NE/SA/SE5532/5532A Internally-compensated dual low noise operational amplifier

Transcription

1 INTEGRATED CIRCUITS Supersedes data of 1997 Sep Aug 3

2 DESCRIPTION The 5532 is a dual high-performance low noise. Compared to most of the standard s, such as the 1458, it shows better noise performance, improved output drive capability and considerably higher small-signal and power bandwidths. This makes the device especially suitable for application in high-quality and professional audio equipment, instrumentation and control circuits, and telephone channel amplifiers. The op amp is internally compensated for gains equal to one. If very low noise is of prime importance, it is recommended that the 5532A version be used because it has guaranteed noise voltage specifications. FEATURES Small-signal bandwidth: 1 MHz Output drive capability: 6 Ω, 1 V RMS Input noise voltage: 5 nv/ Hz (typical) DC voltage gain: 5 AC voltage gain: 22 at 1 khz Power bandwidth: 14 khz Slew rate: 9 V/µs Large supply voltage range: ±3 to ±2 V Compensated for unity gain PIN CONFIGURATIONS OUTPUT A INVERTING INPUT A NON-INVERTING INPUT A V- IN A +IN A V CC +IN B IN B NOTE: 1. SOL and non-standard pinout. N, D8 Packages A B TOP VIEW D Package 1 8 V TOP VIEW 7 OUTPUT B 6 INVERTING INPUT B 5 NON-INVERTING INPUT B OUT A +V CC OUT B Figure 1. Pin Configurations SL332 ORDERING INFORMATION DESCRIPTION TEMPERATURE RANGE ORDER CODE DWG # 8-Pin Small Outline Package (SO) C to 7 C NE5532AD8 SOT Pin Plastic Dual In-Line Package (DIP) C to 7 C NE5532AN SOT Pin Plastic Small Outline Large (SOL) Package C to 7 C NE5532D SOT Pin Small Outline Package (SO) C to 7 C NE5532D8 SOT Pin Plastic Dual In-Line Package (DIP) C to 7 C NE5532N SOT Pin Plastic Dual In-Line Package (DIP) 4 C to +85 C SA5532N SOT Pin Small Outline Package (SO) 55 C to +125 C SE5532AD8 SOT Pin Plastic Dual In-Line Package (DIP) 55 C to +125 C SE5532N SOT Aug

3 EQUIVALENT SCHEMATIC (EACH AMPLIFIER) + _ SL333 Figure 2. Equivalent Schematic (Each Amplifier) ABSOLUTE MAXIMUM RATINGS SYMBOL PARAMETER RATING UNIT V S Supply voltage ±22 V V IN Input voltage ±V SUPPLY V V DIFF Differential input voltage 1 ±.5 V T amb Operating temperature range NE5532/A to 7 C SA to +85 C SE5532/A 55 to +125 C T stg Storage temperature 65 to +15 C T j Junction temperature 15 C P D Maximum power dissipation, T amb = 25 C (still-air) 2 8 D8 package 78 mw 8 N package 12 mw 16 D package 12 mw T sld Lead soldering temperature (1 sec max) 23 C NOTES: 1. Diodes protect the inputs against over-voltage. Therefore, unless current-limiting resistors are used, large currents will flow if the differential input voltage exceeds.6v. Maximum current should be limited to ±1 ma. 2. Thermal resistances of the above packages are as follows: N package at 1 C/W D package at 15 C/W D8 package at 16 C/W 21 Aug 3 3

4 DC ELECTRICAL CHARACTERISTICS T amb = 25 C; V S = ±15 V, unless otherwise specified. 1, 2, 3 SYMBOL PARAMETER TEST CONDITIONS SE5532/A NE5532/A, SA5532 Min Typ Max Min Typ Max V OS Offset voltage mv Over temperature 3 5 mv V OS / T 5 5 µv/ C I OS Offset current na Over temperature 2 2 na I OS / T 2 2 pa/ C I B Input current na Over temperature 7 1 na I B / T 5 5 na/ C I CC Supply current UNIT ma Over temperature 13 ma V CM Common-mode input range ±12 ±13 ±12 ±13 V CMRR Common-mode rejection ratio db PSRR Power supply rejection ratio µv/v A VOL V OUT Large-signal voltage gain Output swing R L 2 kω; V O = ±1 V V/mV Over temperature V/mV R L 6 Ω; V O = ±1 V V/mV Over temperature 2 1 V/mV R L 6 Ω ±12 ±13 ±12 ±13 Over temperature ±1 ±12 ±1 ±12 R L 6 Ω; V S = ±18 V ±15 ±16 ±15 ±16 Over temperature ±12 ±14 ±12 ±14 R L 2 kω ±13 ±13.5 ±13 ±13.5 Over temperature ±12 ±12.5 ±1 ±12.5 R IN Input resistance kω I SC Output short circuit current ma NOTES: 1. Diodes protect the inputs against overvoltage. Therefore, unless current-limiting resistors are used, large currents will flow if the differential input voltage exceeds.6 V. Maximum current should be limited to ±1 ma. 2. For operation at elevated temperature, derate packages based on the package thermal resistance. 3. Output may be shorted to ground at V S = ±15 V, T amb = 25 C. Temperature and/or supply voltages must be limited to ensure dissipation rating is not exceeded. V AC ELECTRICAL CHARACTERISTICS T amb = 25 C; V S = ±15 V, unless otherwise specified. SYMBOL PARAMETER TEST CONDITIONS R OUT Output resistance A V = 3 db Closed-loop f = 1 khz, R L = 6 Ω NE/SE5532/A, SA5532 Min Typ Max UNIT.3 Ω Voltage-follower Overshoot V IN = 1 mv P-P 1 % C L = 1 pf; R L = 6 Ω A V Gain f = 1 khz 2.2 V/mV GBW Gain bandwidth product C L = 1 pf; R L = 6 Ω 1 MHz SR Slew rate 9 V/µs V OUT = ±1 V 14 khz Power bandwidth V OUT = ±14 V; R L = 6 Ω, 1 khz V CC =±18V 21 Aug 3 4

5 ELECTRICAL CHARACTERISTICS T amb = 25 C; V S = ±15 V, unless otherwise specified. SYMBOL PARAMETER TEST CONDITIONS NE/SE5532 NE/SA/SE5532A Min Typ Max Min Typ Max V NOISE Input noise voltage f O = 3 Hz nv/ Hz f O = 1 khz nv/ Hz I NOISE Input noise current f O = 3 Hz pa/ Hz f O = 1 khz.7.7 pa/ Hz Channel separation f = 1 khz; R S = 5 kω db UNIT TYPICAL PERFORMAE CHARACTERISTICS 12 8 Open-Loop Frequency Response TYPICAL VALUES 6 4 Closed-Loop Frequency Response RF = 1 kω; RE = 1 Ω TYPICAL VALUES 4 3 Large-Signal Frequency Response V S = ±15 V TYPICAL VALUES GAIN (db) 4 GAIN (db) 2 RF = 9 kω; RE = 1 kω (V) Vo(p-p) 2 RF = 1 kω; RE = f (Hz) Output Short-Circuit Current 8 V S = ±15 V f (Hz) 1,4 Input Bias Current V S = ±15 V f (Hz) Input Commom-Mode Voltage Range TYPICAL VALUES 6 1,2 2 I O (ma) 4 TYP I I (ma),8 V IN (V) 2, T amb (o C) T amb (o C) Supply Current Input Noise Voltage Density I O = 1 2 Vp; V N (V) 4 TYP 1 TYP I P I N (ma) 2 (nv Hz) f (Hz) Vp; V N (V) SL334 Figure 3. Typical Performance Characteristics 21 Aug 3 5

6 TEST CIRCUITS + V+ R S 25 Ω 5532 (1/2) R F V IN V OUT V I R E 1 pf 8 Ω 1 kω V 1 pf 6 Ω Voltage-Follower Closed-Loop Frequency Response SL335 Figure 4. Test Circuits 21 Aug 3 6

7 DIP8: plastic dual in-line package; 8 leads (3 mil) SOT Aug 3 7

8 SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT Aug 3 8

9 SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT Aug 3 9

10 DIP16: plastic dual in-line package; 16 leads (3 mil) SOT Aug 3 1

11 NOTES 21 Aug 3 11

12 Data sheet status Data sheet status [1] Product status [2] Definitions Objective data Preliminary data Development Qualification This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. Production Definitions Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 6134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Disclaimers Life support These products are not designed for use in life support appliances, devices or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Contact information For additional information please visit Fax: For sales offices addresses send to: sales.addresses@ This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-65A. [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL Koninklijke Philips Electronics N.V. 22 All rights reserved. Printed in U.S.A. Date of release: 3-2 Document order number: Aug 3 12