EHWA DIAMOND INDUSTRIAL CO., LTD. Oversea Marketing : Sundus Trading Company U.S.A Distributor : Semiconductor Technology America.

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1 EHWA DIAMOND INDUSTRIAL CO., LTD. Oversea Marketing : Sundus Trading Company U.S.A Distributor : Semiconductor Technology America., Inc

2 Vision 21 Ehwa s vision is to be the 21st century s customer satisfaction leader in - Product Quality -Service - Innovation and Technology - Trading and Education Providing our customer with a competition advantage in the market

3 Company Profile EHWA Diamond Ind. Co., LTD. was established in Youngdungpo, Seoul Started to manufacture and sell diamond tools for stone Started to manufacture and sell diamond Core Bits and Reaming Shells for drilling Started to manufacture and sell diamond grinding wheels Started to Manufacture and sell diamond grinding wheels Moved its plant form Seoul to Osan Set up a R&D laboratory Established technical ties with Osaka Diamond Co. of Japan for the production of Rotary Dresser and precision Electroplated tools Company products were designated as world class products by Ministry of Commerce and Industry Set up a China factory and a Suhchun factory. 11 Acquisited ISO9001 certification for export tools Awarded IR52 CHANG, YOUNG SIL prize for new developed product, Diamond Wire Saw Received U.S. $50 Million Export Tower an the Meritorious Exporter Tower at the Trade Day Celebration. (Presidential Citation) Designated as Best Quality Management Enterprise in Kyungi-do Province Designated as Best Labor-Management Cooperation Enterprise Awarded the golden prize for the product quality at the 1st WBA competition(korea Management Association Consultants) Awarded the diamond prize for the production process at the 2nd WBA competition Awarded the first prize in the 24th productivity competition (Presidential Citation)(Korea Productivity Center.)

4 Quality Management ISO 9001

5 PROCESS FLOW CHART Diamond & Shank & Metal Powder Metal Bond Slurry Coating Inspection (IQC System) Diamond Distribution Sintering (High Vacuum Furnace) Inspection Electroplated Coating Final Inspection (Q.A) Cleaning & Package

6 SPECIFICATION APPROVAL FLOW CHART EHWA DIAMOND 1. Changing of Process & Spec CUSTOMER 2. New Spec./Criteria Review 4. Review of Customer Approval 3. Approval of Requirement 5. New Sample Supply Production 6. New Sample Test 8. Review of New Sample Result 7. Report of Results (Pass/Fail) 9. Mass Sample Supply Production 10. Mass Sample Test 12. Mass Production Ready 11. Test Result & Decision

7 CHARACTERISTICS Removal of contamination due to the metal extraction : Double metal layer restrains the development of micro scratch preventing the metal particle from being extracted from surface Morphology of lower surface

8 CHARACTERISTICS Schematic diagram cross section of new conditioner (EHWA Patent Peding) -1 st Layer restrains the micro scratch by filling the chink of metal surface where the particles can easily come off. -2 nd Layer made with conventional MSL process guarantees excellent holding force of diamond, longer life time and a chip pocket that allows the slurry to be easily discharged.

9 Comparison of New type conditioner < EWHA Diamond New BSL Type > < Maker A (U.S.A) >

10 Nice finishing of boundary of diamond and metal bond

11 Excellent Holding Force : As metal chemically reacts with the diamond and forms carbide at the interface the, holding force is very strong. As a result, the danger of diamond extraction is very small.

12 Formation of Chip Pocket : Because the chip pocket (drainage path of grinding residuum) between diamonds let the slurry move easily, a higher removal rate is obtained

13 Related merits of each type Contents Electroplated Type Conventional MSL Type (ex, Maker a ) EHA New BSL TYPE Conditioner Stability (Dia. Holding force) Bad Life Time Bad Chip Pocket (drainage path) Bad Grinding efficiency Medium Restriction of micro scratch Bad

14 Morphology of tilted surface

15 Morphology of surface

16 Relate merits of each type Contents Bad Remarks Diamond Holding Force Stability (Dia.Extraction) Electroplated Type (ex, TBW, Marshall) < Conventional MSL Type (ex, TI(ABT) < = EHWA New BSL Type Conditioner Holding force between Diamond and Metal Bond Life Time Chip pocket formation (drainage of residuum) Grinding efficiency (removal rate) Electroplated Type Electroplated Type < < Conventional MSL Type Conventional MSL Type = = EHWA New BSL Type Conditioner EHWA New BSL Type Conditioner Existence of Chip Pocket Restriction of micro scratch Conventional MSL Type < Electroplated Type = EHWA New BSL Type Conditioner Roughness of surface Conventional MSL Type < Electroplated Type = EHWA New BSL Type Conditioner

Difference of manufacturing process between

fixing type Shape of diamond Grade of diamond Chip

Electroplated Type Mechanical contact Irregular Low

17 Difference of manufacturing process between Electroplated type and MSL type contents Diamond fixing type Shape of diamond Grade of diamond Chip Pocket Controllability of diamond exposure Electroplated Type Mechanical contact Irregular Low Do not exist restricted MSL Type Chemical reaction Regular High Exist Easy

18 CERTICICATE

19 Conditioner Certification

DIAMOND DRESSERS INNOVATOR IN TECHNOLOGY

DIAMOND DRESSERS INNOVATOR IN TECHNOLOGY IAMON ESSES INNOATO IN TECHNOOGY INNOATO IN TECHNOOGY EHA IAMON Since 1975, Ehwa iamond has been growing rapidly by developing long-term partnerships with customers worldwide and continues to strive towards