Watchdog Timeout Period Externally Adjustable Voltage Detector

Transcription

1 XC13/XC131Series ETR- Watchdog Timeout Period Externally Adjustable Voltage Detector GENERA DESCRIPTION The XC13/XC131 series are voltage detectors with a watchdog function. The watchdog timeout time and release delay time can be set as desired using a single external capacitor. These voltage detectors are used for microprocessor monitoring, and when the power voltage reaches the detect voltage or an pulse is not input to the watchdog pin within the watchdog timeout time, an level signal is output from the RESETB pin. The XC13 series has a manual reset function. When the manual reset pin is set to ow level at any desired timing, an level signal is output from the RESETB pin. The XC131 series has a watchdog ON/OFF function. By setting the EN pin to level, the watchdog function can be turned OFF while the voltage detector that monitors the power voltage continues to operate. The MRB pin and EN pin are pulled up internally to VIN, and thus these pins can be left open when not used. APPICATIONS Microprocessor reset and malfunction monitoring circuitry Memory battery backup circuits Power-on reset circuits Power failure detection FEATURES Operating Ambient Temperature : - ~+15 Operating Voltage Range : 1.5V~.V Detect Voltage Range : 1.V~5.V ±1.% (SOT-) 1.V~5.V±1.5%(DFN1515-A) ysteresis Width : VDF 5% Temperature Characteristics : ±5ppm/ Output Configuration : N-channel open drain output ow Power Consumption : 8.1μA Detect 9.8μA Release.5μA Release (EN=) Function : Manual Reset (XC13) : Watchdog function OFF (XC131) WD Timeout Time : 1ms (Cd=.1μF) Release Delay Time : 1ms (Cd=.1μF) (at power on) 1ms (Cd=.1μF) (After Watchdog Timeout) Package : SOT- DFN1515-A Environmentally Friendly : EU RoS compliant, Pb free TYPICA APPICATION CIRCUIT XC13 Series TYPICA PERFORMANCE CARACTERISTICS XC131 Series 1/3

2 XC13/XC131 Series BOCK DIAGRAM XC13 Series Type A V IN R RMRB RX RY Voltage Reference - + RESET O GIC RESETB MRB V SS Cd OGIC + Voltage Reference - RWD PUSE DETECT OGIC Cd WD XC131 Series Type A V IN R REN RX - + RESET OGIC RESETB RY Voltage Reference EN V SS Cd OGIC + Voltage Reference - RWD PUSE DETECT OGIC Cd WD * Diodes inside the circuit are an ESD protection diode and a parasitic diode. /3

3 XC13/XC131 Series BOCK DIAGRAM XC131 Series Type B V IN R RX - + RESET O GIC RESETB RY Voltage Reference ENB V SS RENB Cd O GIC + Voltage Reference - RWD PUSE DETECT O GIC Cd WD * Diodes inside the circuit are an ESD protection diode and a parasitic diode. 3/3

4 XC13/XC131 Series PRODUCT CASSIFICATION Ordering Information XC SOT- DESIGNATOR ITEM SYMBO DESCRIPTION 1 TYPE A MRB pin With pull-up resistor 3 Detect Voltage 1~5 e.g. 1.V =1, 3= Detect Accuracy 1 ±1.% 5-7 (*1) Package (Order Unit) MR-G SOT- (3pcs/Reel) (*) (*1) The -G suffix denotes alogen and Antimony free as well as being fully EU RoS compliant. (*) The SOT- reels are shipped in a moisture-proof packing. DFN1515-A DESIGNATOR ITEM SYMBO DESCRIPTION 1 TYPE A MRB pin With pull-up resistor 3 Detect Voltage 1~5 e.g. 1.V =1, 3= Detect Accuracy A ±1.5% 5-7 (*1) Package (Order Unit) R-G DFN1515-A (5pcs/Reel) (*) (*1) The -G suffix denotes alogen and Antimony free as well as being fully EU RoS compliant. (*) The DFN1515-A reels are shipped in a moisture-proof packing. XC SOT- DESIGNATOR ITEM SYMBO DESCRIPTION A EN pin With pull up resistor 1 TYPE B ENB pin With pull down resistor 3 Detect Voltage 1~5 e.g. 1.V =1, 3= Detect Accuracy 1 ±1.% 5-7 (*1) Package (Order Unit) MR-G SOT- (3pcs/Reel) (*) (*1) The -G suffix denotes alogen and Antimony free as well as being fully EU RoS compliant. (*) The SOT- reels are shipped in a moisture-proof packing. DFN1515-A DESIGNATOR ITEM SYMBO DESCRIPTION A EN pin With pull-up resistor 1 TYPE B ENB pin With pull-down resistor 3 Detect Voltage 1~5 e.g. 1.V =1, 3= Detect Accuracy A ±1.5% 5-7 (*1) Package (Order Unit) R-G DFN1515-A (5pcs /Reel) (*) (*1) The -G suffix denotes alogen and Antimony free as well as being fully EU RoS compliant. (*) The DFN1515-A reels are shipped in a moisture-proof packing. /3

5 XC13/XC131 Series PIN CONFIGURATION V IN 1 WD V IN 1 WD MRB 5 V SS EN/ENB 5 V SS RESETB Cd RESETB Cd DFN1515-A (BOTTOM VIEW) DFN1515-A (BOTTOM VIEW) XC13 series XC131 series *The dissipation pad for the DFN1515-A packages should be solder-plated in reference mount pattern and metal masking so as to enhance mounting strength and heat release. If the pad needs to be connected to other pins, it should be connected to the V SS (No. ) pin. PIN ASSIGNMENT XC13 Series PIN NUMBER SOT- DFN1515-A PIN NAME FUNCTIONS 1 1 WD Watchdog Input 5 MRB Manual Reset Input 3 VIN Power Input RESETB Reset Output 5 VSS Ground 3 Cd Adjustable Pin for Release Delay Time/Watchdog Timeout XC131 Series PIN NUMBER SOT- DFN1515-A PIN NAME FUNCTIONS 1 1 WD Watchdog Input 5 EN ENB Watchdog ON/OFF Control (XC131A) Watchdog ON/OFF Control (XC131B) 3 VIN Power Input RESETB Reset Output 5 VSS Ground 3 Cd Adjustable Pin for Release Delay Time/Watchdog Timeout 5/3

6 XC13/XC131 Series FUNCTION CART 1) XC13 Series VIN * VMRB *3 VWD * VRESETB *7 OPEN *1 ) XC131A Series VIN * VEN * VWD * VRESETB *7 OPEN *1 3) XC131B Series VIN * VENB *5 VWD * VRESETB *7 OPEN * 1 *1: Includes all WD logic (VWD=,, OPEN,, ) *: V IN = indicates higher than the release voltage. V IN = indicates lower than the detect voltage. *3: V MRB = indicates MRB igh evel Voltage. V MRB = indicates MRB ow evel Voltage. Since MRB pin of XC13 Series is pulled up internally, the open condition of MRB pin is acceptable when MR function is not required. *: V EN = indicates EN igh evel Voltage. V EN = indicates EN ow evel Voltage. The EN pin of the XC131A Series is pulled up internally, enabling the WD function to be used with EN open. *5: V ENB = indicates ENB igh evel Voltage. V ENB = indicates ENB ow evel Voltage. The ENB pin of the XC131B Series is pulled down internally, enabling the WD function to be used with ENB open. *: V WD = indicates WD igh evel Voltage. V WD = indicates WD ow evel Voltage. *7: V RESETB = indicates the release state. V RESETB = indicates the detect state. /3

7 XC13/XC131 Series ABSOUTE MAXIMUM RATINGS XC13 Series PARAMETER SYMBO RATINGS Ta=5 UNITS Input Voltage VIN -.3~+7. V WD Input Voltage VWD -.3~+7. V MRB Input Voltage VMRB -.3~+7. V Cd Pin Voltage VCd -.3~+VIN+.3 or +7. (*1) V Output Voltage VRESETB -.3~+7. V Cd Pin Current ICd 1 ma Output Current IOUT 3 ma 5 SOT- Power Dissipation Pd (PCB mounted) (*) mw DFN1515-A 8(PCB mounted) (*) Operating Ambient Temperature Topr -~+15 Storage Temperature Tstg -55~+15 All voltages are described based on the VSS pin. (*1) The maximum value should be VIN+.3 or +7. in the lowest. (*) It is reference data on the power dissipation when mounting the board. For mounting conditions, see page 8 and 9. XC131 Series PARAMETER SYMBO RATINGS Ta=5 UNITS Input Voltage VIN -.3~+7. V WD Input Voltage VWD -.3~+7. V EN/ENB Input Voltage VEN/VENB -.3~+7. V Cd Pin Voltage VCd -.3~+VIN+.3 or +7. (*1) V Output Voltage VRESETB -.3~+7. V Cd Pin Current ICd 1 ma Output Current IOUT 3 ma 5 SOT- Power Dissipation Pd (PCB mounted) (*) mw DFN1515-A 8(PCB mounted) (*) Operating Ambient Temperature Topr -~+15 Storage Temperature Tstg -55~+15 All voltages are described based on the VSS pin. (*1) The maximum value should be VIN+.3 or +7. in the lowest. (*) It is reference data on the power dissipation when mounting the board. For mounting conditions, see page 8 and 9. 7/3

8 XC13/XC131 Series EECTRICA CARACTERISTICS XC13 Series PARAMETER SYMBO CONDITIONS Ta=5 - Ta 15 (*9) MIN. TYP. MAX. MIN. TYP. MAX. UNITS CIRCUIT Operating Voltage V IN V Detect Voltage (*1) =1.~5.V SOT- DFN1515-A V V 1 Temperature Characteristics / ( Topr ) - Topr 15 - ±5 - - ±5 - ppm / ysteresis Width V YS V Supply Current I SS V IN =.9V V IN = 1.1V μa V IN =1.5V Output Current I RBOUT N-ch. V RESETB =.3V V IN =.V (*) V IN =3.V (*3) ma 3 V IN =.V (*) eak Current I eak V IN =.V,V RESETB = Cd Pin Sink Current I cd V IN =1.5V, V Cd =.7V Release Delay Time1 (*5) Release Delay Time (*) Watchdog Timeout Period (*7) 8/3 t DR1 V IN =1.5V 1.1V, Cd=.1μF t DR V IN = 1.1V, Cd=.1μF t WD V IN = 1.1V, Cd=.1μF,WD=V SS Detect Delay Time (*8) t DF V IN = 1.1V 1.5V, Cd=.1μF μs Watchdog Minimum Pulse Width Watchdog igh evel Voltage Watchdog ow evel Voltage Watchdog Pull-down Resistance MRB igh evel Voltage MRB ow evel Voltage MRB Pull-up Resistance MRB Minimum Pulse Width t WDIN V WD V WD V IN =.V, Apply pulse from.v to V to the WD pin. 1.1V V IN.V, Cd=.1uF 1.1V V IN.V, Cd=.1uF ns V IN.7 - V IN.7 - V - V IN.3 - V IN.3 V R WD V WD =.V, R WD =V WD /I WD kω 7 V MR V IN V IN V 1.1V V IN.V V MR V R MR t MRIN V IN =.V, V MRB =V, R MR =V IN /I MRB V IN =.V, Apply pulse from.v to V to the MRB pin kω μs 1 NOTE: *The WD pin and MRB pin are open unless otherwise specified in the measurement conditions. (*1) : Nominal detect voltage (*) For >.V products only. (*3) For >3.V products only. (*) For >.V products only. (*5) Until time when RESETB pin shows release status after V IN reached the release voltage. Release voltage (V DR ) = Detect voltage ( ) + ysteresis width (V YS ) (*) The time to change the status of RESETB pin from the detect-status after the watchdog-timeout happens with the condition of WD=V SS. (*7) The time to change the status of RESETB pin from the release-status to the detect-status with the condition of WD=V SS. (*8) When V IN is changed during watchdog timeout time, until time when RESETB pin shows detect status after V IN reached the detect voltage. (*9) The ambient temperature range (- Ta 15 ) is design Value. μa ms 5 8

9 XC13/XC131 Series EECTRICA CARACTERISTICS (Continued) XC131A Series PARAMETER SYMBO CONDITIONS Ta=5 - Ta 15 (*1) MIN. TYP. MAX. MIN. TYP. MAX. UNITS CIRCUIT Operating Voltage V IN V Detect Voltage Temperature Characteristics ysteresis Width Supply Current Output Current / ( Topr ) V YS I SS I RBOUT (*1) =1.~5.V SOT- DFN1515-A Topr 15 - ±5 - - ±5 - ppm / V IN =.9V V IN = 1.1V N-ch. V RESETB =.3V EN= (*) EN= V IN =1.5V V IN =.V (*) V IN =3.V (*3) V IN =.V (*) eakage Current I eak V IN =.V, V RESETB =.V Cd Pin Sink Current I cd V IN =1.5V, V Cd =.7V Release Delay Time1 (*) Release Delay Time (*7) Watchdog Timeout Period (*8) Detect Delay Time (*9) Watchdog Minimum Pulse Width Watchdog igh evel Voltage Watchdog ow evel Voltage Watchdog Pull-down Resistance t DR1 V IN =1.5V 1.1V, Cd=.1μF t DR V IN = 1.1V, Cd=.1μF t WD V IN = 1.1V, Cd=.1μF, WD= V SS t DF V IN = 1.1V 1.5V, Cd=.1μF μs t WDIN V WD V WD V IN =.V, Apply pulse from.v to V to the WD pin. 1.1V V IN.V, Cd=.1uF 1.1V V IN.V, Cd=.1uF ns V IN.7 - V IN.7 - V - V IN.3 - V IN.3 V R WD V WD =.V, R WD =V WD /I WD kω 7 EN igh evel Voltage V EN V IN V IN V 8 1.1V V IN.V EN ow evel Voltage V EN V 9 EN Pull-up Resistance R EN V IN =.V, V EN =V, R EN =V IN /I EN kω NOTE: * The WD pin and EN pin are open unless otherwise specified in the measurement conditions. (*1) : Nominal detect voltage (*) Excludes the current that flows to R EN pull-up resistance when EN =. (*3) (*) (*5) For >.V products only. For >3.V products only. For >.V products only. (*) Until time when RESETB pin shows release status after V IN reached the release voltage. Release voltage (V DR ) = Detect voltage ( ) + ysteresis width (V YS ) (*7) The time to change the status of RESETB pin from the detect-status after the watchdog-timeout happens with the condition of WD=V SS. (*8) The time to change the status of RESETB pin from the release-status to the detect-status with the condition of WD=V SS. (*9) When V IN is changed during watchdog timeout time, until time when RESETB pin shows detect status after V IN reached the detect voltage. (*1) The ambient temperature range (- Ta 15 ) is design Value. V V V μa ma μa ms /3

10 XC13/XC131 Series EECTRICA CARACTERISTICS (Continued) XC131B Series Ta=5 - Ta 15 (*1) PARAMETER SYMBO CONDITIONS MIN. TYP. MAX. MIN. TYP. MAX. UNITS CIRCUIT Operating Voltage V IN V Detect Voltage (*1) =1.~5.V SOT- DFN1515-A V V 1 Temperature Characteristics / ( Topr ) - Topr 15 - ±5 - - ±5 - ppm / ysteresis Width Supply Current Output Current 1/3 V YS I SS I RBOUT V IN =.9V V IN = 1.1V N-ch. V RESETB =.3V ENB= (*) ENB= V IN =1.5V V IN =.V (*) V IN =3.V (*3) V IN =.V (*) eakage Current I eak V IN =.V, V RESETB =.V Cd Pin Sink Current I cd V IN =1.5V, V Cd =.7V Release Delay Time1 (*) Release Delay Time (*7) Watchdog Timeout Period (*8) Detect Delay Time (*9) Watchdog Minimum Pulse Width Watchdog igh evel Voltage Watchdog ow evel Voltage Watchdog Pull-down Resistance t DR1 V IN =1.5V 1.1V, Cd=.1μF t DR V IN = 1.1V, Cd=.1μF t WD V IN = 1.1V, Cd=.1μF, WD= V SS t DF V IN = 1.1V 1.5V, Cd=.1μF μs t WDIN V WD V WD V IN =.V, Apply pulse from.v to V to the WD pin. 1.1V V IN.V, Cd=.1uF 1.1V V IN.V, Cd=.1uF ns V IN.7 - V IN.7 - V - V IN.3 - V IN.3 V R WD V WD =.V, R WD =V WD /I WD kω 7 ENB igh evel Voltage V ENB V IN V IN V 8 1.1V V IN.V ENB ow evel Voltage V ENB V ENB Pull-down 9 R ENB V ENB =.V, R ENB =V ENB /I ENB kω Resistance NOTE: *The WD pin and ENB pin are open unless otherwise specified in the measurement conditions. (*1) : Nominal detect voltage (*) Excludes the current that flows to the R ENB pull-down resistance when ENB =. (*3) For >.V products only. (*) For >3.V products only. (*5) For >.V products only. (*) Until time when RESETB pin shows release status after V IN reached the release voltage. Release voltage (V DR ) = Detect voltage ( ) + ysteresis width (V YS ) (*7) The time to change the status of RESETB pin from the detect-status after the watchdog-timeout happens with the condition of WD=V SS. (*8) The time to change the status of RESETB pin from the release-status to the detect-status with the condition of WD=V SS. (*9) When V IN is changed during watchdog timeout time, until time when RESETB pin shows detect status after V IN reached the detect voltage. (*1) The ambient temperature range (- Ta 15 ) is design Value. V μa ma μa ms 3 5

11 XC13/XC131 Series TEST CIRCUITS CIRCUIT1 CIRCUIT CIRCUIT3 CIRCUIT CIRCUIT5 V IN MRB/EN/ENB Cd WD V SS RESETB 1kΩ Waveform Measure Point 11/3

12 XC13/XC131 Series TEST CIRCUITS (Continued) CIRCUIT MRB/EN/ENB Cd WD V IN V SS RESETB 1kΩ Waveform Measure Point WD V IN.7 V IN.3 RESETB ( ) t WDIN t DR t WD t DR CIRCUIT7 CIRCUIT8 CIRCUIT9 I MRB I EN I ENB A V IN MRB/EN/ENB RESETB Cd WD V SS CIRCUIT1 MRB t MRIN MRB V IN 1kΩ Cd WD V SS RESETB Waveform Measure Point RESETB ( ) t DR 1/3

13 XC13/XC131 Series OPERATIONA EXPANATION In the XC13/XC131 Series, the voltage divided by R, RX, and RY connected to the V IN pin is compared to the internal reference voltage by the comparator, and the resulting output signal drives the watchdog logic and output driver. The V IN pin voltage is gradually lowered, and when the V IN pin voltage reaches the detect voltage, level signal is output to the reset output pin ( type). V IN R RMRB RX RY Voltage Reference - + RESET O GIC RESETB MRB V SS Cd O GIC + Voltage Reference - RWD PUSE DETECT O GIC Cd WD XC13 Series <Output signal of reset output pin> If the V IN pin voltage is below the detect voltage, the reset output pin outputs level signal. After the V IN pin voltage reaches the release voltage, the reset output pin holds level during release delay time1 (t DR1 ). If a start signal is not input to the WD pin within the watchdog timeout time, the reset output pin holds level during release delay time (t DR ) and then outputs level signal. <ysteresis> If the internal comparator outputs level signal, the PMOS transistor connected in parallel to R turns ON and the hysteresis circuit activates. The hysteresis voltage width is obtained from the difference between the detect voltage and the release voltage. The hysteresis width is (.5) V (TYP.). <WD pin> A watchdog timer is used to detect abnormal operation and runaway in a microprocessor. If signal is not input from the microprocessor within the watchdog timeout time, the reset output pin holds the detect state during release delay time (t DR ), and then level signal is output to the reset output pin. In addition, the watchdog pin is pulled down internally to V SS, and when the watchdog pin is OPEN, a reset signal is output after the watchdog timeout time. The watchdog timeout time (t WD ) can be set using the equation below. t WD =Cd 1 Example: When Cd is.1μf, t WD = = 1ms (TYP.) 13/3

14 XC13/XC131 Series OPERATIONA EXPANATION (Continued) <Release delay time 1> When power is added on the V IN, the time from the point that V IN reaches the release voltage until the reset output pin reaches the release voltage is release delay time 1 (t DR1 ). Release delay time 1 (t DR1 ) can be set using the equation below. t DR1 =Cd 1 Example: When Cd is.1μf, t DR1 = =1ms (TYP.) <Release delay time > Release delay time (t DR ) is the duration of the detect state until the watchdog timer restarts when signal is not input to the WD pin within the watchdog timeout time. Release delay time (t DR ) can be set using the equation below. t DR =Cd 1 5 Example: When Cd is.1μf, t DR = =1ms (TYP.) <Detect delay time> The detect delay time (t DF ) is the time until the V IN pin voltage drops to the detect voltage and the reset output pin enters the detect state. <MRB pin> *XC13 Series The MRB pin voltage can be input to force the signal of the reset output pin to the detect state. When the MRB pin voltage input reaches an level signal, an level signal is output to the reset output pin. After the MRB pin voltage reaches level, the reset output pin holds the detect state during release delay time 1(t DR1 ). <EN pin> *XC131A Series If the watchdog function will not be used, the EN pin can be set to level to forcibly stop only the watchdog function and keep the voltage detector operating. When using the watchdog function, use the EN pin at level. When the input voltage reaches the level, the reset output pin holds the detect state during release delay time 1 (t DR1 ), regardless of the EN pin voltage. (Refer to Timing Chart, 1) If the input voltage is higher than the release voltage and the EN pin voltage reaches level, the watchdog function recovers. (Refer to Timing Chart, ) <ENB Pin> *XC131B Series When the watchdog function is not used, the ENB pin can be set to level to keep the voltage detector operating and forcibly stop only the watchdog function. To use the watchdog function, use the ENB pin at level. When the input voltage reaches the level, the reset output pin holds the detect state during release delay time 1 (t DR1 ), regardless of the ENB pin voltage. (Refer to Timing Chart 3, 1) When the input voltage is higher than the release voltage and the ENB pin voltage reaches level, the watchdog function recovers. (Refer to Timing Chart 3, ) 1/3

15 XC13/XC131 Series OPERATIONA EXPANATION (Continued) <Timing Chart 1> XC13 Series 15/3

16 XC13/XC131 Series OPERATIONA EXPANATION (Continued) <Timing Chart > XC131A Series VIN VDR evel VDF evel VIN Pin Wave Form ysterisis Range Min.Operating Voltage GND EN EN Pin Wave Form GND t WD>t WDIN WD WD Pin Wave Form t WD t WD t WD t WD GND Cd IG evel Cd Pin Wave Form Cd ow evel GND VDR evel VDF evel RESETB Pin Wave Form Min.Operating Voltage GND Unstable t DR1 t DR t DR t DR 1 1/3

17 XC13/XC131 Series OPERATIONA EXPANATION(Continued) <Timing Chart 3> XC131B Series VIN VDR evel VDF evel VIN Pin Wave Form ysterisis Range Min.Operating Voltage GND ENB ENB Pin Wave Form GND twd>twdin WD WD Pin Wave Form twd twd twd twd GND Cd IG evel Cd Pin Wave Form Cd ow evel GND VDR evel VDF evel RESETB Pin Wave Form Min.Operating Voltage GND Unstable tdr1 tdr tdr tdr 1 17/3

18 XC13/XC131 Series NOTES ON USE 1. Use this IC within the absolute maximum ratings. Risk of deterioration or damage if the absolute maximum ratings are exceeded during temporary or transient voltage drops or voltage jumps.. If a resistance is added between the power and the VIN pin, the flowthrough current when the IC operates will cause the V IN pin voltage to drop and the IC may malfunction. 3. When raising the input voltage from the minimum operating voltage or less, if changed suddenly, the release delay time may become short.. Sufficiently reinforce the V IN and GND lines, as power noise may cause malfunctioning of the watchdog function and voltage detector. It is recommended that a capacitor be added between V IN and GND. 5. Enter level, or level should be fed to MRB and EN/ENB pin.. To ensure stable operation of the watchdog function, be sure to add a capacitor at the Cd pin. The release delay time and watchdog timeout time are affected by the accuracy and temperature characteristics of the Cd pin capacitor. 7. If the Cd pin capacitor is unable to discharge to the ground level during recovery after a power interruption, the release delay may become noticeably shorter. Exercise caution. 8. The pull-up resistance connected to the output pin determines the RESETB voltage at the time of detect and release. Refer to the following to select the resistance value. At detection: V RESETB =(Vpull-Up)/(1+Rpull/R ON ) Vpull-Up: Voltage after pull-up R (*1) ON : ON resistance of N-ch driver (calculated from V RESETB /I RBOUT1 in electrical characteristics) (*3) Example calculation: When V IN =.V (*), R ON =.3/ Ω(MAX.). If you wish to make the VRESETB voltage at detection.1v or lower with Vpull-Up=3.V, Rpull=(Vpull-Up /V RESETB -1) R ON =(3/.1-1) kΩ, and thus to make the output voltage at detection.1v or less under the above conditions, the pull-up resistance must be 1.8kΩ or higher. (*1) The smaller V IN is, the larger R ON becomes. (*) When selecting V IN, calculate using the lowest value of the input voltage range you will use. (*3) I RBOUT1 specified in the electrical characteristics is the value at Ta=5. I RBOUT1 varies depending on the ambient temperature. To select the pull-up resistance taking ambient temperature into account, please calculate I RBOUT with the MIN. value of the ambient temperature range of - Ta 15. At release: V RESETB = (Vpull-Up)/(1+Rpull/R OFF ) Vpull-Up: Voltage after pull-up R OFF : Resistance value MΩ(MIN.) when N-ch driver is OFF (calculated from V RESETB /I EAK in electrical characteristics) Calculation example: If you wish to make V RESETB 5.99V or higher with Vpull-Up=.V Rpull=(Vpull-Up/V RESETB -1) R OFF =(/5.99-1) 1 1kΩ, and thus to make the output voltage 5.99V or higher at release under the above conditions, the pull-up resistance must be 1kΩ or less. 9. We place importance on improving our products and increasing reliability. owever, please design safety into the device and system, including fail-safe design and post-aging treatment. 18/3

19 XC13/XC131 Series TYPICA PERFORMANCE CARACTERISTICS (1) Detect, Release Voltage vs. Ambient Temperature XC13,XC131 ( =1.V) XC13,XC131 ( =3.V) Detect, Release Voltage :, V DR (V) V DR Detect, Release Voltage :, V DR (V) V DR () Detect, Release Voltage vs. Input Voltage XC13,XC131 ( =5.V) XC13,XC131 ( =1.V) Detect, Release Voltage :, V DR (V) V DR OutPut Voltage : V RESETB (V) Rpull-up=1kΩ Ta=- Ta=5 Ta=85 Ta= Input Voltage : V IN (V) XC13,XC131 ( =3.V) XC13,XC131 ( =5.V) Rpull-up=1kΩ Rpull-up=1kΩ Detect Voltage : (V) Ta=- Ta=5 Ta=85 Ta=15 Detect Voltage : (V) Ta=- Ta=5 Ta=85 Ta= Input Voltage : V IN (V) Input Voltage : V IN (V) 19/3

20 XC13/XC131 Series TYPICA PERFORMANCE CARACTERISTICS (Continued) (3) Supply Current vs. Input Voltage XC13 ( =1.V) XC13 ( =3.V) Supply Current : I SS (μa) Ta=- Ta=5 Ta=85 Ta= Input Voltage: V IN (V) Supply Current : I SS (μa) Ta=- Ta=5 Ta=85 Ta= Input Voltage: V IN (V) Supply Current : I SS (μa) XC13 ( =5.V) Ta=- Ta=5 Ta=85 Ta= Input Voltage: V IN (V) Supply Current : I SS (μa) XC131 ( =1.V) Ta=- Ta=5 Ta=85 Ta= Input Voltage: V IN (V) EN=V IN (XC131A) ENB=V SS (XC131B) Supply Current : I SS (μa) XC13,XC131 ( =3.V) EN=V IN (XC131A) ENB=V SS (XC131B) Ta=- Ta=5 Ta=85 Ta= Input Voltage: V IN (V) Supply Current : I SS (μa) XC13,XC131 ( =5.V) EN=V IN (XC131A) ENB=V SS (XC131B) Ta=- Ta=5 Ta=85 Ta= Input Voltage: V IN (V) /3

21 TYPICA PERFORMANCE CARACTERISTICS (Continued) (3) Supply Current vs. Input Voltage (Continued) XC13/XC131 Series Supply Current : I SS (μa) 1 8 XC131 ( =1.V) EN=V SS (XC131A) ENB=V IN (XC131B) Ta=- Ta=5 Ta=85 Ta=15 Supply Current : I SS (μa) 1 8 XC131 ( =3.V) EN=V SS (XC131A) ENB=V IN (XC131B) Ta=- Ta=5 Ta=85 Ta= Input Voltage: V IN (V) Input Voltage: V IN (V) 1 XC131 ( =5.V) EN=V SS (XC131A) ENB=V IN (XC131B) Supply Current : I SS (μa) 8 Ta=- Ta=5 Ta=85 Ta= Input Voltage: V IN (V) () Output Current vs. V RESETB (5) Output Current vs. Input Voltage XC13,XC131 XC13,XC131 3 Ta=5 3 V RESETB =.3V Output Current : I RBOUT (ma) 5 V IN =.V V IN =3.V 15 1 V IN =.V 5 V IN =1.5V V RESETB (V) Output Current : I RBOUT (ma) Ta=- Ta=5 Ta=85 Ta= Input Voltage : V IN (V) 1/3

22 XC13/XC131 Series TYPICA PERFORMANCE CARACTERISTICS (Continued) () Cd Sink Current vs. Ambient Temperature 5 XC13,XC131 V Cd =.7V Cd Pin Sink Current : I Cd (ma) 3 1 V IN =1.5V V IN =.5V (7) Release Delay Time1 vs. Ambient Temperature 1 XC13,XC131 V IN =1.5V V DF *1.1 Cd=.1μF 1 XC13,XC131 V IN =1.5V V DF *1.1 Cd=.1μF Release delay Time1 : t DR1 (ms) Release delay Time1 : t DR1 (ms) (8) Release Delay Time vs. Ambient Temperature 1. XC13,XC131 V IN =V DF *1.1 Cd=.1μF 1 XC13,XC131 V IN =V DF *1.1 Cd=.1μF Release delay Time : t DR (ms) Release delay Time : t DR (ms) /3

23 Watchdog Timeout Period : t WD (ms) TYPICA PERFORMANCE CARACTERISTICS (Continued) (9) Watchdog Timeout Period vs. Ambient Temperature XC13,XC V IN =V DF *1.1 Cd=.1μF Watchdog Timeout Period : t WD (ms) XC13,XC131 XC13/XC131 Series V IN =V DF *1.1 Cd=.1μF (1) WD igh evel Threshold Voltage vs. Ambient Temperature (11) WD ow evel Threshold Voltage vs. Ambient Temperature WD ighevel Threshold Voltage : V WD (V) XC13,XC V IN =.V 3.. V IN =1.7V WD owevel Threshold Voltage : V WD (V) XC13,XC V IN =.V 3.. V IN =1.7V V WD V IN t WDIN t WDIN V SS V WD WD Input Pulse WD Input Pulse 3/3

24 XC13/XC131 Series TYPICA PERFORMANCE CARACTERISTICS (Continued) (1) MRB igh evel Threshold Voltage vs. Ambient Temperature (13) MRB ow evel Threshold Voltage vs. Ambient Temperature MRB ighevel Threshold Voltage : V MR (V) XC13A V IN =.V V IN =1.7V MRB owevel Threshold Voltage : V MR (V) XC13A V IN =.V.8.7. V IN =1.7V (1) EN igh evel Threshold Voltage vs. Ambient Temperature (15) EN ow evel Threshold Voltage vs. Ambient Temperature XC131A XC131A EN ighevel Threshold Voltage : V EN (V) V IN =.V V IN =1.7V EN owevel Threshold Voltage : V EN (V) V IN =.V.8.7. V IN =1.7V (1) ENB igh evel Threshold Voltage vs. Ambient Temperature (17) ENB ow evel Threshold Voltage vs. Ambient Temperature ENB ighevel Threshold Voltage : V ENB (V) XC131B V IN =.V V IN =1.7V ENB owevel Threshold Voltage : V ENB (V) XC131B V IN =.V.8.7. V IN =1.7V /3

25 TYPICA PERFORMANCE CARACTERISTICS (Continued) (18) MRB Pull-up Resistance vs. Ambient Temperature (19) EN Pull-up Resistance vs. Ambient Temperature XC13A XC131A XC13/XC131 Series 1 1 MRB Pull-up Resistance : R MRB (kω) EN Pull-up Resistance : R EN (kω) () ENB Pull-down Resistance vs. Ambient Temperature (1) WD Pull-up Resistance vs. Ambient Temperature ENB Pull-down Resistance : R ENB (kω) XC131B WD Pull-down Resistance : R WD (kω) XC13,XC /3

26 XC13/XC131 Series PACKAGING INFORMATION SOT- (unit: mm) ± ~ (.95) (.95) SOT- Reference Pattern ayout (unit: mm) 1.. /3

27 XC13/XC131 Series PACKAGING INFORMATION DFN1515-A (unit: mm) DFN1515-A Reference Pattern ayout (unit: mm) DFN1515-A Reference Metal Mask Design (unit: mm) 7/3

28 XC13/XC131 Series PACKAGING INFORMATION (Continued) SOT- Power Dissipation (Toprmax+15 ) Power dissipation data for the SOT- is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as the reference data taken in the following condition. 1. Measurement Condition Condition: Mount on a board Ambient: Natural convection Soldering: ead (Pb) free Board: Dimensions x mm (1 mm in one side) Copper (Cu) traces occupy 5% of the board area In top and back faces (Board of SOT- is used) Material: Glass Epoxy (FR-) Thickness: 1.mm Through-hole x.8 Diameter Evaluation Board (Unit: mm). Power Dissipation vs. Ambient Temperature Board Mount (Tjmax=15 ) Ambient Temperature ( ) Power Dissipation Pd (mw) Thermal Resistance ( /W) Pd vs Ta (Ta=15 ) Power Dissipation : Pd(mW) Ambient Temperature : Ta( ) 8/3

29 XC13/XC131 Series DFN1515-A Power Dissipation (Toprmax+15 ) Power dissipation data for the DFN1515-A is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as the reference data taken in the following condition. 1. Measurement Condition Condition: Mount on a board Ambient: Natural convection Soldering: ead (Pb) free Board: x mm (1 mm ) Copper ayers Each layer is 5% connected to the Package heat-sink Material: Glass Epoxy (FR-) Thickness: 1.mm Through-hol x.8 Diameter e Evaluation Board (Unit: mm). Power Dissipation vs. Ambient Temperature Board Mount (Tjmax=15 ) Ambient Temperature ( ) Power Dissipation Pd (mw) Thermal Resistance ( /W) /3

30 XC13/XC131 Series MARKING RUE XC13 SOT represents products series MARK PRODUCT SERIES XC13******-G represents type of detector and detect voltage MARK DETECT VOTAGE (V) PRODUCT TYPE PRODUCT SERIES 1 1.~..1~3. A XC13A*****-G 3 3.1~..1~5. DFN1515-A 3 represents detect voltage MARK DETECT VOTAGE (V) MARK DETECT VOTAGE (V) 1 x.1 x. x. 7 x.7 3 x.3 8 x.8 x. 9 x.9 5 x.5 x. 5 represents production lot number 1~9, A~Z, 11~9Z, A1~A9, AA~AZ, B1~ZZ in order. (G, I, J, O, Q, W excluded) * No character inversion used. 3/3

31 MARKING RUE (Continued) XC131 SOT- 5 1 represents products series MARK PRODUCT SERIES XC131******-G XC13/XC131 Series DFN1515-A represents type of detector and detect voltage MARK DETECT VOTAGE (V) PRODUCT TYPE PRODUCT SERIES A 1.~. B.1~3. A XC131A*****-G C 3.1~. D.1~5. E 1.~. F.1~3. B XC131B*****-G 3.1~. K.1~5. 3 represents detect voltage MARK DETECT VOTAGE (V) MARK DETECT VOTAGE (V) 1 x.1 x. x. 7 x.7 3 x.3 8 x.8 x. 9 x.9 5 x.5 x. 5 represents production lot number 1~9, A~Z, 11~9Z, A1~A9, AA~AZ, B1~ZZ in order. (G, I, J, O, Q, W excluded) * No character inversion used. 31/3

32 XC13/XC131 Series 1. The product and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date.. The information in this datasheet is intended to illustrate the operation and characteristics of our products. We neither make warranties or representations with respect to the accuracy or completeness of the information contained in this datasheet nor grant any license to any intellectual property rights of ours or any third party concerning with the information in this datasheet. 3. Applicable export control laws and regulations should be complied and the procedures required by such laws and regulations should also be followed, when the product or any information contained in this datasheet is exported.. The product is neither intended nor warranted for use in equipment of systems which require extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss of human life, bodily injury, serious property damage including but not limited to devices or equipment used in 1) nuclear facilities, ) aerospace industry, 3) medical facilities, ) automobile industry and other transportation industry and 5) safety devices and safety equipment to control combustions and explosions. Do not use the product for the above use unless agreed by us in writing in advance. 5. Although we make continuous efforts to improve the quality and reliability of our products; nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent personal injury and/or property damage resulting from such failure, customers are required to incorporate adequate safety measures in their designs, such as system fail safes, redundancy and fire prevention features.. Our products are not designed to be Radiation-resistant. 7. Please use the product listed in this datasheet within the specified ranges. 8. We assume no responsibility for damage or loss due to abnormal use. 9. All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex Semiconductor td in writing in advance. TOREX SEMICONDUCTOR TD. 3/3