STTH100W06C. Turbo 2 ultrafast high voltage rectifier. Features. Description

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STTH1W6C Turbo 2 ultrafast high voltage rectifier Datasheet production data Features Ultrafast switching Low reverse recovery current Low thermal resistance Reduces switching losses ECOPACK 2 compliant component Ribbon bonding for more robustness Description The STTH1W6CW, uses ST Turbo 2, 6 V technology. It is especially suited to be used for DC/DC and DC/AC converters in secondary stage of MIG/MMA/TIG welding machine. Housed in ST's TO-247, this device offers high power integration for all welding machines and industrial applications. Table 1. Symbol I F(AV) V RRM t rr (typ) Device summary Value 2 x 5 A 6 V 55 ns T j (max) 175 C V F (typ) A2 A1 A1 K A2 K TO-247 STTH1W6CW.92 V October 212 Doc ID 23615 Rev 1 1/8 This is information on a product in full production. www.st.com 8

Characteristics STTH1W6C 1 Characteristics Table 2. Absolute ratings (limiting values, at 25 C, unless otherwise specified, per diode) Symbol Parameter Value Unit V RRM Repetitive peak reverse voltage 6 V I F(RMS) Forward rms current 75 A I F(AV) Average forward current, =.5 T c = 135 C Per diode 5 T c = 12 C Per device 1 A I FSM Surge non repetitive forward current t p = 1 ms sinusoidal 36 A T stg Storage temperature range -65 to + 175 C T j Maximum operating junction temperature + 175 C Table 3. Thermal resistance Symbol Parameter Value Unit R th(j-c) Junction to case Per diode.55 Total.35 C / W R th(c) Coupling.15 C / W When diodes 1 and 2 are used simultaneously: T j (diode 1) = P(diode 1) x R th(j-c) (per diode) + P(diode 2) x R th(c) Table 4. Static electrical characteristics (per diode) Symbol Parameter Test conditions Min. Typ. Max. Unit I R (1) V F (2) Reverse leakage current T j = 25 C 2 T j = 125 C V R = V RRM 2 2 Forward voltage drop T j = 25 C 1.45 I F = 5A T j = 15 C.92 1.15 T j = 25 C 1.65 I F = 1 A T j = 15 C 1.15 1.45 µa V 1. Pulse test: t p = 5 ms, < 2% 2. Pulse test: t p = 38 µs, < 2% To evaluate the conduction losses use the following equation: 2 P =.85 x I F(AV) +.6 I F (RMS) 2/8 Doc ID 23615 Rev 1

STTH1W6C Characteristics Table 5. Dynamic electrical characteristics (per diode) Symbol Parameter Test conditions Min. Typ. Max. Unit I RM Reverse recovery current 3 4 A Q RR Reverse recovery charge T j = 125 C I F = 5 A, V R = 4 V di F /dt = -2 A/µs 37 nc S factor Softness factor.3 t rr Reverse recovery time T j = 25 C I F = 1 A, V R = 3 V di F /dt = -1 A/µs 55 75 ns t fr Forward recovery time T j = 25 C I F = 5 A, V FR = 1.V 2 ns V FP Forward recovery voltage T j = 25 C di F /dt = 2 A/µs 1.3 2 V Figure 1. Average forward power dissipation versus average forward current (per diode) Figure 2. Forward voltage drop versus forward current (per diode) 8 7 6 5 4 P F(AV) (W) δ =.5 δ =. 1 δ =.2 δ =.5 δ = 1 1. 1. 1. I FM (A) T j=15 C (Typical values) T j=15 C (Maximum values) T j=25 C (Maximum values) 3 2 T 1 IF(AV)(A) δ = tp/t tp 1 2 3 4 5 6 7 1. V FM(V).1..4.8 1.2 1.6 2. 2.4 Figure 3. Relative variation of thermal impedance junction to case versus pulse duration Figure 4. Peak reverse recovery current versus di F /dt (typical values, per diode) 1. Zth(j-c)/Rth(j-c) 7 IRM(A).9.8 6 V R=4 V.7 5.6.5 4.4 3.3.2 Single pulse.1 tp(s). 1.E-4 1.E-3 1.E-2 1.E-1 1.E+ 2 1 5 1 15 2 25 3 35 4 45 5 Doc ID 23615 Rev 1 3/8

Characteristics STTH1W6C Figure 5. Reverse recovery time versus di F /dt (typical values, per diode) Figure 6. Reverse recovery charges versus di F /dt (typical values, per diode) 4 trr(ns) 7 Q RR(nC) 35 V R=4 V 6 V R=4 V 3 5 25 4 2 15 1 5 5 1 15 2 25 3 35 4 45 5 3 2 1 5 1 15 2 25 3 35 4 45 5 Figure 7. Reverse recovery softness factor versus di F /dt (typical values, per diode) Figure 8. Relative variation of dynamic parameters versus junction temperature.7.6 S factor V R=4 V 2. S FACTOR V R=4 V Reference:.5 1.5.4 1..3.2.5 I RM.1. 5 1 15 2 25 3 35 4 45 5 Q RR Tj ( C). 25 5 75 1 125 Figure 9. Transient peak forward voltage versus di F /dt (typical values, per diode) Figure 1. Forward recovery time versus di F /dt (typical values, per diode) VFP(V) 5 25 tfr(ns) 4 2 V FR=1 V 3 15 2 1 1 2 25 3 35 4 45 5 5 2 25 3 35 4 45 5 4/8 Doc ID 23615 Rev 1

STTH1W6C Characteristics Figure 11. Junction capacitance versus reverse voltage applied (typical values, per diode) 1 C(pF) F=1 MHz V OSC =3 mv RMS T j =25 C 1 1 V R (V) 1 1 1 1 Doc ID 23615 Rev 1 5/8

Package information STTH1W6C 2 Package information Epoxy meets UL94, V Cooling method: by conduction (C) Recommended torque value:.55 N m (1. N m maximum) In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. Table 6. TO-247 dimensions Dimensions Ref. Millimeters Inches S D L1 L E A Heat-sink plane P R L2 b1 b2 1 2 3 b c 3 2 1 A1 BACK VIEW e Min. Typ. Max. Min. Typ. Max. A 4.85 5.15.191.23 A1 2.2 2.6.86.12 b 1. 1.4.39.55 b1 2. 2.4.78.94 b2 3. 3.4.118.133 c.4.8.15.31 D (1) 19.85 2.15.781.793 E 15.45 15.75.68.62 e 5.3 5.45 5.6.29.215.22 L 14.2 14.8.559.582 L1 3.7 4.3.145.169 L2 18.5 typ..728 typ. P (2) 3.55 3.65.139.143 R 4.5 5.5.177.217 S 5.3 5.5 5.7.29.216.224 1. Dimension D plus gate protrusion does not exceed 2.5 mm 2. Resin thickness around the mounting hole is not less than.9 mm 6/8 Doc ID 23615 Rev 1

STTH1W6C Ordering information 3 Ordering information Table 7. Ordering information Ordering type Marking Package Weight Base qty Delivery mode STTH1W6CW STTH1W6CW TO-247 4.46 g 5 Tube 4 Revision history Table 8. Document revision history Date Revision Changes 5-Oct-212 1 First issue. Doc ID 23615 Rev 1 7/8

STTH1W6C Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. 212 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 8/8 Doc ID 23615 Rev 1