kHz input reference clock. This device generates six identical buffered LVTTL clock outputs at 35.328MHz. The internal PLL phase locks the external crystal (35.328MHz) to the 8kHz input reference clock. This device features a low-jitter output that provides a better source for the reference clock relay (see the Functional Diagram). Power-Up At power-up, all the outputs are disabled and pulled low (to ) for at least 25ms. After 25ms, the crystal oscillator starts oscillation. If the reference clock is not present at power-up, the outputs are forced to the center frequency of the crystal oscillator. Reference CLK Monitor The features internal clock (CLK) monitor circuitry to detect the presence of the external 8kHz reference clock. The internal CLK monitor continuously monitors the number of low-to-high transitions within a three-cycle (at 8kHz) time window. If the transition number is less than two, the internal CLK monitor states loss CLK REO Voltage-Controlled Crystal Oscillator (VCXO) The s internal VCXO takes an external 35.328MHz crystal as the base frequency and has a pulling range of approximately ±100ppm. This configuration also makes the VCXO PLL become a narrowband filter to reject high-frequency jitter on the input reference and eliminate it from the REO and CLK_ outputs. SHDN Mode The features a shutdown mode with a supply current of 7.5µA (typ). Drive SHDN low to get the device into shutdown mode. In this mode, all the outputs go low and the PLL is powered down. After SHDN goes high, the outputs still stay low for an additional 25ms to allow the PLL to be stabilized before the outputs are enabled again. Applications Information Crystal Selection The uses a 35.328MHz crystal as the base frequency for the VCXO. It is important to use a correct type of quartz crystal to avoid reducing frequency pulling range, or excessive output phase jitter. Choose an AT-cut crystal that oscillates at 35.328MHz on its fundamental mode with a variation of ±25ppm including frequency accuracy and operating temperature range. The crystal s load capacitance should be 14pF. Pulling range may vary depending on the crystal used. Refer to the evaluation kit for details.

PLL Loop Filter The PLL contains an integrated VCXO that uses an external crystal to track the input reference signal and attenuate input jitter. Figure 1 shows the external loop filter of the PLL containing resistor R1 and two capacitors, C1 and C2. This loop filter is connected between LP1 and LP2 as shown in the Typical Operating Circuit. The loop-filter bandwidth is determined by C1, C2, R1, and R SET where R SET is used to set the value of the charge-pump current. The typical values of C1, C2, R1, and R SET are 22nF, 50pF, 1000kΩ, and 13kΩ, respectively. Use the following equation to calculate a PLL loop bandwidth in Hz: BW = (R1 x I SETI x 1405) / N where R1 (Ω) is the resistor in the PLL loop filter (Figure 1), I SETI (A) is the charge-pump current calculated from the equation in the Charge-Pump Current Setting section, and N is the crystal PLL frequency divider equal to 441. The loop-damping factor is calculated by: R I C DampingFactor = 1 8832 SETI 1 2 N where C1 (F) and R1 (Ω) are the values of the capacitor and the resistor in the PLL loop filter shown in Figure 1; I SETI is calculated as shown in the Charge- Pump Current Setting section and N = 441. The following equation shows the relationship between components C1 and C2 in the loop filter: C2 C1 / 20 Charge-Pump Current Setting The also allows external setting of the chargepump current in the PLL. Connect a resistor from SETI to P to set the PLL charge-pump current: Charge-Pump Current = 2.4 x 1000 / (R SET (kω) + 1) where R SET is in kω and the value of the charge-pump current is in µa. The loop response can be adjusted to meet individual application requirements since the charge-pump current and all the filter components for the VCXO loop can be set externally. Board Layout and Bypassing The s high oscillator frequency makes proper layout important to ensure stability. For best performance, place components as close as possible to the device. Digital or AC transient signals on can create noise at the clock outputs. Return to the highest quality ground available. Bypass and P with 0.1µF and 0.001µF capacitors, placed as close to the device as possible. Careful PC board ground layout minimizes crosstalk between the outputs and digital inputs. Traces must be as short as possible on LP1 and LP2 and connect the capacitors and the resistor as close as possible to the device. Chip Information TRANSISTOR COUNT: 7512 PROCESS: CMOS LP1 LP2 C2 Figure 1. Typical Loop Filter R1 C1 7

Package Information (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.) TSSOP4.40mm.EPS PACKAGE OUTLINE, TSSOP 4.40mm BODY 1 21-00 G 1 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. 8 Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 9408 408-737-700 2005 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products, Inc.