Photocoupler Product Data Sheet LTV-725V (M, S, S-TA, S-TA1) series Spec No.: DS Effective Date: 07/22/2016 LITE-ON DCC RELEASE

Transcription

1 Prduct Data Sheet LTV-725V (M, S, S-TA, S-TA1) Spec N.: DS Effective Date: 07/22/2016 Revisin: C LITE-ON DCC RELEASE BNS-OD-FC001/A4 LITE-ON Technlgy Crp. / Optelectrnics N.90,Chien 1 Rad, Chung H, New Taipei City 23585, Taiwan, R.O.C. Tel: Fax: /

2 1. DESCRIPTION 1.1 Features High cllectr-emitter vltage (V CEO=300V) High input-utput islatin vltage (V ISO=5,000Vrms) Current transfer rati ( CTR : MIN. 0% at I F = 1mA, V CE = 2V ) Dual-in-line package : LTV-725V Wide lead spacing package LTV-725VM Surface munting package LTV-725VS Tape and reel packaging LTV-725VS-TA, LTV-725VS-TA1 Safety apprval * UL apprved (N. E113898) * TUV apprved (N. R ) * CSA apprved (N. CA ) * FIMKO apprved (N ) * NEMKO apprved (N. P ) * DEMKO apprved (N ) * SEMKO apprved (N / 01-20) * VDE apprved (N ) RHS Cmpliance All materials be used in device are fllwed EU RHS directive (N.2002/95/EC). ESD pass HBM 8000V/MM2000V MSL class1 1/11

3 2. PACKAGE DIMENSIONS 2.1 LTV-725V 2.2 LTV-725V 2.3 LTV-725VS Ntes : 1. Year date cde digit wrk week. 3. Factry identificatin mark shall be marked (Y: Thailand, W: China-CZ). 4. Fr VDE ptin. Dimensins in millimeters (inches). 2/11

4 3. TAPING DIMENSIONS 3.1 LTV-725VS-TA 3.2 LTV-725VS-TA1 Descriptin Symbl Dimensin in mm (inch) Tape wide W 16±0.3 (0.63) Pitch f sprcket hles P 0 4±0.1 (0.15) Distance f cmpartment F 7.5±0.1 (0.295) P 2 2±0.1 (0.079) Distance f cmpartment t cmpartment P 1 12±0.1 (0.472) 3.3 Quantities Per Reel Package Type TA / TA1 Quantities (pcs) 0 3/11

5 4. RATING AND CHARACTERISTICS 4.1 Abslute Maximum Ratings at Ta=25 C Parameter Symbl Rating Unit Frward Current I F 50 ma Input Reverse Vltage V R 6 V Pwer Dissipatin P 70 mw Junctin Temperature T J 125 C Cllectr - Emitter Vltage V CEO 300 V Cllectr - Base Vltage V CBO 300 V Output Emitter - Base Vltage V EBO 6 V Emitter - Cllectr Vltage V ECO 0.1 V Cllectr Current I C 150 ma Cllectr Pwer Dissipatin P C 300 mw Ttal Pwer Dissipatin P tt 350 mw 1. Islatin Vltage V is 5000 V rms Operating Temperature T pr -25 ~ + Strage Temperature T stg -45 ~ Sldering Temperature T sl 260 C C C 1. AC Fr 1 Minute, R.H. = 40 ~ 60% Islatin vltage shall be measured using the fllwing methd. (1) Shrt between ande and cathde n the primary side and between cllectr and emitter n the secndary side. (2) The islatin vltage tester with zer-crss circuit shall be used. (3) The wavefrm f applied vltage shall be a sine wave. 2. Fr 10 Secnds 4/11

6 4.2 ELECTRICAL OPTICAL CHARACTERISTICS at Ta=25 C Parameter Symbl Min. Typ. Max. Unit Test Cnditin Frward Vltage V F V I F=10mA Input Reverse Current I R 10 A V R=4V Terminal Capacitance C pf V=0, f=1mhz Cllectr Dark Current I CEO 1 A V CE=200V, I F=0 Output Cllectr-Emitter Breakdwn Vltage Emitter-Cllectr Breakdwn Vltage BV CEO 300 V I C=0.1mA, I F=0 BV ECO 0.1 V I E=10 A, I F=0 Cllectr Current I C ma 1. Current Transfer Rati CTR 1,000 4,000 15,000 % I F=1mA, V CE=2V Cuple Cllectr-Emitter Saturatin Vltage V CE(sat) 1.2 V I F=20mA I C=mA Islatin Resistance R ISO 5x DC500V, 40 ~ 60%.R.H. Flating Capacitance C f pf V=0, f=1mhz Cut-Off Frequency f c 1 7 khz V CE=2V, I C=20mA R L=Ω, -3dB Respnse Time (Rise) tr 300 s V CE=2V, I C=20mA Respnse Time (Fall) tf 20 s R L=Ω I 1. CTR C % I F 5/11

7 5. CHARACTERISTICS CURVES Fig.1 Frward Current vs. Ambient Temperature Fig.2 Cllectr Pwer Dissipatin vs. Ambient Temperature Frward current I (ma) F Ambient temperature Ta ( C) Cllectr pwer dissipatin Pc (mw) Ambient temperature Ta ( C) Fig.3 Frward Current vs. Frward Vltage Fig.4 Current Transfer Rati vs. Frward Current 5000 Frward current (ma) 10 C 80 C 60 C 40 C 20 C Current transfer rati CTR (%) VCE= 2V Frward vltage (V) Frward current (ma) Fig.5 Cllectr Current vs. Cllectr-emitter Vltage Fig.6 Relative Current Transfer Rati vs. Ambient Temperature Cllectr current Ic (ma) mA 3mA 2mA 1.5mA 1mA Pc(MAX.) 0.7mA IF= 0.5mA Relative current transfer rati (%) I F= 1mA V CE= 2V Cllectr-emitter vltage V CE(V) O Ambient temperature Ta ( C) 6/11

8 Fig.7 Cllectr-emitter Saturatin Vltage vs. Ambient Temperature Fig.8 Cllectr Dark Current vs. Temperature Cllectr-emitter saturatin vltage V CE (sat) (V) I F= 20mA Ic= ma O O Ambient temperature Ta ( C) Ambient temperature Ta ( C) Cllectr dark current ICEO (na) 0 V CE= 200V Fig.9 Respnse Time vs. Lad Resistance Fig.10 Frequency Respnse VCE= 2V IC= 20mA tr 0 VCE= 2V IC= 20mA Respnse time ( s) td tf ts Vltage gain Av (db) RL= 1k Lad resistance RL (k ) Frequency f (khz) Test Circuit fr Respnse Time Test Circuit fr Frequency Respnse Input RD Input Vcc Output RL Output Vcc 10% RD RL Output 90% td ts tr tf 7/11

9 Temperature ( C) 6. TEMPERATURE PROFILE OF SOLDERING 6.1 IR Reflw sldering (JEDEC-STD-020C cmpliant) One time sldering reflw is recmmended within the cnditin f temperature and time prfile shwn belw. D nt slder mre than three times. Prfile item Cnditins Preheat - Temperature Min (T Smin) - Temperature Max (T Smax) - Time (min t max) (ts) 150 C 200 C 90±30 sec Sldering zne - Temperature (T L) - Time (t L) Peak Temperature (T P) Ramp-up rate Ramp-dwn rate 217 C 60 sec 260 C 3 C / sec max. 3~6 C / sec Ramp-up TL 217 C Tsmax 200 C 20 sec TP 260 C Ramp-dwn Tsmin 150 C 60 sec tl (Sldering) 25 C 60 ~ 120 sec ts (Preheat) 35~70 sec Time (sec) 8/11

10 6.2 Wave sldering (JEDEC22A111 cmpliant) One time sldering is recmmended within the cnditin f temperature. Temperature: 260+0/-5 C Time: 10 sec. Preheat temperature:25 t 140 C Preheat time: 30 t 80 sec. 6.3 Hand sldering by sldering irn Allw single lead sldering in every single prcess. One time sldering is recmmended. Temperature: 380+0/-5 C Time: 3 sec max. 9/11

11 7. RRECOMMENDED FOOT PRINT PATTERNS (MOUNT PAD) Unit: mm 10/11

12 8. NAMING RULE LTV-725V(1)-(2) DEVICE PART NUMBER - (1) N suffix = Dual-in-Line package M = Wide lead spacing package S = Surface munting package (2) TAPING TYPE (TA, TA1) Please refer t rientatin f taping n Page: 3 Example : LTV-725VS-TA1 LTV 725V(1)(2)-V DEVICE PART NUMBER (1) N suffix = Dual-in-Line package M = Wide lead spacing package S = Surface munting package (2) TAPING TYPE (TA, TA1) Please refer t rientatin f taping n Page: 3 (3) VDE rder ptin Example : LTV725VSTA1-V 9. NOTES LiteOn is cntinually imprving the quality, reliability, functin r design and LiteOn reserves the right t make changes withut further ntices. The prducts shwn in this publicatin are designed fr the general use in electrnic applicatins such as ffice autmatin equipment, cmmunicatins devices, audi/visual equipment, electrical applicatin and instrumentatin. Fr equipment/devices where high reliability r safety is required, such as space applicatins, nuclear pwer cntrl equipment, medical equipment, etc, please cntact ur sales representatives. When requiring a device fr any specific applicatin, please cntact ur sales in advice. If there are any questins abut the cntents f this publicatin, please cntact us at yur cnvenience. The cntents described herein are subject t change withut prir ntice. Immerge unit s bdy in slder paste is nt recmmended. 11/11