Inductors for Standard Circuits

Transcription

1 Inductors for Standard Circuits Multilayer/STD magnetic shielded MLF series Type: MLF05L MLF608 MLF202 05[0402 inch]* 608[0603 inch] 202[0805 inch] * Dimensions Code JIS[EIA] Issue date: November 20 Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.

2 (/9) Inductors for Standard Circuits Multilayer/STD Magnetic Shielded Conformity to RoHS Directive MLF Series MLF05L Various digital devices are required to be further downsized yet remain highly functional, and to excel in low power consumption, and parts mounted on the devices are also required to have lower resistance. The MLF05L type is a new line of inductors that have been developed to meet such requirements: their resistance has been lowered by up to 35% in comparison with that of the existing MLF05 type. In addition, the new inductors use similar magnetic shielding, which enables their high-density mounting. FEATURES The resistance of the MLF05L type has been lowered by up to 35% in comparison with that of the existing MLF05 type. Magnetically shielded configuration allowing for high-density mounting. Does not contain lead and is compatible with lead-free soldering. It is a product conforming to RoHS directive. APPLICATIONS Signal processing modules such as cellular phones and tuners SPECIFICATIONS Operating temperature range Storage temperature range 40 to +85 C 40 to +85 C(After mount) RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING 250 to 260 C 230 C 80 C 50 C Preheating 60 to 20s Time(s) s max. Soldering 30 to 60s Natural cooling PRODUCT IDENTIFICATION MLF 05 L R K T () (2) (3) (4) (5) (6) (7) () Series name (2) Dimensions L W (3) Type name L (4) Inductance R R0 (5) Tolerance K ±% (6) Packaging style T (7) TDK internal code Low-resistance type 0.µH.0µH Taping [reel] PACKAGING STYLE AND QUANTITIES Packaging style Quantity Taping 000 pieces/reel HANDLING AND PRECAUTIONS Before soldering, be sure to preheat components. The preheating temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 50 C. After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. The inductance value may change due to magnetic saturation if the current exceeds the rated maximum. Do not expose the inductors to stray magnetic fields. Avoid static electricity discharge during handling. When hand soldering, apply the soldering iron to the printed circuit board only. Temperature of the iron tip should not exceed 350 C. Soldering time should not exceed 3 seconds. Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. Please contact our Sales office when your application is considered the following: The device s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) / 2029 / e5_mlf_02

3 (2/9) SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN.0± ± min. 0.min ±0.05 Weight :.2mg ELECTRICAL CHARACTERISTICS Inductance (µh) Inductance tolerance Test frequency L, Q (MHz) Test current L, Q (ma) Q min. Self-resonant frequency (MHz)min. DC resistance (Ω )max. Rated current (ma)max. Part No. 0. ±% MLF05LRKT 0.2 ±% MLF05LR2KT 0.5 ±% MLF05LR5KT 0.8 ±% MLF05LR8KT 0.22 ±% MLF05LR22KT 0.27 ±% MLF05LR27KT 0.33 ±% MLF05LR33KT 0.39 ±% MLF05LR39KT 0.47 ±% MLF05LR47KT 0.56 ±% MLF05LR56KT 0.68 ±% MLF05LR68KT 0.82 ±% MLF05LR82KT.0 ±% MLF05LR0KT.2 ±% MLF05LR2KT.5 ±% MLF05LR5KT.8 ±% MLF05LR8KT 2.2 ±% MLF05L2R2KT TYPICAL ELECTRICAL CHARACTERISTICS INDUCTANCE vs. FREQUENCY CHARACTERISTICS IMPEDANCE vs. FREQUENCY CHARACTERISTICS 000 Inductance(µH) µH.0µH 0.33µH 0.µH Impedance(Ω) µH.0µH 0.33µH 0.µH Q vs. FREQUENCY CHARACTERISTICS µH 50.0µH 0.µH Q µH / 2029 / e5_mlf_02

4 (3/9) PACKAGING STYLES REEL DIMENSIONS.0 ø60min. 2.0±0.5 ø3±0.2 ø2±0.8 ø80± max. TAPE DIMENSIONS Sprocket hole Cavity.75±0. 8.0± ± max. 0.65±0. 4.0±0. 2.0± ±0.05.5±0. 60min. Taping 200min. Drawing direction 300min / 2029 / e5_mlf_02

5 (4/9) Inductors for Standard Circuits Multilayer/STD Magnetic Shielded Conformity to RoHS Directive MLF Series MLF608 FEATURES High-reliability monolithic structure. Ferrite core and magnetic shielding enables the design of compact circuits with high density mounting. Excellent solderability and high heat resistance permits either flow or reflow soldering. The products contain no lead and also support lead-free soldering. It is a product conforming to RoHS directive. APPLICATIONS Digital cellular phone, tuner, personal computers, audio, or various electronic appliances SPECIFICATIONS Operating temperature range Storage temperature range 40 to +85 C 40 to +85 C(After mount) RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING 250 to 260 C 230 C 80 C 50 C s max. Natural cooling PRODUCT IDENTIFICATION MLF 608 A R0 K T () (2) (3) (4) (5) (6) (7) () Series name (2) Dimensions L W mm (3) Type name (4) Inductance 47N 47nH[0.047µH] R5 0.5µH R0 µh (5) Tolerance K ±% M ±20% (6) Packaging style T (7) TDK internal code Taping [reel] PACKAGING STYLE AND QUANTITIES Packaging style Quantity Taping 4000 pieces/reel Preheating 60 to 20s Time(s) Soldering 30 to 60s HANDLING AND PRECAUTIONS Before soldering, be sure to preheat components. The preheating temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 50 C. After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. The inductance value may change due to magnetic saturation if the current exceeds the rated maximum. Do not expose the inductors to stray magnetic fields. Avoid static electricity discharge during handling. When hand soldering, apply the soldering iron to the printed circuit board only. Temperature of the iron tip should not exceed 350 C. Soldering time should not exceed 3 seconds. Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. Please contact our Sales office when your application is considered the following: The device s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) / 2029 / e5_mlf_02

6 (5/9) SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN.6± ± ± ±0.5 Weight: 4mg ELECTRICAL CHARACTERISTICS Test Test Self-resonant DC resistance Inductance Inductance Q Rated current frequency current frequency (MHz) (Ω ) (µh) tolerance (ma)max. min. typ. L, Q (MHz) L, Q (ma) min. typ. max. typ. Part No ±20% MLF608D47N MT ±20% MLF608D68NMT ±20% MLF608D82NMT 0. ±% MLF608DRKT 0.2 ±% MLF608DR2KT 0.5 ±% MLF608DR5KT 0.8 ±% MLF608DR8KT 0.22 ±% MLF608DR22KT 0.27 ±% MLF608DR27KT 0.33 ±% MLF608DR33KT 0.39 ±% MLF608DR39KT 0.47 ±% MLF608DR47KT 0.56 ±% MLF608DR56KT 0.68 ±% MLF608DR68KT 0.82 ±% MLF608DR82KT ±% MLF608AR0KT.2 ±% MLF608AR2KT.5 ±% MLF608AR5KT.8 ±% MLF608AR8KT 2.2 ±% MLF608A2R2KT 2.7 ±% MLF608A2R7KT 3.3 ±% MLF608A3R3KT 3.9 ±% MLF608A3R9KT 4.7 ±% MLF608A4R7KT 5.6 ±% MLF608E5R6KT 6.8 ±% MLF608E6R8KT 8.2 ±% MLF608E8R2KT ±% MLF608E0KT 2 ±% MLF608E20KT 5 ±% MLF608C50KT 8 ±% MLF608C80KT 22 ±% MLF608C220KT 27 ±% MLF608C270KT 33 ±% MLF608C330KT 47N means for 47nH (0.047µH). Test equipment Inductance, Q: Ag4294A-6034G / 2029 / e5_mlf_02

7 (6/9) TYPICAL ELECTRICAL CHARACTERISTICS INDUCTANCE CHANGE vs. DC SUPERPOSITION CHARACTERISTICS 0 IMPEDANCE vs. FREQUENCY CHARACTERISTICS 0 8.2µH Inductance(µH) µh Impedance(kΩ) 8.2µH µh 0.68µH µH DC current(ma) INDUCTANCE CHANGE vs. TEMPERATURE CHARACTERISTICS Q vs. FREQUENCY CHARACTERISTICS µh 8.2µH 0.68µH µH 5 8.2µH µh Temperature( C) L/L(%) Q µH µh 0.68µH PACKAGING STYLES REEL DIMENSIONS TAPE DIMENSIONS.0 Sprocket hole Cavity.75±0. 3.5±0.05 ø60min. 8.0±0.3.max..± ±0. 4.0±0. 2.0±0.05.9± ±0.5 ø3±0.2 ø2± max. 60min. Taping 200min. ø80±2.0 Drawing direction 300min / 2029 / e5_mlf_02

8 (7/9) Inductors for Standard Circuits Multilayer/STD Magnetic Shielded Conformity to RoHS Directive MLF Series MLF202 FEATURES High-reliability monolithic structure. Ferrite core and magnetic shielding enables the design of compact circuits with high density mounting. Excellent solderability and high heat resistance permits either flow or reflow soldering. The products contain no lead and also support lead-free soldering. It is a product conforming to RoHS directive. APPLICATIONS Digital cellular phone, car audio, TV, personal computers, or various electronic appliances SPECIFICATIONS Operating temperature range 40 to +85 C Storage temperature range 40 to +85 C(After mount) RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING PRODUCT IDENTIFICATION MLF 202 A R0 K T () (2) (3) (4) (5) (6) (7) () Series name (2) Dimensions L W mm (3) Type name (4) Inductance 47N 47nH[0.047µH] R5 0.5µH R0 µh 0 µh (5) Tolerance K ±% M ±20% 250 to 260 C 230 C s max. Natural cooling (6) Packaging style T (7) TDK internal code Taping [reel] 80 C 50 C Preheating 60 to 20s Time(s) Soldering 30 to 60s PACKAGING STYLE AND QUANTITIES Packaging style Product s thickness Quantity Taping 0.85mm 4000 pieces/reel.25mm 2000 pieces/reel HANDLING AND PRECAUTIONS Before soldering, be sure to preheat components. The preheating temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 50 C. After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. The inductance value may change due to magnetic saturation if the current exceeds the rated maximum. Do not expose the inductors to stray magnetic fields. Avoid static electricity discharge during handling. When hand soldering, apply the soldering iron to the printed circuit board only. Temperature of the iron tip should not exceed 350 C. Soldering time should not exceed 3 seconds. Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. Please contact our Sales office when your application is considered the following: The device s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) / 2029 / e5_mlf_02

9 (8/9) SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN 2.0±0.2.25± ± T T(Thickness) 0.85±0.2.25±0.2 Weight(mg) 4 ELECTRICAL CHARACTERISTICS Test Test Self-resonant DC resistance Rated Thickness Inductance Inductance Q frequency current frequency (MHz) (Ω ) current T (µh) tolerance min. typ. L, Q (MHz) L, Q (ma) min. typ. max. typ. (ma)max. (mm) Part No ±20% MLF202D47N MT ±20% MLF202D68NMT ±20% MLF202D82NMT 0. ±% MLF202DRKT 0.2 ±% MLF202DR2KT 0.5 ±% MLF202DR5KT 0.8 ±% MLF202DR8KT 0.22 ±% MLF202DR22KT 0.27 ±% MLF202DR27KT 0.33 ±% MLF202DR33KT 0.39 ±% MLF202DR39KT 0.47 ±% MLF202DR47KT 0.56 ±% MLF202DR56KT 0.68 ±% MLF202DR68KT 0.82 ±% MLF202DR82KT ±% MLF202AR0KT.2 ±% MLF202AR2KT.5 ±% MLF202AR5KT.8 ±% MLF202AR8KT 2.2 ±% MLF202A2R2KT 2.7 ±% MLF202A2R7KT 3.3 ±% MLF202A3R3KT 3.9 ±% MLF202A3R9KT 4.7 ±% MLF202A4R7KT 5.6 ±% MLF202E5R6KT 6.8 ±% MLF202E6R8KT 8.2 ±% MLF202E8R2KT ±% MLF202E0KT 2 ±% MLF202E20KT 5 ±% MLF202C50KT 8 ±% MLF202C80KT 22 ±% MLF202C220KT 27 ±% MLF202C270KT 33 ±% MLF202C330KT 39 ±% MLF202K390KT 47 ±% MLF202K470KT 56 ±% MLF202K560KT 68 ±% MLF202C680KT 82 ±% MLF202C820KT 0 ±% MLF202CKT 47N means for 47nH (0.047µH). Test equipment Inductance, Q: Ag4294A-6034G / 2029 / e5_mlf_02

10 (9/9) TYPICAL ELECTRICAL CHARACTERISTICS INDUCTANCE CHANGE vs. DC SUPERPOSITION CHARACTERISTICS 0 IMPEDANCE vs. FREQUENCY CHARACTERISTICS 0 µh Inductance(µH) µh Impedance(kΩ) µh 0. 0.µH 0. µh 0.µH DC current(ma) INDUCTANCE CHANGE vs. TEMPERATURE CHARACTERISTICS Q vs. FREQUENCY CHARACTERISTICS 25 0.µH µh µh µh µh 4 0.µH Temperature( C) L/L(%) Q µh µh 0.µH PACKAGING STYLES REEL DIMENSIONS TAPE DIMENSIONS t=0.85mm.0 Sprocket hole Cavity ø60min..75±0. 3.5± ±0.3.max..5± ±0. 4.0±0. 2.0± ± ±0.5 ø3±0.2 ø2± max. t=.25mm.5max Sprocket hole 0.5min. Cavity.75±0. 3.5±0.05 ø80± ± max..5± ±0. 4.0±0. 2.0± ±0.2 60min. Taping 200min. Drawing direction 300min / 2029 / e5_mlf_02