Applications. Tape and Reel Device Qualification Packaging AL5802LP4 Commercial X2-DFN ,000/Tape & Reel -7

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Description The combines a high-gain NPN transistor with a pre-biased NPN transistor to make a simple small footprint LED driver. 30V, ADJUSTABLE CURRENT SINK LINEAR LED DRIVER Pin Assignments The LED current is set by an external resistor connected from R EXT Pin (2) to GND Pin (1). The internal high-gain transistor develops approximately 0.6V across the external resistor. The s open-collector output can operate from 0.8V to 30V making it suitable for industry standard 5V to 24V power supplies without additional components. PWM dimming of the LED current can be achieved by either driving the BIAS Pin (4) with a low impedance voltage source, or driving the EN Pin (6) with an external open-collector NPN transistor or open-drain N-Channel MOSFET. The is available in a X2-DFN1310-6 package and is ideal for driving up to 120mA current. Features Reference Voltage V REXT = 0.65V -40 to +125 C Temperature Range 0.8V to 30V Open-Collector Output Negative Temperature Co-Efficient Automatically Reduces the LED Current at High Temperatures Low Thermal Impedance, Small Footprint X2-DFN1310-6 Package with Exposed Pads Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. Green Device (Note 3) Mechanical Data Case: X2-DFN1310-6 Case Material: Molded Plastic, Green Molding Compound. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminals: NiPdAu (Lead-Free) Plating. Solderable per MIL-STD-202, Method 208 e4 Weight: 0.0013 grams Applications Internal Schematic (Top View) Linear LED Driver LED Signs Offline LED Luminaries (Bottom View) Ordering Information (Note 8) Tape and Reel Device Qualification Packaging Quantity Part Number Suffix Commercial X2-DFN1310-6 3,000/Tape & Reel -7 Note: 8. For packaging details, go to our website at http:///products/packages.html. Marking Information 802 = Product Type Marking Code Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See http:///quality/lead_free.html for more information about Diodes Incorporated s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 1 of 10

Typical Application Circuit Pin Descriptions Pin Number Name Function 1 GND Ground Reference Point for Setting LED Current 2 R EXT Current Sense Pin LED current sensing resistor should be connected from here to GND 3 OUT Open-Collector LED Driver Output 4 BIAS Biases the Open Collector Output Transistor 5 N/C No Connection 6 EN Enable Pin for PWM Dimming Provides access to the base of Q2 and collector of Q1 Functional Block Diagram Figure 1 Block Diagram 2 of 10

Absolute Maximum Ratings Symbol Characteristics Values Unit V OUT Output Voltage Relative to GND 30 V V BIAS BIAS Voltage Relative to GND 30 V V FB LED Voltage Relative to GND 6 V V EN EN Voltage Relative to GND 6 V V REXT REXT Voltage Relative to GND 6 V I OUT Output Current 120 ma T J Operating Junction Temperature -40 to +150 C T ST Storage Temperature -55 to +150 C These are stress ratings only. Operation outside the absolute maximum ratings may cause device failure. Operation at the absolute maximum rating for extended periods may reduce device reliability. Package Thermal Data Characteristic Symbol Value Unit Power Dissipation (Note 4) @T A = +25 C P D 0.36 W Thermal Resistance, Junction to Ambient Air (Note 4) @T A = +25 C R θja 347 C/W Recommended Operating Conditions Symbol Parameter Min Max Unit V BIAS Supply Voltage Range 4.5 30 V OUT OUT Voltage Range 0.8 30 V I LED LED Pin Current (Note 5) 10 100 ma T A Operating Ambient Temperature Range -40 +125 C Notes: 4. Device mounted on FR-4 PCB, 2oz with minimum recommended pad layout. 5. Subject to ambient temperature, power dissipation and PCB. 3 of 10

Electrical Characteristics: NPN Transistor Q1 (@T A = +25 C, unless otherwise specified.) Symbol Characteristic Test Condition Min Typ Max Unit V (BR)CEO Collector-Emitter Breakdown Voltage (Note 6) (Note 7) I C = 1.0mA, I B = 0 40 V V (BR)EBO Emitter-Base Breakdown Voltage I E = 10µA, I C = 0 6.0 V I CEX Collector Cutoff Current (Note 7) V CE = 30V, V EB(OFF) = 3.0V 50 na I BL Base Cutoff Current (Note 7) V CE = 30V, V EB(OFF) = 3.0V 50 na h FE DC Current Gain I C = 1.0mA, V CE = 1.0V I C = 10mA, V CE = 1.0V V CE(SAT) Collector-Emitter Saturation Voltage (Note 6) I C = 10mA, I B = 1.0mA 0.20 V V BE(SAT) Base-Emitter Saturation Voltage I C = 10mA, I B = 1.0mA 0.65 0.85 V V BE(ON) Base-Emitter Turn-On Voltage V CE = 1.20V, I C = 2.0mA 0.30 1.10 V 70 100 300 Electrical Characteristics: NPN Pre-biased Transistor Q2 (@T A = +25 C, unless otherwise specified.) Symbol Characteristic Test Condition Min Typ Max Unit V (BR)CBO Collector-Base Breakdown Voltage I C = 50μA, I E = 0 30 V V (BR)CEO Collector-Emitter Breakdown Voltage (Note 6) I C = 1mA, I B = 0 30 V V (BR)EBO Emitter-Base Breakdown Voltage (Note 7) I E = 50μA, I C = 0 5.0 V I CBO Collector Cutoff Current V CB = 30V, I E = 0 0.5 µa I EBO Emitter Cutoff Current (Note 7) V EB = 4V, I C = 0 0.5 µa V CE(SAT) Collector-Emitter Saturation Voltage (Note 6) I C = 10mA, I B = 1mA 0.3 V V BE(ON) Base-Emitter Turn-On Voltage V CE = 5.0V, I C = 2.0mA 0.30 1.10 V h FE DC Current Gain (Note 6) V CE = 5V, I C = 150mA 100 R 1 Input Resistance 7 10 13 kω *Characteristics of transistor only. Notes: 6. Short duration pulse test used to minimize self-heating effect. 7. Guaranteed by design and tested only at the wafer level for single die. These parameters cannot be tested at the finished good level due to test conditions changed after packaging multi-dies to form an application circuit. 4 of 10

I OUT (ma) ADVANCE INFORMATION Thermal Characteristics 100 Vbias = 24V 50 Vout = 1.4V Vout = 5.4V V OUT (V) Figure 3 Output Current vs. V OUT 0 1 10 100 R EXT ( Figure 4 Output Current vs. R EXT V OUT (V) Figure 5 Output Current vs. V OUT V OUT (V) Figure 6 Output Current vs. V OUT 5 of 10

Typical Performance Characteristics (Continued) V OUT (V) Figure 7 Output Current vs. V OUT V BIAS (V) Figure 8 Output Current vs. V BIAS V BIAS (V) Figure 9 Output Current vs. V BIAS V BIAS (V) Figure 10 Output Current vs. V BIAS V BIAS (V) Figure 11 Output Current vs. V BIAS 6 of 10

Application Information The is designed for driving low current LEDs with typical LED currents of 10mA to 100mA. It provides a cost effective way of driving low current LEDs compared with more complex switching regulator solutions. Furthermore, it reduces the PCB board area of the solution as there is no need for external components like inductors, capacitors and switching diodes. Figure 12 shows a typical application circuit diagram for driving an LED or string of LEDs. The NPN transistor Q1 measures the LED current by sensing the voltage across an external resistor R EXT. Q1 uses its V BE as reference to set the voltage across R EXT and controls the base current into Q2. Q2 operates in linear mode to regulate the LED current. The LED current is: I LED = V BE(Q1) / R EXT From this, for any required LED current the necessary external resistor R EXT can be calculated from: R EXT = V BE(Q1) / I LED Two or more can be connected in parallel to construct higher current LED strings as shown in Figure 13. Consideration of the expected linear mode power dissipation must be factored into the design, with respect to the 's thermal resistance. The maximum voltage across the device can be calculated by taking the maximum supply voltage less the voltage across the LED string. V CE(Q2) = V CC V LED V BE(Q1) P D = V CE(Q2) * I LED + ( V CC V BE(Q2) V BE(Q1)) 2 / R 1 As the output current of increases, it is necessary to provide appropriate thermal relief to the device. The power dissipation supported by the device is dependent upon the PCB board material, the copper area and the ambient temperature. The maximum dissipation the device can handle is given by: P D = (T J(MAX) - T A) /R θja Figure 12 Typical Application Circuit for Linear Mode Current Sink LED Driver Figure 13 Application Circuit for Increasing LED Current 7 of 10

LED CURRENT (ma) ADVANCE INFORMATION Application Information (Continued) PWM dimming can be achieved by driving the EN Pin. An external open-collector NPN transistor or open-drain N-Channel MOSFET can be used to drive the EN Pin as shown in Figure 14. Dimming is achieved by turning the LEDs ON and OFF for a portion of a single cycle. The PWM signal can be provided by a micro-controller or analog circuitry. Figure 16 is a typical response of LED current vs. PWM duty cycle on the EN Pin. -or- Figure 14 Application Circuits for LED Driver with PWM Dimming Functionality 60 50 40 30 20 10 0 0 20 40 60 80 100 PWM DUTY CYCLE (%) Figure 15 Typical LED Current Response vs. PWM Duty Cycle for R EXT = 13Ω at 400Hz PWM Frequency To remove the potential of incorrect connection of the power supply damaging the lamp s LEDs, many systems use some form of reverse polarity protection. One solution for reverse input polarity protection is to simply use a diode with a low V F in-line with the driver/led combination. The low V F increases the available voltage to the LED stack and dissipates less power. A circuit example is presented in Figure 16 using Diodes Incorporated s SBR (Super Barrier Rectifier) technology. An SDM10U45LP (0.1A/45V) is shown, providing exceptionally low V F for its package size of 1mm x 0.6mm, equivalent to an 0402 chip style package. Other reverse voltage ratings are available on Diodes website, such as the SBR02U100LP (0.2A/100V) or SBR0220LP (0.2A/20V). Automotive applications commonly use this method for reverse battery protection. 8 of 10

Application Information (cont.) A second approach, shown in Figure 17, improves upon the method shown in Figure 16. Whereas the method in Figure 16 protects the light engine, it will not function until the problem is diagnosed and corrected. The method shown in Figure 17 not only provides reverse polarity protection, it also corrects the reversed polarity, allowing the light engine to function. The BAS40BRW incorporates four low V F, Schottky diodes into a single package and allows more voltage to be available for the LED stack and dissipates less power than standard rectifier bridges. SDM10U45LP V S R S Figure 16 Application Circuit for LED Driver with Reverse Polarity Protection Figure 17 Application Circuit for LED Driver with Assured Operation Regardless of Polarity Package Outline Dimensions Please see AP02001 at http:///_files/datasheets/ap02001.pdf for the latest version. X2-DFN1310-6 A1 A z R0.150 E(Pin #1 ID) f f b D d D2 e f A3 f d z Seating Plane L E2 X2-DFN1310-6 Dim Min Max Typ A 0.40 A1 0 0.05 0.02 A3 0.13 b 0.10 0.20 0.15 D 1.25 1.38 1.30 d 0.25 D2 0.30 0.50 0.40 E 0.95 1.075 1.00 e 0.35 E2 0.30 0.50 0.40 f 0.10 L 0.20 0.30 0.25 Z 0.05 All Dimensions in mm 9 of 10

Suggested Pad Layout Please see AP02001 at http:///_files/datasheets/ap02001.pdf for the latest version. X2-DFN1310-6 G2 X2 b G3 a X1 Y2 Y1 G1 Dimensions Value (in mm) G1 0.16 G2 0.17 G3 0.15 X1 0.52 X2 0.20 Y1 0.52 Y2 0.375 a 0.09 b 0.06 IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright 2016, Diodes Incorporated 10 of 10