MIC9 MHz Low-Power SC-7 Op Amp General Description The MIC9 is a high-speed operational amplifier with a gain-bandwidth product of MHz. The part is unity gain stable. It has a very low.ma supply current, and features the Teeny SC-7 package. Supply voltage range is from ±.V to ±9V, allowing the MIC9 to be used in low-voltage circuits or applications requiring large dynamic range. The MIC9 is stable driving any capacitative load and achieves excellent PSRR and CMRR, making it much easier to use than most conventional high-speed devices. Low supply voltage, low power consumption, and small packing make the MIC9 ideal for portable equipment. The ability to drive capacitative loads also makes it possible to drive long coaxial cables. Features MHz gain bandwidth product MHz db bandwidth.ma supply current SC-7 package V/µs slew rate Drives any capacitive load Unity gain stable Applications Video Imaging Ultrasound Portable equipment Line drivers Ordering Information Part Number Ambient Temperature Package Standard Marking Pb-Free Marking MIC9BC A9 MIC9YC A9 ºC to +8ºC SC-7- Pin Configuration Functional Pinout IN V IN+ A9 Part Identification IN V IN+ OUT V+ SC-7 OUT V+ SC-7 Pin Description Pin Number Pin Name Pin Function IN+ Noninverting Input V Negative Supply (Input) IN Inverting Input OUT Output: Amplifier Output V+ Positive Supply (Input) Teeny is a trademark of 8 Fortune Drive San Jose, CA 9 USA tel + (8) 9-8 fax + (8) 7- http://www.micrel.com May 6 MIC9
Absolute Maximum Ratings (Note ) Supply Voltage (V V+ V V )... V Differential Input Voltage ( V IN+ V IN )... V, Note Input Common-Mode Range (V IN+, V IN )...V V+ to V V Lead Temperature (soldering, sec.)... 6 C Storage Temperature (T S )... C ESD Rating, Note....kV Operating Ratings (Note ) Supply Voltage (V S )...±.V to ±9V Junction Temperature (T J )... C to + Package Thermal Resistance SC-7- (θ JA )... C/W Electrical Characteristics (±V) V+ = +V, V = V, V CM = V, ; T J =, bold values indicate C T J +; unless noted. Symbol Parameter Condition Min Typ Max Units V OS Input Offset Voltage -.8 mv V OS V OS Temperature Coefficient µv/ C I B Input Bias Current.7. µa I OS Input Offset Current -. µa V CM Input Common-Mode Range. +. V CMRR Common-Mode Rejection Ratio.V < V CM < +.V 7 8 db PSRR Power Supply Rejection Ratio ±.V < V S < ±9V 68 87 db A VOL Large-Signal Voltage Gain = kω, V OUT = ±V 6 7 db = Ω, V OUT = ±V 77 db V OUT Maximum Output Voltage Swing positive, = kω +.6 V negative, = kω.6 V positive, = Ω +.7. V negative, = Ω, Note.6. V GBW Unity Gain-Bandwidth Product =.7pF MHz PM Phase Margin =.7pF 9 BW db Bandwidth, =.7pF MHz SR Slew Rate C=.7pF, Gain=, V OUT =V PP V/µs negative SR = 6V/µs I SC Short-Circuit Output Current source 6 78 ma sink 7 ma I S Supply Current No Load. ma Input Voltage Noise f = khz 9 V/ Hz Input Current Noise f = khz. A/ Hz Electrical Characteristics V+ = +9V, V = 9V, V CM = V, ; T J =, bold values indicate C T J +; unless noted Symbol Parameter Condition Min Typ Max Units V OS Input Offset Voltage -. mv V OS Input Offset Voltage µv/ C Temperature Coefficient I B Input Bias Current.7. µa I OS Input Offset Current. µa V CM Input Common-Mode Range 7. +7. V CMRR Common-Mode Rejection Ratio 6.V < V CM < +6.V 8 8 db PSRR Power Supply Rejection Ratio ±.V < V S < ±9V 68 87 db MIC9 May 6
Symbol Parameter Condition Min Typ Max Units A VOL Large-Signal Voltage Gain = kω, V OUT = ±V 6 76 db = Ω, V OUT = ±V 86 db V OUT Maximum Output Voltage Swing positive, = kω 7 7. V negative, = kω 7. 7 V GBW Unity Gain-Bandwidth Product =.7pF MHz PM Phase Margin =.7pF BW db Bandwidth A V =, =.7pF MHz SR Slew Rate C=.7pF, Av =, V OUT =8V PP, V/µs positive SR = 7V/µs I SC Short-Circuit Output Current source 7 8 ma sink ma I S Supply Current No Load. ma Input Voltage Noise f = khz 9 nv/ Hz Input Current Noise f = khz. pa/ Hz Note. Note. Note. Note. Note. Exceeding the absolute maximum rating may damage the device. The device is not guaranteed to function outside its operating rating. Exceeding the maximum differential input voltage will damage the input stage and degrade performance (in particular, input bias current is likely to change). Devices are ESD sensitive. Handling precautions recommended. Human body model,.k in series with pf. Output swing limited by the maximum output sink capability, refer to the short-circuit current vs. temperature graph in Typical Characteristics. May 6 MIC9
Test Circuits V+ µf Input Ω.µF.µF V+ R k µf Input k k k Ω All resistors: % metal film.µf MIC9 Ω V k.µf µf PSRR vs. Frequency Output Input R k R7c k R7b Ω R7a Ω All resistors % R6 k R k R Ω R k MIC9 V R R + R + R VOUT = VERROR + + R R7 CMRR vs. Frequency.µF.µF µf Output pf R k pf V+ µf V+ µf R Ω R Ω R 7k S S R 7k MIC9.µF.µF To Dynamic Analyzer V IN Ω MIC9.µF.µF Ω V OUT FET Probe pf µf V Noise Measurement V µf Closed Loop Frequency Response Measurement MIC9 May 6
Typical Characteristics SUPPLY CURRENT (ma).7.6.6...... Supply Current vs. Temperature V± = ±.V. - - 6 8 TEMPERATURE ( C) SUPPLY CURRENT (ma).6...... Supply Current vs. Supply Voltage C..... 6. 7. 8. 9. SUPPLY VOLTAGE (V) OFFSET VOLTAGE (mv)...8.6.. Offset Voltage vs. Temperature V± = ±.V - - 6 8 TEMPERATURE ( C) OFFSET VOLTAGE (mv) Offset Voltage vs. Common-Mode Voltage 8 7 6 C - - - - - - - - COMMON-MODE VOLTAGE (V) OFFSET VOLTAGE (mv) Offset Voltage vs. Common-Mode Voltage 8 7 6 - - - C -9. -7. -. -.6 -.8.8.6. 7. 9. COMMON-MODE VOLTAGE (V) OUTPTU VOLTAGE (V) Output Voltage vs. Output Current.. Sourcing...... C... 6 7 8 CURRENT (ma) VOLTAGE (V) Output Voltage vs. Output Current 9.9 9. Sourcing 8. 7. 6. C...6.7 +.8.9 + 6 7 8 9 CURRENT (ma) VOLTAGE (V) Output Voltage vs. Output Current. Sinking -. -. -. -. C -. -. -. -. -. -. --------- - CURRENT (ma) VOLTAGE (V) Output Voltage vs. Output Current.9. Sinking -.9 -.8 -.7 -.6 -. -. C -6. -7. -8. -9. -6--8--6---8- -6 CURRENT (ma) SHORT-CIRCUIT CURRENT (ma) 99 9 8 7 6 6 7 8 9 Short-Circuit Current vs. Supply Voltage Sourcing C..7...8. 6. 6.9 7.6 8. 9. SUPPLY VOLTAGE (±V) NOISE VOLTAGE (nv/hz) 6-6 - -8 - - -6 - -8 - -6 Short Circuit Current vs. Supply Voltage Sinking C..7...8. 6. 6.9 7.6 8. 9. SUPPLY VOLTAGE (±V) I NPUT BIAS CURRENT ( µ A )... Bias Current vs. Temperature V± = ±.V - - 6 8 TEMPERATURE ( C) May 6 MIC9
B IAS CURRENT ( ± V )...6..8...6..8. Bias Current vs. Supply Voltage C....... 6. 6. 7. 7. 8. 8. 9. SUPPLY VOLTAGE (±V) Open-Loop Frequency Response 6 8 Phase Margin = Ω 9 No Load Gain Bandwidth - = Ω -9 - - - -8 - - - -7 M M M CAPACITIVE LOAD (pf) GAIN BANDWIDTH (MHz) P HASE MARGIN ( ) Open-Loop Frequency Response 6 = Ω Phase No Load Gain = Ω - - - - M M M CAPACITIVE LOAD (pf) GAIN BANDWIDTH (MHz) 8 9 - -9 - -8 P HASE MARGIN ( ) - -7 GAIN BANDWIDTH (MHz) Gain Bandwidth and Phase Margin vs. Load 6 Phase Margin Gain Bandwidth 6 8 P HASE MARGIN ( ) GAIN BANDWIDTH (MHz) Gain Bandwidth and Phase Margin vs. Load Phase Margin Gain Bandwidth 6 8 P HASE MARGIN ( ) GAIN BANDWIDTH (MHz) Gain Bandwidth and Phase Margin vs. Supply Voltage 9 Phase Margin 8 7 Gain Bandwidth 6 9 8 7 6 6 7 8 9 SUPPLY VOLTAGE (±V) P HASE MARGIN ( ) P OSITIVE SLEW RATE (V/ µ s ) 8 7 6 Positive Slew Rate 6 7 8 9 S LEW RATE (V/ µ s ) 8 6 Negative Slew Rate 6 7 8 9 S LEW RATE (V/ µ s ) Positive Slew Rate 6 7 8 9 S LEW RATE (V/ µ s ) Negative Slew Rate 6 8 CLOSED-LOOP GAIN (db) 9 8 7 6 M Closed Loop Gain vs. Frequency pf 8pF 6pF pf.7pf pf x 6 x M 6 x M 6 x 6 FREQUENCY (Hz) CLOSED-LOOP GAIN (db) Closed-Loop Gain vs. Frequency.7pF - - pf - pf pf - 8pF pf 6pF - -6-7 x M 6 x M 6 x M 6 x 6 FREQUENCY (Hz) MIC9 6 May 6
OPEN-LOOP GAIN (db) 6 - - - - M Open-Loop Gain vs. Frequency pf 67pF pf.7pf pf pf pf M M FREQUENCY (Hz) OPEN-LOOP GAIN (db) 6 - - - - M Open-Loop Gain vs. Frequency pf 67pF.7pF pf pf pf pf M M FREQUENCY (Hz) May 6 7 MIC9
Functional Characteristics (mv/div) V± = ±.V =.7µF (mv/div) V± = ±9.V =.7µF (mv/div) (mv/div) TIME (ns/div) TIME (ns/div) (mv/div) V± = ±.V = pf (mv/div) V± = ±9.V = pf (mv/div) (mv/div) TIME (ns/div) TIME (ns/div) (mv/div) V± = ±.V = pf (mv/div) V± = ±9.V = pf (mv/div) (mv/div) TIME (ns/div) TIME (ns/div) MIC9 8 May 6
(V/div) V± = ±.V =.7µF Positive Slew Rate = 8V/µs Negative Slew Rate = 6V/µs TIME (ns/div) (V/div) V± = ±.V = pf Positive Slew Rate = V/µs Negative Slew Rate = V/µs TIME (ns/div) (V/div) (V/div) V± = ±9.V =.7µF Positive Slew Rate = 77V/µs Negative Slew Rate = V/µs TIME (ns/div) (V/div) V± = ±9.V = pf Positive Slew Rate = 7V/µs Negative Slew Rate = 7V/µs TIME (ns/div) (V/div) V± = ±.V = pf Positive Slew Rate = 6V/µs Negative Slew Rate = 66V/µs V± = ±9.V = pf Positive Slew Rate = 78V/µs Negative Slew Rate = V/µs TIME (ns/div) TIME (ns/div) May 6 9 MIC9
Applications Information The MIC9 is a high-speed, voltage-feedback operational amplifier featuring very low supply current and excellent stability. This device is unity gain stable, capable of driving high capacitance loads. Driving High Capacitance The MIC9 is stable when driving high capacitance, making it ideal for driving long coaxial cables or other high-capacitance loads. Most high-speed op amps are only able to drive limited capacitance. Note: increasing load capacitance does reduce the speed of the device. In applications where the load capacitance reduces the speed of the op amp to an unacceptable level, the effect of the load capacitance can be reduced by adding a small resistor (<Ω) in series with the output. Feedback Resistor/Capacitor Selection Conventional op amp gain configurations and resistor selection apply, the MIC9 is NOT a current feedback device. Also, for minimum peaking, the feedback resistor should have low parasitic capacitance. To use the part as a follower, the output should be connected to input via a short wire. At high frequency, the parasitic capacitance at the input might cause peaking in the closed-loop frequency response. A pf capacitor should be used across the feedback resistor to compensate for this parasitic peaking. Layout Considerations All high speed devices require careful PCB layout. The following guidelines should be observed: Capacitance, par-ticularly on the two inputs pins will degrade performance; avoid large copper traces to the inputs. Keep the output signal away from the inputs and use a ground plane. It is important to ensure adequate supply bypassing capacitors are located close to the device. Power Supply Bypassing Regular supply bypassing techniques are recommended. A µf capacitor in parallel with a.µf capacitor on both the positive and negative supplies are ideal. For best performance all bypassing capacitors should be located as close to the op amp as possible and all capacitors should be low ESL (equivalent series inductance), ESR (equivalent series resis-tance). Surface-mount ceramic capacitors are ideal. Thermal Considerations The SC7- package, like all small packages, has a high thermal resistance. It is important to ensure the IC does not exceed the maximum operating junction (die) temperature of. The part can be operated up to the absolute maximum temperature rating of, but between and performance will degrade, in par-ticular CMRR will reduce. An MIC9 with no load, dissipates power equal to the quiescent supply current supply voltage P D(no load) = (V V+ V V- )I S When a load is added, the additional power is dissipated in the output stage of the op amp. The power dissipated in the device is a function of supply voltage, output voltage and output current. P D(output stage) = (V V+ V VOUT )I OUT Total Power Dissipation = P D(no load) + P D(output stage) Ensure the total power dissipated in the device is no greater than the thermal capacity of the package. The SC7- package has a thermal resistance of C/W. T J(max) T A(max) Max. Allowable Power Dissipation = C/W MIC9 May 6
Package Information SC-7 (C) MICREL INC. 8 FORTUNE DRIVE SAN JOSE, CA 9 USA TEL + (8) 9-8 FAX + (8) 7- WEB http://www.micrel.com This information furnished by Micrel in this data sheet is believed to be accurate and reliable. However no responsibility is assumed by Micrel for its use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer. Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser's use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser's own risk and Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale. May 6 MIC9