HIGHLY ACCELERATED LIFE TEST REPORT. CoreModule 410

Transcription

1 HIGHLY ACCELERATED LIFE TEST REPORT CoreModule 410 Prepared for: Mr. Tom Davenport Ampro Computers, Inc Hellyer Avenue, Unit 110 San Jose, California phone: Page 1 of 29

2 Highly Accelerated Life Test Report Document Number 266 Test Dates: 12/10/ /12/2003 CoreModule 410 Testing Performed for: Ampro Computers, Inc. Phone: (408) Mr. Tom Davenport Fax: (408) Hellyer Avenue, Unit San Jose, CA Testing Performed by: Phone: (408) Ken Duncan Fax: (408) Thomas Road Santa Clara, CA Reference Documents Document Revision Number Date Issued Quotation SV1447A 12/8/03 Invoice Number /15/03 Page 2 of 29

3 1. Objective Highly Accelerated Life Testing (H.A.L.T.) is performed to uncover latent defects in product design, component selection and/or manufacturing that would not otherwise be found through conventional qualification methods. The process subjects the test product to progressively higher stress levels, incorporating thermal dwells, rapid temperature transitions, vibration, and a combination of temperature and vibration to precipitate inherent defects. Moreover, H.A.L.T. stresses the product to failure in order to assess design robustness and margin above its intended operation. 2. Scope To find the weak links in product design, document failure modes, and determine the true operating and destruct limits using repeatable testing techniques such as thermal step stress, rapid thermal transitions, vibration step stress, and combined temperature and vibration environments. By subjecting the product to increasing levels of stress, long term failure modes that would show up under normal operating conditions in months or years can be revealed in just hours or days. An essential component of H.A.L.T. is root cause analysis and the identification and implementation of corrective action to ensure the product integrity, thus increasing the product s reliability and the robustness of design. 3. Acronyms and Definitions H.A.L.T. Highly accelerated life test H.A.S.S. Highly accelerated stress screen UUT Unit under test Operating Limit (OL) - The operating limit is defined as the last operational temperature or vibration set point prior to failure. Destruct Limit (DL) - The destruct limit is the level at which the product stops functioning and remains inoperable at normal operating conditions. Grms Gravity Root Means Squared Page 3 of 29

4 4. Test Results Table 1: Operating and Destruct Limits Stress Condition Cold Temperature OL Hot Temperature OL Vibration OL Cold Temperature DL Hot Temperature DL Vibration DL Chamber Setpoint <-100 C (-148 F) 120 C (248 F) 45 Grms <-100 C (-148 F) >150 C (302 F) >50 Grms Highlights of failure modes and weaknesses discovered during the HALT process: Thermal Step Stress: The two units under test were fully functional at -100 C. At +130 C, both units under test failed extended memory test. The units were power cycled and did not reboot. Both units recovered at +120 C. At +150 C, the two units locked up at the beginning of the dwell. Both units recovered at +20 C. Rapid Thermal Transitions: There were no weaknesses discovered during rapid thermal transitions. Vibration Step Stress: At 50 Grms, SN_3071 locked up during extended memory test. The unit recovered at 5 Grms. SN_3132 was fully functional at the 50 Grms step. Combined Environment: During the first cycle at +100 C and 10 Grms vibration, SN_3071 locked up during extended memory test. The unit was power cycled with no change. Testing was paused at the end of the first cycle and SN_3071 was replace with SN_3022. SN_3132 failed during the transition to -50 C and at start of 50 Grms vibration step. Page 4 of 29

5 5. Products Tested The units subjected to the H.A.L.T process are documented below. Table 2: Product Identification Description Model number Serial number CoreModule 410 CM2-410-Q-01 FL01B8AA CoreModule 410 CM2-410-Q-01 FL01B8AA CoreModule 410* CM2-410-Q-01 FL01B8AA * Replaced SN_3071 during combined temperature and vibration test profile. 6. Test Equipment and Setup 6.1 Test Equipment Equipment used to conduct the H.A.L.T. testing is detailed below. Any test equipment that requires periodic calibration was in current calibration at time of test. The calibration certifications are traceable to the National Institute of Standards and Technology. Table 3: Customer Test Equipment Description Manufacturer Model number DC power supply Kenwood PD18-10AD 4-Port KVM Switch OmniView Pro2 Series F3X1105-XX Page 5 of 29

6 Table 4: Reliant Labs Test Equipment Lab 2 Description Manufacturer Model number Serial Number Calibration Due HALT Chamber QualMark OVS 2.5LF /03/03 Data Logger Fluke Hydra 2620A /22/04 Thermocouples Omega C03-T-60 / TT-T-30 NA Accelerometer Control Dytran 3030C /20/03 Accelerometer Ch. 1 Dytran 3030B /12/04 Accelerometer Ch. 2 PCB 352A /14/04 Spectrum National PCI-6023E C35D3D 06/03/04 Analyzer/DAQ Instruments Spectrum Dytran /30/04 Analyzer/Signal Cond. Video Microscope PTEM Zoom NA Page 6 of 29

7 6.2 Temperature Test Setup During the thermal testing the unit s cover or chassis was removed and the airflow from the chamber was directed onto the UUT using 4 aluminum ducting. This allowed for better temperature stabilization during the thermal step stress and faster ramp rates during the rapid thermal transition process. The UUT was placed on aluminum u-channel to prevent the chassis from heat syncing to the vibration table. Thermocouples were attached to the UUT to monitor the temperature of the product at various locations. The locations of the thermocouple placements are located in the table below. Pictures illustrating the temperature test setup are located in Appendix A. Table 5: Data collection points for temperature and voltage monitoring. Fluke Data logger Channel Assignment Channel Type Location or Description 1 TC Used to monitor chamber control thermocouple 2 TC Used to monitor air thermocouple 3 TC Processor U1 SN TC Extended memory U4 SN TC Extended memory U3 SN TC Processor U1 SN TC Extended memory U4 SN TC Extended memory U3 SN 3132 Page 7 of 29

8 Figure 1 - Temperature Setup for CM410 Figure 2 Thermocouple Locations for CM410 Page 8 of 29

9 6.3 Vibration Test Setup The UUT was mounted to the vibration table using two 20 L x 1 W x 1 H sections of aluminum u-channel. The u-channel was bolted to the vibration table at four locations using 3/8-16 threaded steel rod. Pictures illustrating the fixture setup are located in Appendix A. Accelerometers were attached to the UUT to measure the vibration response on the product at various locations. The location of each accelerometer is located in the table below. More detailed pictures illustrating the vibration fixture and the locations of accelerometers are located in Appendix A. Table 6: Accelerometer Locations. Spectrum Analyzer Channel Assignment Channel Axis Location or Description 1 Z Mounted underneath the vibration table at center. 2 Z Mounted on top of U1, SN_3132 Note: The X-axis runs through the chamber doors, the Y-axis runs from the access portal to air plenum, and the Z-axis is vertical to the vibration table. Figure 3 Vibration Setup for CM410 Page 9 of 29

10 7. Functional Test Description During the HALT the UUT was continually monitored for functionality. When a failure occurred the test diagnostics logged the failure data and all attempts to determine the cause of failure were made. Test equipment used to monitor the UUT was set up on a bench outside the H.A.L.T. chamber. Cables, wires, and power cords were fed through the chamber access port. Before running the H.A.L.T., the following modifications were made to the UUT: Quicktech PRO 2000 Version 3.33 software used to monitor functional test results. Functional test result files were stored on chip memory residing on the UUT. Used 5.17 volts nominal load. Each UUT pulled ~2.0 Amps for total of 4.0 Amps. (Kenwood DC power supply, mdl #. PD36-10AD) Test hardware setup could support 1 to 4 units under test. Functional test list for UUT using QTPRO Version 3.33 CPU NPU INT #1 Controller INT #2 Controller DMA #1 Controller DMA #2 Controller LPT 1 (378) No Loop Back COM 1 (3F8) AutoDetect COM 2 (2F8) AutoDetect Extended Memory Base Memory 7.1 Failure Characterization During the HALT process, any abnormalities are considered possible failure modes until they can be determined otherwise. To establish clear failure characterization the list below details acceptable specifications and/or unit functionality. Diagnostic software displayed a PASS / FAIL status to PC monitor for each UUT. Failure status is continuously reported. HW LEDS showing power status were visible in chamber for each UUT. Page 10 of 29

11 7.2 Fault Recovery When a failure occurred the environmental stress was reduced to determine when the UUT recovered. Once the UUT recovered, the environmental stress was increased to determine if the failure mode was repeatable. 1. If the UUT was still functional after repeating the failure mode, the environmental stress was increased until additional failure modes were determined or a hard failure occurred. 2. If the UUT was not functional after repeating the failure mode, an attempt was made to mask the failure and continue testing in pursuant of additional failure modes. Figure 4 Test Equipment / Lab Setup for CM410 Page 11 of 29

12 8. HALT Results 8.1 Cold Temperature Step Stress The cold temperature step stress began at +20 C and decreased in 10 C increments. The dwell time at each thermal step was 10 minutes. The dwell time began after the component temperatures on the UUT stabilized. Airflow from the chamber was directed onto the UUT using 4 aluminum ducting, and the UUT was placed on aluminum u-channel to prevent the chassis from heat sinking to the vibration table. Pictures illustrating the temperature step stress setup are located in Appendix A. The UUT was monitored for functionality throughout the cold temperature step stress process. Lower Operating Limit (LOL): -100 C / -148 F Lower Destruct Limit: (LDL): -100 C / -148 F Table 7: Cold Step Stress Results Chamber Set point ( C) Pass/Fail Comments +20 Pass Note: At the end of each cold step, the units were power cycled. +10 Pass 0 Pass -10 Pass -20 Pass -30 Pass -40 Pass -50 Pass -60 Pass -70 Pass -80 Pass -90 Pass -100 Pass Page 12 of 29

13 Table 8: Temperatures Recorded During the Cold Temperature Step Stress ( C) HALT Report Number 266 Set point ( C) U1 U4 U3 U1 U4 U3 Control 1 Control 2 SN_3071 SN_3071 SN_3071 SN_3132 SN_3132 SN_ Note: Thermocouple Locations are documented in Table Cold Temperature Step Stress 20 0 Temperature (C) :40 14:45 14:50 14:55 15:00 15:05 15:10 15:15 15:20 15:25 15:30 15:35 15:40 15:45 15:50 15:55 16:00 16:05 16:10 16:15 16:20 16:25 16:30 16:35 16:40 16:45 16:50 16:55 17:00 17:05 17:10 17:15 Chamber control Chamber control U1 SN_3071 U4 SN_3071 U3 SN_3071 U1 SN_3132 U4 SN_3132 U3 SN_3132 Time Page 13 of 29

14 8.2 Hot Temperature Step Stress The Hot temperature step stress began at +30 C and increased in 10 C increments. The dwell time at each thermal step was 10 minutes. The dwell time began after the component temperatures on the UUT stabilized. Airflow from the chamber was directed onto the UUT using 4 aluminum ducting, and the UUT was placed on aluminum u-channel to prevent the chassis from heat sinking to the vibration table. Pictures illustrating the temperature step stress setup are located in Appendix A. The UUT was monitored for functionality throughout the hot temperature step stress process. Upper Operating Limit (UOL): +120 C / +248 F Upper Destruct Limit (UDL): >+150 C / +302 F Table 9: Hot Step Stress Results Chamber Set point ( C) Pass/Fail Comments +30 Pass Note: after each test sequence the units were power cycled to restart test sequence. +40 Pass Power cycled successfully. +50 Pass +60 Pass Power cycled successfully. +70 Pass Power cycled successfully. +80 Pass +90 Pass Power cycled successfully Pass +110 Pass +120 Pass +130 Fail +140 Fail +150 Fail Failed extended memory test. UUT #1(SN_3132) had bit fallout at 2-4, 6-8, and MB range. UUT #2(SN_3071) had bit fallout at 6-8, and MB range. Both failed to reboot. Returned to 120 C, both units had successful reboot and test sequence was completed successfully. Failed extended memory test. Both units had bit fallout from 1 to 16 MB. UUT #2(SN_3071) was rebooted from keyboard, UUT #1(SN_3132) would not reboot from keyboard. Both units failed to reboot when power cycled. Chamber set to 120 C, successfully rebooted both units by power cycling. Both units failed, locked, at start of soak. Both units locked during Internal loopback transmission. Component temperatures ranged from 150 C to 159 C. +20 Pass Both units successfully rebooted and completed all test sequences. Page 14 of 29

15 Table 10: Temperatures Recorded During the Hot Temperature Step Stress ( C) Set point ( C) U1 U4 U3 U1 U4 U3 Control 1 Control 2 SN_3071 SN_3071 SN_3071 SN_3132 SN_3132 SN_ Note: Thermocouple Locations are documented in Table Hot Temperature Step Stress Temperature (C) :26 9:35 9:40 9:45 9:50 9:55 10:00 10:05 10:10 10:15 10:20 10:25 10:30 10:35 10:40 10:45 10:50 10:55 11:00 11:05 11:10 11:15 11:20 11:25 11:30 11:35 11:40 11:45 11:50 11:55 12:00 12:05 12:10 12:15 12:20 12:25 12:30 12:35 12:40 Chamber control Chamber control U1 SN_3071 U4 SN_3071 U3 SN_3071 U1 SN_3132 U4 SN_3132 U3 SN_3132 Time Page 15 of 29

16 8.3 Rapid Thermal Transitions The UUT was exposed to 5 rapid temperature cycles from 50 C to +100 C. The dwell time at each extreme was 10 minutes and the thermal transition rate was set to 70 C per minute. The actual thermal transition rate on the product was 65 C per minute. This transition rate was calculated by averaging the product response and chamber control thermocouples. The UUT was monitored for functionality throughout the rapid thermal transition process. Upper Set Point: +100 C / +212 F Lower Set Point: -50 C / -58 F Chamber Programmed Rate of Change: 70 C/min Calculated Product Rate of Change: 65 C/min Table 11: Rapid Thermal Transition Results Cycle Chamber Set point ( C) Pass/Fail Comments Pass Power cycled successfully. 1 Transition Pass 1-50 Pass 1 Transition Pass Pass Power cycled successfully. 1/2 Transition Pass 2-50 Pass Power cycled successfully. 2 Transition Pass Pass Power cycled successfully. 2/3 Transition Pass 3-50 Pass Power cycled successfully. 3 Transition Pass Pass Power cycled successfully. Page 16 of 29

17 3/4 Transition Pass 4-50 Pass 4 Transition Pass Pass Power cycled successfully. 4/5 Transition Pass 5-50 Pass 5 Transition Pass Pass Power cycled successfully. 5 Transition Pass +20 Pass Page 17 of 29

18 140 Rapid Thermal Transitions Temperature (C) :40 13:45 13:50 13:55 14:00 14:05 14:10 14:15 14:20 14:25 14:30 14:35 14:40 14:45 14:50 14:55 15:00 15:05 15:10 15:15 15:20 15:25 15:30 15:35 15:40 15:45 15:50 15:55 16:00 16:05 Chamber Control Chamber Control U1 SN_3071 U4 SN_3071 U3 SN_3071 U1 SN_3132 U4 SN_3132 U3 SN_3132 Time Average Rate of Change Temperature (C) / Average ROC (C/min) :40 13:45 13:50 13:55 14:00 14:05 14:10 14:15 14:20 14:25 14:30 14:35 14:40 14:45 14:50 14:55 15:00 15:05 15:10 15:15 15:20 15:25 15:30 15:35 15:40 15:45 15:50 15:55 16:00 16:05 Time Average Temperature Average Rate of Change Page 18 of 29

19 8.4 Vibration Step Stress The UUT was mounted to the vibration table using two 20 L x 1 W x 1 H sections of aluminum u-channel. The u-channel was bolted to the vibration table at four locations using 3/8-16 threaded steel rod. Pictures illustrating the fixture setup are located in Appendix A. Accelerometers were attached to the UUT to measure the vibration response on the product. The location of each accelerometer is located in Table 15. Pictures illustrating the locations of the accelerometers are located in Appendix A. The vibration step stress began at a set point of 5 Grms and was increased in 5 Grms increments. The dwell time at each set point was 10 minutes. After the 30 Grms level, the vibration was decreased to 5 Grms to determine if a failure occurred that was not detected at the higher vibration level. If a failure was not detected during this tickle vibration, the vibration was increased to the next level. The temperature was set to 20 C. The UUT was monitored for functionality throughout the test. Table 12: Vibration Step Stress Results Chamber Set point (Grms) Pass/Fail Comments 0 Pass 5 Pass 10 Pass Power cycled successfully. 15 Pass 20 Pass Power cycled successfully. 25 Pass 30 Pass Power cycled successfully. 5 Pass 35 Anomaly 5 Pass 40 Pass 5 Pass 45 Anomaly Power cycled successfully. Note: SN_3071 on board SW test sequence is not keeping up with SN_3132. Power cycled successfully. Accelerometer data on SN_3132 appeared incorrect during 35 and 40 Grms steps. It was discovered that the unit was not secured to test fixture causing the reduced vibration level. Opened chamber door and found that the fixture HW had backed off. Replaced jam nuts holding PWA to stand-offs with lock washers and tall stand-offs for adequate access to fasteners. Power cycled successfully. Ribbon cable connector separated on SN_3132 at 45 Grms. SN_3071 was ok. Video on SN_3071 is degraded. 5 Pass After 5 Grms step, opened chamber door and secured connectors. Power cycled successfully at start of 50 Grms step. SN_3071 locked up during extended memory 50 Fail test. Completed 50 Grms step. SN_3132 passed all test sequences. 5 Pass Both units Power cycled successfully. Page 19 of 29

20 8.5 Vibration Measurements Vibration levels were measured at one product location during the vibration step stress. The vibration measurements on the product were taken using a National Instruments spectrum analyzer. The bandwidths used to calculate the Grms levels on the product were 2Hz to 2,500Hz and 2Hz to 10,000Hz using a digital filter at 2,500Hz and 10,000Hz. During each vibration step, a power spectral density plot was taken showing the calculated Grms level on the product and the distribution of energy over the desired frequency bands 2Hz to 2,500Hz and 2Hz to 10,000Hz. The Grms levels measured on the product are shown in the table below and the spectral density plots are located in Appendix B (See Table 15 for accelerometer locations). Table 13: Vibration Levels Measured During Vibration Step Stress (Grms) Chamber Channel 1 Channel 2 Setpoint 2Hz-2.5kHz 2Hz-10kHz 2Hz-2.5kHz 2Hz-10kHz * 32.0* * 33.0* * Fixture stand-off jam nuts holding UUT PWA s backed off Table 14: Transmissibility Ratio (Energy at Product (response) vs. Input Energy) Transmissibility of Energy from Vibration Table to Product Chamber Setpoint Channel 1 Input Channel 2 Response/Input Channel 3 Response/Input Channel 4 Response/Input N/a N/a N/a N/a N/a N/a Note: Calculation made using Channel 1 (2Hz 2.5kHz) frequency band. Page 20 of 29

21 Table 15: Accelerometer Placement Spectrum Analyzer Channel Assignment Channel Axis Location or Description 1 Z Mounted underneath the vibration table at center. 2 Z Mounted on top of U1, SN_3132 Note: The X-axis runs through the chamber doors, the Y-axis runs from the access portal to air plenum, and the Z-axis is vertical to the vibration table. Vibration Step Stress Temperature (C) / Vibration (Grms) :15 16:20 16:25 16:30 16:35 16:40 16:45 16:50 16:55 17:00 17:05 17:10 17:15 17:21 17:26 17:31 17:36 17:41 17:46 9:01 9:06 9:11 9:21 9:26 9:31 Time Temp Setpoint Temp Product Temp Air Vib Setpoint Vib Product Page 21 of 29

22 8.6 Combined Environment The UUT was exposed to 5 rapid temperature cycles from 50 C to +100 C combined with vibration. The vibration level was set to 10 Grms for the first temperature cycle and then increased in 10 Grms increments before each additional cycle. The dwell time at each temperature extreme was 10 minutes and the thermal transition rate was set to 70 C per minute. The actual thermal transition rate on the product was 65 C (This transition rate was calculated during the rapid thermal transition process). The UUT was monitored for functionality throughout the combined environment process. Table 16: Combined Environment Results Cycle Chamber Set point ( C) Chamber Set point (Grms) Pass/Fail Comments Pass Successful boot-up 1 Transition 10 Anomaly SN_3071 locked up, power cycle was successful Pass 1 Transition 10 Pass SN_3071 locked up during extended memory test. Failures were reported by Unlinked test and Block Move test sequences. SN_3132 passed all test sequences Fail 1/2 Transition 20 Fail Power cycle was unsuccessful for SN_3071. Opened chamber door and replaced failed SN_3071 with SN_3022. Started chamber profile at 20 C and 10Grms Pass 2 Transition 20 Pass Pass Power cycled successfully. 2/3 Transition 30 Pass Pass Power cycled successfully. 3 Transition 30 Pass Pass Power cycled successfully. SN_3132 showed sign of video degradation 3/4 Transition 40 Pass SN_3132 video stabilized during transition to 50 C Pass Power cycled successfully. Page 22 of 29

23 4 Transition 40 Pass Anomaly SN_3132 showed signs of video degradation and then locked up. Opened chamber door to verify cable connections. Ribbon cable to SN_3132 appeared to be loose. Both units successfully rebooted at restart of chamber test profile. SN_3022 passed all test sequences 4/5 Transition 50 Fail SN_ Anomaly Video cards failed. Status of SN_3022 unknown. 5 Transition 50 Anomaly Video cards failed. Status of SN_3022 unknown Anomaly Video cards failed. Status of SN_3022 unknown. 5 Transition 50 Anomaly Video cards failed. Status of SN_3022 unknown Pass SN_3022 recovered. Combined Temperature and Vibration Temperature (C) / Vibration (Grms) :41 9:47 9:52 9:57 10:02 10:07 10:12 10:34 10:39 10:44 10:49 10:54 10:59 11:04 11:09 11:14 11:19 11:24 11:30 11:35 11:40 11:45 11:50 11:55 12:05 12:10 12:15 12:20 12:25 12:30 Time Temp Setpoint Temp Product Temp Air Vib Setpoint Vib Product Page 23 of 29

24 Appendix A - Photographs Figure A.1: Thermal Test Setup Figure A.2: Thermocouple Locations Page 24 of 29

25 Figure A.3: Vibration Test Setup Figure A.4: Location of Accelerometer 2 Page 25 of 29

26 Vibration Plot - 5 Grms 2Hz 2.5KHz Appendix B - Vibration Plots Power Spectral Density 1.0E E-01 Grms2/Hz 1.0E E E E Frequency (Hz) Channel 1 (6.0 Grms) Channel 2 (6.3 Grms) Spectrum Analyzer Channel Assignment Channel Axis Location or Description 1 Z Mounted underneath the vibration table at center. 2 Z Mounted on top of U1, SN_3132 Note: The X-axis runs through the chamber doors, the Y-axis runs from the access portal to air plenum, and the Z-axis is vertical to the vibration table. Page 26 of 29

27 Vibration Plot - 5 Grms 2Hz 10KHz Power Spectral Density 1.0E E-01 Grms2/Hz 1.0E E E E Frequency (Hz) Channel 1 (9.8 Grms) Channel 2 (7.2 Grms) Spectrum Analyzer Channel Assignment Channel Axis Location or Description 1 Z Mounted underneath the vibration table at center. 2 Z Mounted on top of U1, SN_3132 Note: The X-axis runs through the chamber doors, the Y-axis runs from the access portal to air plenum, and the Z-axis is vertical to the vibration table. Page 27 of 29

28 Vibration Plot - 50 Grms 2Hz 2.5KHz Power Spectral Density 1.0E E+00 Grms2/Hz 1.0E E E Frequency (Hz) Channel 1 (48.2 Grms) Channel 2 (45.2 Grms) Spectrum Analyzer Channel Assignment Channel Axis Location or Description 1 Z Mounted underneath the vibration table at center. 2 Z Mounted on top of U1, SN_3132 Note: The X-axis runs through the chamber doors, the Y-axis runs from the access portal to air plenum, and the Z-axis is vertical to the vibration table. Page 28 of 29

29 Vibration Plot - 50 Grms 2Hz 10KHz Power Spectral Density 1.0E E+00 Grms2/Hz 1.0E E E Frequency (Hz) Channel 1 (98.6 Grms) Channel 2 (57.6 Grms) Spectrum Analyzer Channel Assignment Channel Axis Location or Description 1 Z Mounted underneath the vibration table at center. 2 Z Mounted on top of U1, SN_3132 Note: The X-axis runs through the chamber doors, the Y-axis runs from the access portal to air plenum, and the Z-axis is vertical to the vibration table. Page 29 of 29