(25.8) MIN. C kv

Transcription

1 /ST// /ST / Features. Low profile type (height:6mm). Built-in zero-cross circuit (ST/). RMS ON-state current I T (rms) : MX. (T a ). Recognized by UL, file No.E978 pproved by CS, No.LR67 pplications. Programmable controllers. ir conditioners. Copiers. utomatic vending machines bsolute Maximum Ratings (T a =) Parameter Symbol Rating Unit Forward current I F m Reverse voltage R 6 RMS ON-state current I T(rms) * * Peak one cycle surge current Input Output * * Repetitive peak OFF-state voltage ST Non-repetitive ST peak OFF-state voltage Critical rate of rise of ON-state current Operating frequency Operating temperature Storage temperature Isolation voltage Soldering temperature I surge DRM DSM 6 6 di T/dt f to 6 T opr to + to + T stg iso (rms) T sol. 6 * Refer to Fig., Fig. * 6Hz sine wave, start at T j = * Isolation voltage measuring method () Dielectric withstand voltage tester with zero cross circuit shall be used () The applied voltage waveform shall be sine wave () oltage shall be applied between input and output (Input and output terminals shall be shorted respectively) () to 6%RH, C 6Hz, for minute * For s /µs Hz k Low Profile Type Solid State Relays Outline Dimensions (.8) MIN. B +.8 MX.. MX..8 (.8) (.) (.8) (.6) 7 Common to pin No. φ.7 6. (.) (.8) /.8 Common to pin No.. MIN : Do not allow external connection. ( ) : Typical dimensions Lot No. (DIN Standard) Zero cross circuit Epoxy resin Internal connection diagram. Model line-up No zero-cross circuit Built-in zero-cross circuit Output (Triac T) Output (Triac T) Input (+) Input () For lines ST ST/ (Unit : mm) (Model No.) B C ST 6C. (.8) For lines Notice Internet In the absence of confirmation by device specification sheets, SHRP takes no responsibility for any defects that may occur in equipment using any SHRP devices shown in catalogs, data books, etc. Contact SHRP in order to obtain the latest device specification sheets before using any SHRP device. Internet address for Electronic Components Group

2 /ST// Electro-optical Characteristics (T a =) Parameter Symbol Conditions MIN. TYP. MX. Unit Forward voltage Reverse current Repetitive peak OFF-state current F I R I DRM I F =m R = D = DRM.. ON-state voltage T (rms) I T (rms) =, Resistance load, I F =m.7 Holding current I H m Critical rate of rise of OFF-state voltage d/dt D =/ DRM /µs Critical rate of rise of OFF-state voltage at commutaion (d/dt) C T j =, D =/ DRM, di t /dt=./ms /µs Minimum / D =, R L =Ω I FT trigger current ST/ D =6, R L =Ω 8 m Zero cross voltage ST/ OX I F =8m Isolation resistance R iso DC, to 6%RH Ω D (rms) =, CHz, I T (rms) =, Turn-on ST Resistance load, I F =m t on time D (rms) =, CHz, I T (rms) =, ms Resistance load, I F =m Input Output Transfer characteristics Turn-off time ST t off D (rms) =, CHz, I T (rms) =, Resistance load, I F =m D (rms) =, CHz, I T (rms) =, Resistance load, I F =m ms Fig. Forward Current vs. mbient Temperature 6 Fig. RMS ON-state Current vs. mbient Temperature. Forward current IF (m) RMS ON-state current IT (rms) ()

3 /ST// Fig. Forward Current vs. Forward oltage Fig. Surge Current vs. Power-on Cycle Forward current IF (m). T a =7 Surge current Isurge () f=6hz T j = start Forward voltage F () Fig. Minimum Trigger Current vs. mbient Temperature (Typical alue) / D = 9 Power-on cycle (Times) Fig.6 Minimum Trigger Current vs. mbient Temperature (Typical alue) ST/ D =6 Minimum trigger current IFT (m) mbient temperature T () Fig.7 Maximum ON-state Power Dissipation vs. RMS ON-state Current (Typical alue). Minimum trigger current IFT (m) Maximum ON-state power dissipation (W).. T a =.. RMS ON-state current I T ()

4 /ST// Fig.8 Repetitive Peak OFF-state Current vs. mbient Temperature Repetitive peak OFF-state current IDRM () /ST D = ST Fig.9 Repetitive Peak OFF-state Current vs. mbient Temperature Repetitive peak OFF-state current IDRM () / D =

5 NOTICE The circuit application examples in this publication are provided to explain representative applications of SHRP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHRP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHRP's devices. Contact SHRP in order to obtain the latest device specification sheets before using any SHRP device. SHRP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. Observe the following points when using any devices in this publication. SHRP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- udio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHRP devices are used for or in connection with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- larm equipment --- arious safety devices, etc. (iii)shrp devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). If the SHRP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHRP devices. This publication is the proprietary product of SHRP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHRP. Express written permission is also required before any use of this publication may be made by a third party. Contact and consult with a SHRP representative if there are any questions about the contents of this publication.