. COMPLETE VERTICAL DEFLECTION . LOW NOISE . SUITABLE FOR HIGH DEFINITION TDA1170N LOW-NOISE TV VERTICAL DEFLECTION SYSTEM SYSTEM MONITORS

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1 LOW-NOISE T ERTICAL DEFLECTION SYSTEM. COMPLETE ERTICAL DEFLECTION SYSTEM. LOW NOISE. SUITABLE FOR HIGH DEFINITION MONITORS DESCRIPTION The TDA0N is a monolithic integrated circuit in a -lead quad in-line plastic package. It is intended for use in black and white and colour T receivers. Low-noise makes this device particularly suitable for use in monitors. The functions incorporated are : synchronization circuit, oscillator and ramp generator, high power gain amplifier, flyback generator, voltage regulator. FINDIP (Plastic Package) ORDER CODE : TDA0N PIN CONNECTIONS RAMP OUTPUT RAMP GENERATOR SUPPLY OLTAGE COMPENSATION FLYBACK 3 AMP. INPUT GROUND GROUND POWER AMPLIFLIER OUTPUT POWER AMPLIFLIER SUPPLY OLTAGE REGULATED OLTAGE 8 6 OSCILLATOR SYNC. INPUT HEIGHT ADJUSTMENT 0N-0.EPS December /8

2 BLOCK DIAGRAM C D A + S FREQ P TDA0N 6 3 R H C OSCILLATOR OLTAGE REGULATOR FLYBACK GENERATOR POWER AMPLIFLIER SYNC C 8 SYNC CIRCUIT RAMP GENERATOR BUFFER STAGE PREAMPLIFLIER RG C 8 YOKE C C LINEARITY C R D R E HEIGHT P R A P3 RB RC C3 C 6 R F 0N-0.EPS ABSOLUTE MAXIMUM RATINGS Symbol Parameter alue Unit S Supply oltage at Pin 3, Flyback Peak oltage 60 Power Amplifier Input oltage + 0. I o Output Peak Current (non repetitive) at t = msec A I o Output Peak Current at f = 0Hz t µsec. A Io Output Peak Current at f = 0Hz t > µsec. A I 3 Pin 3 DC Current at < 0 ma I 3 Pin 3 Peak to Peak Flyback Current for f = 0Hz, t fly.msec.8 A I8 Pin 8 Current ± 0 ma Ptot Power Dissipation : at Tab = 0 C at Tamb =80 C (free air) Tstg, Tj Storage and Junction Temperature 0, +0 C W W 0N-0.TBL THERMAL DATA Symbol Parameter alue Unit R th j-tab Rth j-amb Thermal Resistance Junction-tab Thermal Resistance Junction-ambient * Obtained with tabs soldered to printed circuit with minimized copper area. Max Max 0 C/W C/W * 0N-0.TBL /8

3 ELECTRICAL CHARACTERISTICS (Refer to the test circuits, S =3,Tamb = o C,unless otherwise specified) DC CHARACTERISTICS Symbol Parameter Test Conditions Min. Typ. Max. Unit Fig. I Pin Quiescent Current I 3 =0 ma b I Pin Quiescent Current I = 0 8 ma b I Oscillator Bias Current = 0. µa a I Amplifier Input Bias Current = µa b I Ramp Generator Bias Current = µa a I Ramp Generator Current I =0µA, = µa b I I Ramp Generator Non-linearity = 0 to, I =0µA 0. % b s Supply oltage Range 3 Pin Saturation oltage to Ground I = ma. 3 Pin 3 Saturation oltage to Ground I3 = ma m a Qiuescent output oltage S = R = kω, R=kΩ... a S = 3 R = 3kΩ, R=kΩ a L Output Saturation oltage to Ground I = 0.A I = 0.8A H Output Saturation oltage to Supply I = 0.A I = 0.8A 6 Regulated oltage at Pin b Regulated oltage at Pin I =0µA b 6 S ; S Regulated oltage Drift with Supply oltage S = to 3 m/ b Amplifier Input Reference oltage.0..3 R8 Pin 8 Input Resistance 8 0. MΩ a c c d d 0N-03.TBL 3/8

4 Figure : DC Test Circuits Figure a Figure b I +s 3 I3 +s I 3 8 TDA0N TDA0N I8 R 6 kω -I 8 - I R 6 - I - I 0kΩ 0N-03.EPS 0N-0.EPS Figure c Figure d +s +s I H TDA0N TDA0N L I 0N-0.EPS 0N-06.EPS /8

5 ELECTRICAL CHARACTERISTICS (Refer to the AC test circuit, S = ; f = 0Hz ; Tamb = C, unless otherwise specified) AC CHARACTERISTICS Symbol Parameter Test Conditions Min. Typ. Max. Unit I s Supply Current I y = App 0 ma I8 Sync. Input Current (positive or negative) 00 µa Flyback oltage I y = App t fly Flyback Time I y = App 0. ms ON Peak to Peak Output Noise Pin Connected to GND 0 mpp f o Free Running Frequency (P + R) = 300kΩ, C = (P + R) = 60kΩ, C = f Sychronization Range I8 = 0.mA Hz f S Frequency Drift with Supply oltage s = to Hz/ f T ab Frequency Drift with tab Temperature Ttab = 0 to 0 C 0.0 Hz/ C. 8. Hz Hz 0N-0.TBL Figure : AC Test and Application Circuit for Large Screen B/W T Set Ω/0mH/App =. S N00 0µF 0µF 3.3Ω 3 Sync. Input 8 T D A 0 N 0kΩ 0pF kω 0pF.6kΩ.6kΩ µ YOKE Ry = Ω Ly = 0mH 00µF P 6 0kΩ R kω.8kω 0kΩ C 0kΩ kω Ω 0N-0.EPS /8

6 Figure 3 : Typical Application Circuit for Small Screen 0 TC Set (RY = Ω, LY = 30mH, IY = 0.8 App) D N00 C 0µF S = 6 C C 0µF R8 3.3Ω C f sync = 0Hz C R.kΩ 3 8 T D A 0 N R 30kΩ C6 0pF R6 8kΩ C 0pF R.6kΩ R.6kΩ R3 0Ω C µf YOKE Ry = Ω Ly = 30mH C 00µF P 0kΩ 6 P3 0kΩ C3 0.µF R 0kΩ P 0kΩ R3 0kΩ R 680kΩ C C8 R kω R.kΩ R Ω 0N-08.EPS Figure : P.C. Board and Components Layout of the Circuit of fig. 3 (: scale) 0N-0.TIF 6/8

7 MOUNTING INSTRUCTION During soldering the tab temperature must not exceed 60 C and the soldering time must not be longer than seconds. The external heatsink or printed circuit copper area must be connected to electrical ground. The junction to ambient thermal resistance can be Figure : Example of P.C. Board Copper Area Used as Heatsink reduced by soldering the tabs to a suitable copper area of the printed circuit board (fig. ) or to an external heatsink (fig. 6). The diagram of fig. shows the maximum dissipable power P tot and the R th j-amb as a function of the side e of two equal square copper areas having a thicknessof 3 µ (. mil). Figure 6 : Example of External heatsink 0N-.EPS 0N-.EPS 0N-.EPS Figure : Maximum Power Dissipation and Junction-Ambient Thermal Resistance versus e Figure 8 : Maximum Allowable Power Dissipation versus Ambient Temperature 0N-3.EPS /8

8 G e b E E KD E F I TDA0N PACKAGE MECHANICAL DATA : PINS - PLASTIC FINDIP D A a b c c e e6 e3 e L M 6 PM-FDIP.EPS Dimensions Millimeters Inches Min. Typ. Max. Min. Typ. Max. A a b b c c D E E E e e e e e F G I K L M FINDIP.TBL Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No licence is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. 8/8 SGS-THOMSON Microelectronics - All Rights Reserved Purchase of I C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips I C Patent. Rights to use these components in a I C system, is granted provided that the system conforms to the I C Standard Specifications as defined by Philips. SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.