Ametek Electronic Packaging s S-Bend Ceramic Feedthrough Design for Enhanced RF Performance. IMAPS NEW ENGLAND 2015 Boxborough, MA

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1 MICROELECTRONIC PACKAGES HEADERS & TERMINALS CERAMIC SOLUTIONS Ametek Electronic Packaging s S-Bend Ceramic Feedthrough Design for Enhanced RF Performance IMAPS NEW ENGLAND 2015 Boxborough, MA Ken McGillivray 5 May

2 DESIGN CHALLENGE Hermetic Packages for Telecommunication Applications Require Improved Signal Speed Up to 40 GHz and Higher Conventional Ceramic Feedthroughs Have Performance Limitations Due to the Use of Via Transitions that Distort the RF Signal Path through Abrupt 90 Bends

3 INTRODUCTION of S-BEND CERAMIC FEEDTHROUGH AMETEK s S-Bend Ceramic Feedthrough Provides a Smooth Uninterrupted Signal Path for Superior RF Performance The S-Bend Design Eliminates the Requirement for Vias in the Signal Path

CONVENTIONAL HTCC DESIGN IS FLAT Multilayer Structure Similar to Printed Wiring Board (PWB) High Routing Density Solid Metal Planes Power / Ground Controlled

4 CONVENTIONAL HTCC DESIGN IS FLAT Multilayer Structure Similar to Printed Wiring Board (PWB) High Routing Density Solid Metal Planes Power / Ground Controlled Impedance Cross-talk Shield Differential Signal Pairs Wirebondable Pads Kovar Sealrings Parallel Seam Sealable Laser Weldable Brazed-On Terminals Pins Leads Solder Pads

5 100G Receiver Module Conventional Ceramic RF Feedthrough Uses Via Transitions to Direct the RF Signal Path through the Ceramic Feedthrough 100G Receiver Module

6 Conventional Ceramic Feedthrough Conventional Ceramic Feedthrough Uses Vias to Direct the RF Signal Path from the Input Pads on Top of the Feedthrough Down to the Output Leads on the Bottom RF Circuit Path *See US Patent 6,933,450 B2, August 23, 2005 Kyocera Corporation

7 S-Bend Ceramic Feedthrough S-Bend Ceramic Feedthrough has a Smooth Uninterrupted Signal Path to Direct the RF Signal Path from the Input Pads on Top of the Feedthrough Down to the Output Leads on the Bottom RF Circuit Path *See US Patent Application 14/323,046 July 3, 2014 Ametek Aegis

8 Cross-Section View of S-Bend Ceramic Feedthrough

9 HTCC HIGH TEMPERATURE COFIRED CERAMIC MATERIAL PROCESS ADVANTAGE CERAMIC TAPE IS FLEXIBLE PRIOR TO SINTERING

10 CERAMIC TAPE IS FLEXIBLE Process Review

11 S-BEND CERAMIC RF FEEDTHROUGH DESIGN ADVANTAGES

12 100G Receiver with S-Bend Ceramic Feedthrough AMETEK S S-Bend Feedthrough Advantage Improved RF Performance by Eliminating Via Transitions *Patent Pending

S-Bend Ceramic Feedthrough for 100G Receiver Application Smooth, Uninterrupted RF Signal Path Increased Bandwidth 25 mm Height is Possible Eliminates

13 S-Bend Ceramic Feedthrough for 100G Receiver Application Smooth, Uninterrupted RF Signal Path Increased Bandwidth 25 mm Height is Possible Eliminates 90 Via Transitions Reduced Return Loss Reduced Transmission Loss 80 GHz May be Achievable S-Bend Ceramic Feedthrough Smooth Uninterrupted RF Signal Path

14 S-Bend Ceramic Feedthrough Ametek Electronic Packaging's New "S-Bend Ceramic Feedthrough offers a high speed design solution to achieve higher bandwidth signal performance in hermetic packages. Ametek's "S-Bend Ceramic Feedthrough" design provides a smooth, uninterrupted RF signal path from the wirebond shelf inside the package down to the printed wiring board outside the package without 90 degree via transitions. Superior performance at operating frequencies up to 80 GHz may be achieved.

15 S-Bend Ceramic Feedthrough Eliminates RF Reflection The S-Bend design eliminates the RF reflection caused by 90 degree via transitions. A bandwidth performance increase is achieved as the result of the reduced reflection coefficient (no via transitions) and the related benefits of reduced return loss and reduced transmission loss.

16 S-Bend Ceramic Feedthrough Pitch and Height Advantage This design may be applied to hermetic package applications requiring compact interconnect separation of inch and smaller, as compared to larger SMP and SSMP designs. Vertical signal paths (0.01 to 1 inch height) connecting the internal RF devices with the external printed wiring board can be accommodated, providing a solution for mismatched "device height" to "board height" design scenarios.

17 Summary of S-Bend Ceramic Feedthrough Advantages Smooth Uninterrupted RF Signal Path No Vias in Signal Path No 90 Via Transitions Reduced Reflection Coefficient Reduced Return Loss Reduced Transmission Loss Increased Bandwidth Performance Frequencies to 80 GHz (and higher) may be achieved 25 mm Height is Possible

18 S-BEND FEEDTHROUGH MARKET REQUIREMENT

19 S-Bend Ceramic Feedthrough

20 HTCC CERAMIC MATERIAL ELECTRICAL CHARACTERIZATION DIELECTIC CONSTANT AND LOSS TANGENT AT FREQUENCIES UP TO 30 GHz HTCC: Refers to High Temperature Cofired Ceramic, 94% Alumina

21 White Alumina Characterization Report University of California, Davis and RLS Design, Inc Rick Sturdivant, CTO *Presented at the 2014 IMAPS RF and Microwave Packaging Workshop. San Diego, CA. April 8-9, 2014.

22 Parts Tested White HTCC alumina from Ametek was designed for testing at a probe station using ground-signal-ground probes to 30GHz

23 Parts Tested Port1 Gap Coupling W R a Gap Coupling Port2 Image of Resonator

24 Test System Shows Alumina With RF Probes The test system is at UC Davis and consists of an Agilent vector network analyzer and cascade microtech probe station with PicoProbe GSG probes rated to 40GHz.

25 Port1 Electrical Model For Ring Resonator Gap Model C 2 C 1 nλ 2 = πr m λ = c Ring Model Tline, L Tline, L Data Deembedding Gap Model C 1 C 2 Port2 f ε reff f n = The resonances that occur in the ring can be predicted by realizing that the resonances occur when each of the line sections satisfy L=pR m where R m = R a +W/2 = the approximate mean radius of the ring. nc 2π(R a + W 2 ) ε eff (f) Gives the resonant frequencies as a function of effective dielectric constant

26 Port1 Electrical Model For Ring Resonator Gap Model C 2 C 1 nλ 2 = πr m λ = c Ring Model Tline, L Tline, L Data Deembedding Gap Model C 1 C 2 Port2 f ε reff f n = The resonances that occur in the ring can be predicted by realizing that the resonances occur when each of the line sections satisfy L=pR m where R m = R a +W/2 = the approximate mean radius of the ring. nc 2π(R a + W 2 ) ε eff (f) Gives the resonant frequencies as a function of effective dielectric constant

27 White Alumina HTCC Material Parameters From Ring Resonator Test C1=0.018 C2=0.005 L1=376.9 Er=8.517 Tand=0.004 MSUB Er=Er H=15 mil T=1 mil Rho=2.2 Tand=Tand ErNom=3.38 Name=SUB Ring Resonator Test Comparision PORT P=1 Z=50 Ohm MLIN ID=TL6 W=15 mil L=55 mil CAP ID=C4 C=C2 pf CAP ID=C3 C=C1 pf MLIN ID=TL1 W=15 mil L=L1 mil MLIN ID=TL2 W=15 mil L=L1 mil CAP ID=C1 C=C1 pf CAP ID=C2 C=C2 pf MLIN ID=TL5 W=15 mil L=55 mil PORT P=2 Z=50 O Insertion Loss (db) Frequency (GHz) Dielectric constant is and the loss tangent is approximately (4/6/2015) The black lines are the model and the colored lines are the measured data.

28 White Alumina Transmission Line Test Material Parameter Extraction Insertion Loss (db/inch) Thick Film Microstrip HTCCMicrostrip Thick Film CPW Frequency (GHz) White HTCC alumina microstrip lines have a measured insertion loss of 0.7dB per inch at 20GHz.

29 Conclusions Dielectric constant of white alumina is approximately (4/6/2015) Loss tangent of white alumina is approximately The transmission line loss of microstrip line in white alumina is 0.7dB per inch at 20GHz

30 Welcome To Ametek Electronic Packaging Aegis 50 Welby Road New Bedford, Massachusetts United States Phone: Fax: Website: Glasseal Products 485 Oberlin Avenue, South Lakewood, New Jersey United States Phone: Fax: Website:

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