STPS45B-Y Automotive power Schottky rectifier Features Negligible switching losses Low forward voltage drop Low capacitance High reverse avalanche surge capability Avalanche specification AEC-Q qualified Description High voltage Schottky rectifier suited for switch mode power supplies and other power converters. Packaged in DPAK, this device is intended for use in high frequency circuits where low switching losses are required. j Table. Device summary I F(AV) A V RRM 45 V T j 75 C V F (max) K K A A DPAK STPS45BY.57 V May 2 Doc ID 7265 Rev /7 www.st.com 7
Characteristics STPS45B-Y Characteristics Table 2. Absolute maximum ratings Symbol Parameter Value Unit V RRM Repetitive peak reverse voltage 45 V I F(RMS) /pin Forward rms current 7 A I F(AV) Average forward current T c = 5 C δ =.5 A I FSM Surge non repetitive forward current t p = ms sinusoidal 75 A I RRM Repetitive peak reverse current t p = 2 µs, F= khz A P ARM Repetitive peak avalanche power t p = µs, T j = 25 C 4 W T stg Storage temperature range -65 to +75 C T j Operating junction temperature range () -4 to +75 C dv/dt Critical rate of rise of reverse voltage V/µs. dptot --------------- condition to avoid thermal runaway for a diode on its own heatsink dtj Rth ( j a) Table 3. Thermal parameters Symbol Parameter Value Unit R th(j-c) Junction to case 3 C/W Table 4. Static electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit I R () V F (2) Reverse leakage current Forward voltage drop T j = 25 C - - μa V R = V RRM T j = 25 C - 7 5 ma T j = 25 C - -.63 I F = A T j = 25 C -.5.57 V T j = 25 C - -.84 I F = 2 A T j = 25 C -.65.72. Pulse test: t p = 5 ms, δ < 2% 2. Pulse test: t p = 38 µs, δ < 2% To evaluate the conduction losses use the following equation: P =.42 x I F(AV) +.5 I F 2 (RMS) 2/7 Doc ID 7265 Rev
STPS45B-Y Characteristics Figure. Average forward power dissipation versus average forward current Figure 2. Average forward current versus ambient temperature ( δ =.5) 8 7 6 P F(AV) (W) δ =.5 δ =. δ =.2 δ =.5 2 I F(AV) (A) R th(j-a) =Rth(j-c) 5 4 δ = 8 6 R th(j-a) =5 C/W 3 2 T I F(AV) (A) δ=tp/t tp 2 3 4 5 6 7 8 9 2 R th(j-a) =7 C/W 4 2 T amb( C) 25 5 75 25 5 75 Figure 3. P ARM(t p) P ARM(µs) Normalized avalanche power derating versus pulse duration Figure 4..2 P ARM(T) j P ARM(25 C) Normalized avalanche power derating versus junction temperature..8.6..4... t p(µs).2 T ( C) j 25 5 75 25 5 Figure 5. Non repetitive surge peak forward current versus overload duration (maximum values) Figure 6. Relative variation of thermal impedance junction to case versus pulse duration 2 I (A) M. Z th(j-c) /Rth(j-c).8 8 6 4 T C=5 C T C= C T C=5 C IM 2 t δ=.5 t(s) E-3 E-2 E- E+.6.4.2 δ =.5 δ =.2 δ =. Single pulse t p(s) δ=tp/t tp. E-4 E-3 E-2 E- E+ T Doc ID 7265 Rev 3/7
Characteristics STPS45B-Y Figure 7. Reverse leakage current versus reverse voltage applied (typical values) Figure 8. Junction capacitance versus reverse voltage applied (typical values) E+5 E+4 E+3 I (µa) R T j=5 C T j=25 C T j= C 5 C(pF) F=MHz V OSC=3mVRMS T j=25 C E+2 T j=75 C T j=5 C E+ T j=25 C 2 E+ V R(V) E- 5 5 2 25 3 35 4 45 V (V) R 2 5 2 5 Figure 9.. I FM(A) Forward voltage drop versus forward current T j=25 C (maximum values) Figure. Rth(j-a)( C/W) Thermal resistance junction to ambient versus copper surface under tab Epoxy printed circuit board, copper thickness: 35 µm. T j=25 C (typical values) 8 6. T j=25 C (maximum values) 4 V FM(V)...2.4.6.8..2.4.6 2 S(Cu)(cm 2 ) 2 4 6 8 2 4 6 8 2 4/7 Doc ID 7265 Rev
STPS45B-Y Package information 2 Package information Epoxy meets UL94, V Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. Table 5. DPAK dimensions Dimensions Ref. Millimeters Inches Min. Max Min. Max. E B2 L2 C2 A A 2.2 2.4.86.94 A.9..35.43 A2.3.23..9 B.64.9.25.35 H L4 G B A R C R D B2 5.2 5.4.24.22 C.45.6.7.23 C2.48.6.8.23 D 6. 6.2.236.244 E 6.4 6.6.25.259.6 MIN. A2 G 4.4 4.6.73.8 H 9.35..368.397 V2 L2.8 typ..3 typ. L4.6..23.39 V2 8 8 Figure. DPAK footprint (dimensions in mm) 6.7 3 3.6 6.7 2.3 2.3.6 Doc ID 7265 Rev 5/7
Ordering information STPS45B-Y 3 Ordering information Table 6. Ordering information Order code Marking Package Weight Base qty Delivery mode STPS45BY-TR S45Y DPAK.3 g 25 Tape and reel 4 Revision history Table 7. Document revision history Date Revision Changes 23-May-2 Initial release. 6/7 Doc ID 7265 Rev
STPS45B-Y Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. 2 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com Doc ID 7265 Rev 7/7