( ) DIN EN : successor standard of DIN VDE0884
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- Laurence Paul
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1 PC94LNSZF Series PC94LNSZF Series Gate Drive DIP pin OPIC Photocoupler Description PC94LNSZF Series contains an IRED optically coupled to an OPIC chip. It is packaged in a pin DIP, available in SMT gullwing lead form option. Input-output isolation voltage(rms) is.kv. CMR is MIN. kv/µs. Agency approvals/compliance. Recognized by UL (Double protection isolation), file No. E4 (as model No. PC94L). Approved by VDE, DIN EN4-- ( ) (as an option), file No. 49 (as model No. PC94L). Package resin : UL flammability grade (94V-) ( ) DIN EN4-- : successor standard of DIN VDE4 Features. pin DIP package. Double transfer mold package (Ideal for Flow Soldering). Built-in direct drive circuit for IGBT drive (I OP, I OP :.A) 4. Wide operating supply voltage range ( : to V. High noise immunity due to high instantaneous common mode rejection voltage (CM H : MIN. kv/µs, CM L : MIN. kv/µs). High isolation voltage between input and output (V iso(rms) :. kv). Lead-free and RoHS directive compliant Applications. IGBT/MOSFET gate drive for inverter control "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing circuit integrated onto a single chip. Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Sheet No.: D-AEN Date Jun.. SHARP Corporation
2 PC94LNSZF Series Internal Connection Diagram Tr. Tr. Interface 4 Anode Cathode NC NC O O GND Amp. 4 Truth table Input ON OFF O Terminal Output High level Low level Tr. ON OFF Tr. OFF ON Outline Dimensions (Unit : mm). Through-Hole [ex. PC94LNSZF]. Through-Hole (VDE option) [ex. PC94LYIZF]. ±.. ±.. ±.. ±. PC94L. ±. PC94L 4. ± ± ±. VDE Identification mark Primary side mark Date code. ±. Primary side mark Date code. ±.. ±.. TYP.. ±.. TYP.. ±..4 ±..4 ±.. ±. θ Epoxy resin. ±. θ: to θ. ±..4 ±..4 ±.. ±. θ Epoxy resin. ±. θ: to θ Product mass : approx..g Product mass : approx..g Sheet No.: D-AEN
3 PC94LNSZF Series. SMT Gullwing Lead-Form [ex. PC94LNIPF] 4. SMT Gullwing Lead-Form (VDE option) [ex. PC94LYIPF]. ±.. ±.. ±.. ±. (Unit : mm) Primary side mark PC94L. ±. Primary side mark PC94L 4. ±. 9. ±. Date code 4 9. ±. Date code 4 VDE Identification mark. ±.. ±.. ±.. ±.. ±.. ±..4 ±.. ± Epoxy resin ±.. ± Epoxy resin Product mass : approx..g Product mass : approx..g Plating material : SnCu (Cu : TYP. %) Sheet No.: D-AEN
4 PC94LNSZF Series Date code ( digit) st digit Year of production nd digit Month of production rd digit Week of production A.D Mark A B C D E F H J K L M N A.D 4 9 Mark P R S T U V W X A B C Month January February March April May June July August September October November December Mark 4 9 O N D Week st nd rd 4th.th Mark 4 repeats in a year cycle Country of origin Japan Rank mark There is no rank mark indicator. 4 Sheet No.: D-AEN
5 PC94LNSZF Series Absolute Maximum Ratings Input Output *4 * * (T a = C) Parameter Symbol Rating Unit * Forward current I F ma Reverse voltage V R V Supply voltage V O output current I O. A * O peak output current I OP. A O output current I O. A * O peak output current I OP. A O output voltage V O V * Power dissipation P O mw Total power dissipation P tot mw Isolation voltage V iso (rms). kv Operating temperature T opr 4 to + C Storage temperature T stg to + C Soldering temperature T sol C * The derating factors of a absolute maximum ratings due to ambient temperature are shown in Fig. * Pulse width.µs, Duty ratio :. *, 4 The derating factors of a absolute maximum ratings due to ambient temperature are shown in Fig. * AC for minute, 4 to %RH, f=hz * For s Electro-optical Characteristics * Input Output *9 *9 * Transfer characteristics Response time (Unless otherwise specified T a =T opr ) Parameter Symbol Conditions MIN. TYP. MAX. Unit Forward voltage V F T a = C, I F =ma..4 V V F T a = C, I F =.ma..9 V Reverse current I R T a = C, V R =4V µa Terminal capacitance C t T a = C, V=, f=khz pf Supply voltage V O low level output voltage O high level output voltage O low level output voltage O leak current O leak current High level supply current "Low High" propagation delay time "High Low" propagation delay time Rise time Fall time Instantaneous common mode rejection voltage (High level output) Instantaneous common mode rejection voltage (Low level output) V OL V OH V OL I OL I OL I CCH =4V, I F =ma Low level supply current I CCL =4V, I F = "Low High" input threshold current I FLH T a = C, =4V =4V Isolation resistance T a = C, DCV, 4 to %RH R ISO t PLH t PHL t r t f CM H CM L =V, =V I O =.A, I F =ma =V O =4V, I O =.A, I F =ma =4V, I O =.A, I F = =V O =V, I F = =V O =V, I F =ma T a = C, =4V, I F =ma R G =4Ω, C G = pf T a = C, V CM =.kv(p-p) I F =ma, =4V, V OH =.V T a = C, V CM =.kv(p-p) I F =, =4V, V OL =.V * It shall connect a by-pass capacitor of.µf or more between (pin ) and GND (pin ) near the device, when it measures the transfer characteristics and the output side characteristics * I FLH represents forward current when output goes from "Low" to "High" *9 O output terminal is set to open V V V µa µa ma ma ma ma Ω µs µs µs µs kv/µs kv/µs Sheet No.: D-AEN
6 PC94LNSZF Series Model Line-up Lead Form Through-Hole SMT Gullwing Package Sleeve Taping pcs/sleeve pcs/reel DIN EN4-- Approved Approved Approved Model No. PC94LNSZF PC94LYSZF PC94LNIZF PC94LYIZF PC94LNIPF PC94LYIPF Please contact a local SHARP sales representative to inquire about production status. Sheet No.: D-AEN
7 PC94LNSZF Series Fig. Test Circuit for O Low Level Output Voltage Fig. Test Circuit for O High Level Output Voltage I F V VOL I O I F I O V OH V Fig. Test Circuit for O Low Level Output Voltage Fig.4 Test Circuit for O Leak Current I F V V OL I O I F A I OL Fig. Test Circuit for O Leak Current Fig. Test Circuit for High Level / Low Level Supply Current A I OL A I CC I F I F Sheet No.: D-AEN
8 PC94LNSZF Series Fig. Test Circuit for "Low High" Input Threshold Current I F Variable V Fig. Test Circuit for Response Time t r =t f =.µs V IN Pulse width µs Duty ratio % V OUT R G C G V IN wave form V OUT wave form t PLH t PHL % 9% % % t r t f Fig.9 Test Circuit for Instantaneous Common Mode Rejection Voltage A SW B + V CM V V O V CM wave form CM H, V O wave form SW at A, I F =ma CM L, V O wave form SW at B, I F = V OL V OH V CM (Peak) GND V OH V OL GND Sheet No.: D-AEN
9 PC94LNSZF Series Fig. Forward Current vs. Ambient Temperature Fig. Power Dissipation vs. Ambient Temperature Forward current IF (ma) 4 Power dissipation Po, Ptot (mw) 4 P O P tot 4 Ambient temperature T a ( C) Fig. Forward Current vs. Forward Voltage 4 Fig. "Low High" Relative Input Threshold Current vs. Supply Voltage Ambient temperature T a ( C) T a = C Forward current IF (ma) C T a = C C C C 4 C Relative input threshold current (%) 9 Value of =4V assume Forward voltage V F (V) Fig.4 "Low High" Relative Input Threshold Current vs. Ambient Temperature Relative input threshold current (%) 4 =4V I FLH =% at T a = C 4 Supply voltage (V) Fig. O Low Level Output Voltage vs. O Output Current O low level output voltage VOL (V) T a = C =V =V I F =ma 4 4 Ambient temperature T a ( C) O output current I O (A) 9 Sheet No.: D-AEN
10 PC94LNSZF Series Fig. O Low Level Output Voltage vs. Ambient Temperature O low level output voltage VOL (V) Fig. O High Level Output Voltage vs. Supply Voltage O high level output voltage VOH (V) T a = C I F =ma Ambient temperature T a ( C) =V =V I F =ma I O =.A Fig. O Output Voltage Drop vs. O Output Current High output voltage drop (VOH-VCC) (V) Fig.9 O High Level Output Voltage vs. Ambient Temperature O high level output voltage VOH (V) =4V I F =ma O output current I O (A) I O Nearly=A I O =.A T a = C =V O =4V I F =ma Fig. O Low Level Output Voltage vs. O Output Current O low level output voltage VOL (V) 4 Supply voltage (V) O output current I O (A) T a = C =V O =4V I F = 4 4 Ambient temperature T a ( C) Fig. O Low Level Output Voltage vs. Ambient Temperature O low level output voltage VOL (V) =4V I F = I O =.A. 4 4 Ambient temperature T a ( C) Sheet No.: D-AEN
11 PC94LNSZF Series Fig. High Level Supply Current vs. Supply Voltage High level supply current ICCH (ma)... 4 Supply voltage (V) T a = C I F =ma Fig.4 High Level Supply Current vs. Ambient Temperature High level supply current ICCH (ma) Fig. Propagation Delay Time vs. Forward Current Propagation delay time tphl, tplh (µs) t PHL t PLH T a = C 4 C C C Forward current I F (ma) =V O =4V R G =4Ω C G = pf C =4V I F =ma 4 4 Ambient temperature T a ( C) 4 C Fig. Low Level Supply Current vs. Supply Voltage Low level supply current ICCL (ma)... 4 Supply voltage (V) T a = C I F = Fig. Low Level Supply Current vs. Ambient Temperature Low level supply current ICCL (ma) Fig. Propagation Delay Time vs. Ambient Temperature Propagation delay time tphl, tplh (µs) t PHL t PLH =4V I F = 4 4 Ambient temperature T a ( C) =V O =4V R G =4Ω C G = pf I F =ma 4 4 Ambient temperature T a ( C) Remarks : Please be aware that all data in the graph are just for reference and not for guarantee. Sheet No.: D-AEN
12 PC94LNSZF Series Design Considerations Recommended operating conditions Parameter Forward current Supply voltage Operating temperature Symbol I F MIN. 4 4 TYP. MAX. T opr Unit ma V C Notes about static electricity Transistor of detector side in bipolar configuration may be damaged by static electricity due to its minute design. When handling these devices, general countermeasure against static electricity should be taken to avoid breakdown of devices or degradation of characteristics. Design guide In order to stabilize power supply line, we should certainly recommend to connect a by-pass capacitor of.µf or more between and GND near the device. In case that some sudden big noise caused by voltage variation is provided between primary and secondary terminals of photocoupler some current caused by it is floating capacitance may be generated and result in false operation since current may go through IRED or current may change. If the photocoupler may be used under the circumstances where noise will be generated we recommend to use the bypass capacitors at the both ends of IRED. The detector which is used in this device, has parasitic diode between each pins and GND. There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin becomes below GND level even for instant. Therefore it shall be recommended to design the circuit that electric potential of any pin does not become below GND level. This product is not designed against irradiation and incorporates non-coherent IRED. This photocoupler is dedicated to the use for IGBT or MOSFET Gate Drive. Please do not use this for the other application. As mentioned below, when the input is on, if DC load (resistor etc.) is connected between O output pin and GND pin and if the electric potential V O goes approx. V below than electric potential pin continuously, supply current I CC may flow more than usually and go beyond power dissipation. A V or more I F Sheet No.: D-AEN
13 Degradation PC94LNSZF Series In general, the emission of the IRED used in photocouplers will degrade over time. In the case of long term operation, please take the general IRED degradation (% degradation over years) into the design consideration. Please decide the input current which become times of MAX. I FLH. Recommended Foot Print (reference) (Unit : mm) For additional design assistance, please review our corresponding Optoelectronic Application Notes. Sheet No.: D-AEN
14 PC94LNSZF Series Manufacturing Guidelines Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. ( C) Terminal : C peak ( package surface : C peak) Preheat to C, s or less Reflow C or more, s or less 4 (min) Flow Soldering : Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below C and within s. Preheating is within the bounds of to C and to s. Please don't solder more than twice. Hand soldering Hand soldering should be completed within s when the point of solder iron is below 4 C. Please don't solder more than twice. Other notices Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions. 4 Sheet No.: D-AEN
15 Cleaning instructions Solvent cleaning: Solvent temperature should be 4 C or below Immersion time should be minutes or less PC94LNSZF Series Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. Recommended solvent materials: Ethyl alcohol, Methyl alcohol and Isopropyl alcohol In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin. Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride,..-trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (/9/EC). Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE). Sheet No.: D-AEN
16 PC94LNSZF Series Package specification Sleeve package Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. pcs. of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its primary side mark on the tabless stopper side. MAX. sleeves in one case. Sleeve outline dimensions. ±... (Unit : mm) Sheet No.: D-AEN
17 PC94LNSZF Series Tape and Reel package Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F E D G I J H H A B C C D E K Dimensions List A B. ±.. ±.. ±.. ±. H I J K.4 ±..4 ±. 4. ±.. ±.. ±. MAX. (Unit : mm) F G 4. ±. φ. +. Reel structure and Dimensions e d g c a f b Dimensions List (Unit : mm) a b. ±. c ±. d ±. e ±. f. ±. g. ±. Direction of product insertion Pull-out direction [Packing : pcs/reel] Sheet No.: D-AEN
18 PC94LNSZF Series Important Notices The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. Contact and consult with a SHARP representative if there are any questions about the contents of this publication. [E] Sheet No.: D-AEN
( ) DIN EN : successor standard of DIN VDE0884
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GPS94JF Gap : 3.5mm Slit :.3mm Phototransistor Output, Compact Transmissive Photointerrupter Description GPS94JF is a compact-package, phototransistor output, transmissive photointerrupter, with opposing
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GP1S50J0000F Gap : 3mm, Slit : 0.5mm Phototransistor Output, Case package Transmissive Photointerrupter Description GP1S50J0000F is a standard, phototransistor output, transmissive photointerrupter with
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PC3H4J00001H Series Mini-flat Half Pitch Package, AC Input Photocoupler Description PC3H4J00001H Series contains an IRED optically coupled to a phototransistor. It is packaged in a 4-pin Mini-flat, half
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PCSDNTZ Series V DRM : 600V type is also available. (PC3SDNTZ Series) VDRM : 400V Nonzero cross type DIP 6pin Phototriac Coupler for triggering Description PCSDNTZ Series Phototriac Coupler include an
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PC851XNNSZ1H Series DIP 4pin High Collector-emitter Voltage Photocoupler Description PC851XNNSZ1H Series contains an IRED optically coupled to a phototransistor. It is packaged in a 4-pin DIP, available
More information* "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signalprocessing
GPA57HRJF Gap : mm, Slit :.8mm *OPIC Output Case package Transmissive Photointerrupter Description GPA57HRJF is a standard, OPIC output, transmissive photointerrupter with opposing emitter and detector
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PC123XxYSZ1B Series PC123XxYSZ1B Series DIP 4pin Reinforced Insulation Type Photocoupler Description PC123XxYSZ1B Series contains an IRED optically coupled to a phototransistor. It is packaged in a 4-pin
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Phototransistor Features 1. Side view detection type 2. Plastic mold with resin lens 3. Narrow directivity angle 4. Visible light cut-off resin 5. Lead free and RoHS directive component Agency Approvals/Compliance
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PC1231xNSZ1B Series DIP 4pin Reinforced Insulation Type, High CMR, Low Input Current Photocoupler Description PC1231xNSZ1B Series contains an IRED optically coupled to a phototransistor. It is packaged
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GP1FAV51RK0F Fiber Optic Receiver Square connector With mounting hole With shutter Description GP1FAV51RK0F employs an OPIC device that integrates a photodiode and signal processing circuit onto a single
More information5-0.4 (1.27) Parameter Symbol Rating Unit Forward current IF 50 ma
GPA7HR GPA7HR Wide Gap Type OPIC Photointerrupter Features. Wide gap between LED and detector (mm ). High accuracy mounting type with positioning pin 3. Built-in schmidt-trigger circuit 4. PWB mounting
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S2S3 Series Zero cross type is also available. (S2S4 Series) VDRM : 600V, Non-zero cross type Mini-Flat Package Phototriac Coupler for triggering Description S2S3 Series Phototriac Coupler include an infrared
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GPA75EJ000F Gap : 5mm Slit : 0.5mm *OPIC Output, Screw fixing type Transmissive Photointerrupter with Connector Description GPA75EJ000F are standard, OPIC output, transmissive photointerrupters with opposing
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GPA53HRJF Gap : 5mm, Slit :.5mm *OPIC Output Case package Transmissive Photointerrupter Description GPA53HRJF is a standard, OPIC output, transmissive photointerrupter with opposing emitter and detector
More informationParamerter Symbol Rating Unit Forward currnt IF 50 ma
GP1A58HR OPIC Photointerrupter Features 1. High sensing accuracy (Slit width:.5mm ). PWB mounting type Applications 1. OA equipment such as printers, facsimiles, etc.. VCRs Outline Dimensions (.5) A58
More informationParameter Symbol Rating Unit. Reverse voltage V R 5 V *1 *2Power dissipation P 40 mw. P C 60 mw
PC9D PC9D Ultra-high Speed Response, -channel OPIC Photocoupler Features. Built-in -channel. Ultra-high speed response ( tphl, t PLH : TYP. ns at R L= Ω ). Isolation voltage between input and output (
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PC PC Compact, Surface Mount Ultra-high Speed Response OPIC Photocoupler Features Outline Dimensions ( Unit : mm). Mini-flat package 2. Ultra-high speed response ( tplh, : TYP. ns at R L = Ω ).27 ±.2 Internal
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PC96 PC96 DC Input Type OPIC Photocoupler with Built-in ON/OFF Delay Circuit Features Outline Dimensions (Unit : mm ) 1. Propagation delay time 2. ±.2 ( t PHL, t PLH : TYP..7ms ) 16 1 1 13 12 11 1 9 2.
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Series Zero cross type is also available. (S0T0 Series/ S0T0 Series) IT(rms) A, Non-Zero Cross type Low profile SIP 4pin Triac output SSR Description Series and Solid State Relays (SSR) are an integration
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PC87X Lead forming type (I type) and taping reel type (P type) are also available. (PC87XI/PC87XP) TÜ (DE88) approved type is also available as an option. (approved name:pc87) Features Outline Dimensions.
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GPS5VJF GPS5VJF Gap : mm Slit :.5mm Phototransistor Output, Case package Transmissive Photointerrupter Description GPS5VJF is a standard, phototransistor output, transmissive photointerrupter with opposing
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GP1S194HCZ0F Gap : 1.7mm, Slit : 0.3mm Phototransistor Output, Compact Transmissive Photointerrupter Description GP1S194HCZ0F is a compact and low-profile, transmissive photointerrupter with photo-transistor
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Non-zero cross type is also available. (ST01 Series/ S0T01 Series) IT(rms) A, Zero Cross type Low profile SIP 4pin Triac output SSR Description and Solid State Relays (SSR) are an integration of an infrared
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GP2S700HCP SMT, Detecting Distance : 3mm Phototransistor Output, Compact Reflective Photointerrupter Description GP2S700HCP is a compact-package, phototransistor output, reflective photointerrupter, with
More informationParameter Symbol Rating Unit Forward current. IF 50 ma. P C 150 mw P tot 170 mw V iso 3.75 kv rms T opr - 30 to C.
PC4T PC4T Features. Built-in breakdown diode for absorption of surge voltage 2. High current transfer ratio ( CTR: MIN. % at I F = ma ) 3. Mini-flat package 4. Applicable to soldering reflow. Available
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PC/PCF PC/PCF DIN-DE88 approved type (PCY/PCFY) is also available as an option. Features. Conform to European Safetty Standard. Internal isolation distance:.mm or more. High collector-emitter voltage (
More informationREFERENCE PC817X*CSZ9F. Product name : PHOTOCOUPLER. Model No. : PC817 PC817XNCSZ9F PC817X1CSZ9F PC817X2CSZ9F PC817X3CSZ9F PC817X4CSZ9F
Product name : PHOTOCOUPLER Model No. : PC817 Business dealing name PC817XNCSZ9F PC817X1CSZ9F PC817X2CSZ9F PC817X3CSZ9F PC817X4CSZ9F 1. These specification sheets include materials protected under copyright
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GP2S60 SMT, Detecting Distance : 0.5mm Phototransistor Output, Compact Reflective Photointerrupter Description GP2S60 is a compact-package, phototransistor output, reflective photointerrupter, with emitter
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GPS74PJF GPS74PJF Gap : 5mm Slit :.5mm Phototransistor Output, Snap-in fixing Transmissive Photointerrupter with Connector Description GPS74PJF is a standard, phototransistor output, transmissive photointerrupter
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SPEC. No. ED-14P018A ISSUE April 27, 2015 SYSTEM DEVICE UNIT ELECTRONIC COMPONENTS AND DEVICES DIVISION SHARP CORPORATION SPECIFICATION DEVICE SPECIFICATION FOR MODEL No. PHOTOCOUPLER PC817 Business dealing
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