US2882. Bipolar Hall Switch Very High Sensitivity. Features and Benefits. Application Examples. 1 Functional Diagram 2 General Description

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Features and Benefits Wide operating voltage range from 3.5V to 24V Very high magnetic sensitivity CMOS technology Chopper-stabilized amplifier stage Low current consumption Open drain output Thin SOT23 3L and flat TO-92 3L both RoHS Compliant packages Application Examples Automotive, Consumer and Industrial Solid-state switch Brushless DC motor commutation Speed detection Linear position detection Angular position detection Proximity detection Ordering Information Part No. Temperature Code Package Code US2882 E (-4 C to 85 C) SE (TSOT-3L) US2882 E (-4 C to 85 C) UA (TO-92) US2882 L (-4 C to 15 C) SE (TSOT-3L) US2882 L (-4 C to 15 C) UA (TO-92) 1 Functional Diagram 2 General Description The Melexis US2882 is a bipolar Hall-effect switch designed in mixed signal CMOS technology. The device integrates a voltage regulator, Hall sensor with dynamic offset cancellation system, Schmitt trigger and an open-drain output driver, all in a single package. Thanks to its wide operating voltage range and extended choice of temperature range, it is suitable for use in automotive and consumer applications. The device is delivered in a Thin Small Outline Transistor (TSOT) for surface mount process and in a Plastic Single In Line (TO-92 flat) for throughhole mount. Both 3-lead packages are RoHS compliant. 3912882 Page 1 of 12 Data Sheet

Table of Contents 1 Functional Diagram... 1 2 General Description... 1 3 Glossary of Terms... 3 4 Absolute Maximum Ratings... 3 5 Pin Definitions and Descriptions... 3 6 General Electrical Specifications... 4 7 Magnetic Specifications... 4 8 Output Behaviour versus Magnetic Pole... 4 9 Detailed General Description... 5 1 Unique Features... 5 11 Performance Graphs... 6 11.1 Magnetic parameters vs. T A...6 11.2 Magnetic parameters vs. V DD...6 11.3 V DSon vs. T A...6 11.4 V DSon vs. V DD...6 11.5 I DD vs. T A...6 11.6 I DD vs. V DD...6 11.7 I OFF vs. T A...7 11.8 I OFF vs. V DD...7 12 Test Conditions... 7 12.1 Supply Current...7 12.2 Output Saturation Voltage...7 12.3 Output Leakage Current...7 12.4 Magnetic Thresholds...7 13 Application Information... 8 13.1 Typical Three-Wire Application Circuit...8 13.2 Two-Wire Circuit...8 13.3 Automotive and Harsh, Noisy Environments Three-Wire Circuit...8 14 Application Comments... 8 15 Standard information regarding manufacturability of Melexis products with different soldering processes... 9 16 ESD Precautions... 9 17 Package Information... 1 17.1 SE Package (TSOT-3L)...1 17.2 UA Package (TO-92 flat)...11 18 Disclaimer... 12 3912882 Page 2 of 12 Data Sheet

3 Glossary of Terms MilliTesla (mt), Gauss RoHS TSOT ESD BLDC Units of magnetic flux density: 1mT = 1 Gauss Restriction of Hazardous Substances Thin Small Outline Transistor (TSOT package) also referred with the Melexis package code SE Electro-Static Discharge Brush-Less Direct-Current 4 Absolute Maximum Ratings Parameter Symbol Value Units Supply Voltage VDD 28 V Supply Current IDD 5 ma Output Voltage VOUT 28 V Output Current IOUT 5 ma Storage Temperature Range TS -5 to 15 C Maximum Junction Temperature TJ 165 C Table 1: Absolute maximum ratings Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute-maximumrated conditions for extended periods may affect device reliability. Operating Temperature Range Symbol Value Units Temperature Suffix E TA -4 to 85 C Temperature Suffix L TA -4 to 15 C 5 Pin Definitions and Descriptions SE Pin UA Pin Name Type Function 1 1 VDD Supply Supply Voltage pin 2 3 OUT Output Open Drain Output pin 3 2 GND Ground Ground pin Table 2: Pin definitions and descriptions SE package UA package 3912882 Page 3 of 12 Data Sheet

6 General Electrical Specifications DC Operating Parameters T A = 25 o C, V DD = 3.5V to 24V (unless otherwise specified) Parameter Symbol Test Conditions Min Typ Max Units Supply Voltage VDD Operating 3.5 24 V Supply Current IDD B < BRP 1.1 5 ma Output Saturation Voltage VDSon IOUT = 2mA, B > BOP.5 V Output Leakage Current IOFF B < BRP, VOUT = 24V.1 1 µa Output Rise Time tr RL = 1kΩ, CL = 2pF.25 µs Output Fall Time tf RL = 1kΩ, CL = 2pF.25 µs Maximum Switching Frequency FSW 1 KHz SE Package Thermal Resistance RTH Single layer (1S) Jedec board 31 C/W UA Package Thermal Resistance RTH 2 C/W Table 3: Electrical specifications 7 Magnetic Specifications DC Operating Parameters V DD = 3.5V to 24V (unless otherwise specified) Parameter Symbol Test Conditions Min Typ Max Units Operating Point BOP -3 6 mt Release Point BRP E spec., TA = 85 C -6 3 mt Hysteresis BHYST 1.5 6 mt Operating Point BOP -3.5 6 mt Release Point BRP L spec., TA = 15 C -6 3.5 mt Hysteresis BHYST 1.5 6 mt Table 4: Magnetic specifications Note 1: For typical values, please refer to the performance graphs in section 11 8 Output Behaviour versus Magnetic Pole DC Operating Parameters T A = -4 o C to 15 o C, V DD = 3.5V to 24V (unless otherwise specified) Parameter Test Conditions (SE) OUT (SE) Test Conditions (UA) OUT (UA) South pole B < BRP High B > BOP Low North pole B > BOP Low B < BRP High Table 5: Output behaviour versus magnetic pole South pole North pole North pole South pole OUT = high OUT = low (V DSon ) SE package OUT = high UA package OUT = low (V DSon ) 3912882 Page 4 of 12 Data Sheet

9 Detailed General Description Based on mixed signal CMOS technology, Melexis US2882 is a Hall-effect device with very high magnetic sensitivity. It allows using generic magnets, weak magnets or larger air gap. The chopper-stabilized amplifier uses switched capacitor technique to suppress the offset generally observed with Hall sensors and amplifiers. The CMOS technology makes this advanced technique possible and contributes to smaller chip size and lower current consumption than bipolar technology. The small chip size is also an important factor to minimize the effect of physical stress. This combination results in more stable magnetic characteristics and enables faster and more precise design. The wide operating voltage from 3.5V to 24V, L and E operating temperature range and low current consumption make this device especially suitable for automotive and BLDC motor applications. The output signal is open-drain type. Such output allows simple connectivity with TTL or CMOS logic by using a pull-up resistor tied between a pull-up voltage and the device output. 1 Unique Features The US2882 exhibits bipolar magnetic switching characteristics. Therefore, it operates with both south and north poles. Typically, the device behaves as a latch with symmetric operating and release switching points (B OP = B RP ). This means magnetic fields with equivalent strength and opposite direction drive the output high and low. Removing the magnetic field (B ) keeps the output in its previous state. This latching property defines the device as a magnetic memory. Latch characteristic Depending on the magnetic switching points, the device may also behave as a unipolar positive switch (B OP and B RP strictly positive) or negative switch (B OP and B RP strictly negative). That is the output can be set high and low by only using one magnetic pole. In such case, removing the magnetic field changes the output level. Unipolar positive switch characteristic Unipolar negative switch characteristic In latch, positive or negative switch behaviour, a magnetic hysteresis B HYST keeps B OP and B RP separated by a minimal value. This hysteresis prevents output oscillation near the switching point. 3912882 Page 5 of 12 Data Sheet

11 Performance Graphs 11.1 Magnetic parameters vs. T A 11.2 Magnetic parameters vs. V DD Magnetic field (mt) 5 4 3 2 1-1 -2-3 Bop, VDD=3.5V Bop, VDD=24V Brp, VDD=3.5V Brp, VDD=24V -4 Bhyst, VDD=3.5V Bhyst, VDD=24V -5-4 -3-2 -1 1 2 3 4 5 6 7 8 9 1 11 12 13 14 15 Ta ( C) Magnetic field (mt) 5 4 3 2 1-1 -2 Bop, Ta=25 C Bop, Ta=15 C -3 Brp, Ta=25 C Brp, Ta=15 C Bhyst, Ta=25 C Bhyst, Ta=15 C -4-5 3 4 5 6 7 8 9 1 11 12 13 14 15 16 17 18 19 2 21 22 23 24 VDD (Volts) 11.3 V DSon vs. T A 11.4 V DSon vs. V DD.5 Ta = -4 C VDSon (Volts).4.2 VDD = 3.5V VDD = 12V VDD = 24V VDSon (Volts).4.3.2 Ta = 25 C Ta = 85 C Ta = 15 C.1-4 -3-2 -1 1 2 3 4 5 6 7 8 9 1 11 12 13 14 15 Ta ( C) 3 4 5 6 7 8 9 1 11 12 13 14 15 16 17 18 19 2 21 22 23 24 VDD (Volts) 11.5 I DD vs. T A 11.6 I DD vs. V DD 5 5 IDD (ma) 4.5 4 3.5 3 2.5 2 VDD = 3.5V VDD = 12V VDD = 24V IDD (ma) 4.5 4 3.5 3 2.5 2 1.5 1.5-4 -3-2 -1 1 2 3 4 5 6 7 8 9 1 11 12 13 14 15 Ta ( C) 1.5 Ta = -4 C 1 Ta = 25 C.5 Ta = 85 C Ta = 15 C 3 4 5 6 7 8 9 1 11 12 13 14 15 16 17 18 19 2 21 22 23 24 VDD (Volts) 3912882 Page 6 of 12 Data Sheet

11.7 I OFF vs. T A 11.8 I OFF vs. V DD 6 6 5 VDD = 3.5V VDD = 12V VDD = 24V 5 Ta = 25 C Ta = 85 C 4 4 Ta = 15 C Ioff (µa) 3 Ioff (µa) 3 2 2 1 1-4 -3-2 -1 1 2 3 4 5 6 7 8 9 1 11 12 13 14 15 3 4 5 6 7 8 9 1 11 12 13 14 15 16 17 18 19 2 21 22 23 24 Ta ( C) VDD (Volts) 12 Test Conditions Note : DUT = Device Under Test 12.1 Supply Current 12.2 Output Saturation Voltage 12.3 Output Leakage Current 12.4 Magnetic Thresholds 3912882 Page 7 of 12 Data Sheet

13 Application Information 13.1 Typical Three-Wire Application Circuit 13.2 Two-Wire Circuit 13.3 Automotive and Harsh, Noisy Environments Three-Wire Circuit Note: With this circuit, precise ON and OFF currents can be detected using only two connecting wires. The resistors RL and Rb can be used to bias the input current. Refer to the part specifications for limiting values. B RP : B OP : I OFF = I R + I DD = V DD /R b + I DD I ON = I OFF + I OUT = I OFF + V DD /R L 14 Application Comments For proper operation, a 1nF bypass capacitor should be placed as close as possible to the device between the V DD and ground pin. For reverse voltage protection, it is recommended to connect a resistor or a diode in series with the V DD pin. When using a resistor, three points are important: - the resistor has to limit the reverse current to 5mA maximum (V CC / R1 5mA) - the resulting device supply voltage V DD has to be higher than V DD min (V DD = V CC R1.I DD ) - the resistor has to withstand the power dissipated in reverse voltage condition (P D = V CC 2 / R1) When using a diode, a reverse current cannot flow and the voltage drop is almost constant (.7V). Therefore, a 1Ω/.25W resistor for 5V application and a diode for higher supply voltage are recommended. Both solutions provide the required reverse voltage protection. When a weak power supply is used or when the device is intended to be used in noisy environment, it is recommended that figure 13.3 from the Application Information section is used. The low-pass filter formed by R1 and C1 and the zener diode Z1 bypass the disturbances or voltage spikes occurring on the device supply voltage V DD. The diode D1 provides additional reverse voltage protection. 3912882 Page 8 of 12 Data Sheet

15 Standard information regarding manufacturability of Melexis products with different soldering processes Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level according to following test methods: Reflow Soldering SMD s (Surface Mount Devices) IPC/JEDEC J-STD-2 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices (classification reflow profiles according to table 5-2) EIA/JEDEC JESD22-A113 Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing (reflow profiles according to table 2) Wave Soldering SMD s (Surface Mount Devices) and THD s (Through Hole Devices) EN6749-2 Resistance of plastic- encapsulated SMD s to combined effect of moisture and soldering heat EIA/JEDEC JESD22-B16 and EN6749-15 Resistance to soldering temperature for through-hole mounted devices Iron Soldering THD s (Through Hole Devices) EN6749-15 Resistance to soldering temperature for through-hole mounted devices Solderability SMD s (Surface Mount Devices) and THD s (Through Hole Devices) EIA/JEDEC JESD22-B12 and EN6749-21 Solderability For all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature, temperature gradient, temperature profile etc) additional classification and qualification tests have to be agreed upon with Melexis. The application of Wave Soldering for SMD s is allowed only after consulting Melexis regarding assurance of adhesive strength between device and board. Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of the use of certain Hazardous Substances) please visit the quality page on our website: http://www.melexis.com/quality.asp 16 ESD Precautions Electronic semiconductor products are sensitive to Electro Static Discharge (ESD). Always observe Electro Static Discharge control procedures whenever handling semiconductor products. 3912882 Page 9 of 12 Data Sheet

17 Package Information 17.1 SE Package (TSOT-3L).891 +/-.5.2.127 +.23 -.7.15.2 2.9 BSC see note 3.95 BSC.3.45 1.9 BSC 3912882 Page 1 of 12 Data Sheet

17.2 UA Package (TO-92 flat) 14.5 +/-.5 1.65 +/-.1 2.5 min see note 4 3. +/-.2 3912882 Page 11 of 12 Data Sheet

18 Disclaimer Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. Melexis reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with Melexis for current information. This product is intended for use in normal commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical lifesupport or life-sustaining equipment are specifically not recommended without additional processing by Melexis for each application. The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of Melexis rendering of technical or other services. 25 Melexis NV. All rights reserved. For the latest version of this document, go to our website at www.melexis.com Or for additional information contact Melexis Direct: Europe, Africa, Asia: America: Phone: +32 1367 495 Phone: +1 63 223 2362 E-mail: sales_europe@melexis.com E-mail: sales_usa@melexis.com ISO/TS 16949 and ISO141 Certified 3912882 Page 12 of 12 Data Sheet