Thin-Film RF/Microwave Inductor Technology. Accu-L

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1 hin-film RF/Microwave Inductor echnology Accu- 31

2 Accu- 001 ight olerance SMD RF hin Film uning Inductor ACCU- ECHNOOGY he 001 SMD uning Inductor is based on thin-film multilayer technology. he technology provides a miniature part with excellent high frequency performance and rugged construction for reliable automatic assembly. APPICAIONS Mobile Communications Satellite V Receivers GPS Vehicle ocation Systems Wireless AN s Filters Matching Networks HOW O ORDER 001 XXX X H S R Inductance (nh) olerance Series ead Free ermination aped & Reeled P/N Example: 0013R3BHSR UAIY INSPECION Finished parts are 100% tested for electrical parameters and visual characteristics. Each production lot is evaluated on a sample basis for: Static Humidity: 85 C, 85% RH, 160 hours Endurance: 15 C, I R, 4 hours ERMINAION Nickel/ead Free solder coating compatible with automatic soldering technologies: reflow, wave soldering, vapor phase and manual. DIMENSIONS: (OP View) millimeters (inches) Recommended Pad ayout Dimensions mm (inches) B1 0.6 W 0.78 (0.031) 0.6 B 0.6 W 0.600±0.050 (0.04±0.00) 0.35±0.050 (0.013±0.00) 0.5±0.050 (0.009±0.00) B1 B 0.100±0.100 (0.004±0.004) 0.150±0.050 (0.006±0.00) 0.34 (0.013) 3

3 Accu- 001 ight olerance SMD RF hin Film uning Inductor EECRICA SPECIFICAIONS 450MHz 900MHz 1900MHz 400MHz SRF RDC IDC olerance min. max. max. (nh) A=±0.05nH, B=±0.1nH, (min) (yp) (yp) (yp) (MHz) ( ) (ma) C=±0.nH, D=±0.5nH 0.33 ±0.05nH, ± 0.1nH, ± 0.nH ±0.05nH, ± 0.1nH, ± 0.nH ±0.05nH, ± 0.1nH, ± 0.nH ±0.05nH, ± 0.1nH, ± 0.nH ±0.05nH, ± 0.1nH, ± 0.nH ±0.05nH, ± 0.1nH, ± 0.nH ±0.05nH, ± 0.1nH, ± 0.nH ±0.05nH, ± 0.1nH, ± 0.nH ± 0.1nH, ± 0.nH, ± 0.5nH ± 0.1nH, ± 0.nH, ± 0.5nH ± 0.1nH, ± 0.nH, ± 0.5nH ± 0.1nH, ± 0.nH, ± 0.5nH ± 0.1nH, ± 0.nH, ± 0.5nH All intermediate Inductance values within the indicated range are available. 33

4 040 ight olerance RF Inductor GENERA DESCRIPION IF ECHNOOGY DIMENSIONS: (Bottom View) millimeters (inches) he 040 GA Inductor is based on thin-film multilayer technology. he technology provides a miniature part with excellent high frequency performance and rugged construction for reliable automatic assembly. B S A APPICAIONS Mobile Communications Satellite V Receivers GPS Vehicle ocation Systems Wireless AN s Filters Matching Networks HOW O ORDER 040 XXX X AND GRID ARRAY ADVANAGES Inherent ow Profile Self Alignment during Reflow Excellent Solderability ow Parasitics Better Heat Dissipation H N R W W 1.00±0.10 (0.039±0.004) 0.58±0.07 (0.03±0.003) 0.35±0.10 (0.014±0.004) A B S, H H 0.48±0.05 (0.019±0.00) 0.17±0.05 (0.007±0.00) 0.064±0.05 (0.003±0.00) Inductance (nh) P/N Example: 0403R3BHNR olerance Series GA ermination Sn100 aped & Reeled EAD-FREE COMPAIBE COMPONEN UAIY INSPECION Finished parts are 100% tested for electrical parameters and visual characteristics. Each production lot is evaluated on a sample basis for: Static Humidity: 85 C, 85% RH, 160 hours Endurance: 15 C, I R, 4 hours ERMINAION Nickel/ead Free solder coating compatible with automatic soldering technologies: reflow, wave soldering, vapor phase and manual. MAKING AND ORIENAION IN APE (op View) Recommended Pad ayout Dimensions mm (inches) 0.7 (0.08) 1.6 (0.063) 0.6 (0.04) 34

5 040 ight olerance RF Inductor EECRICA SPECIFICAIONS 450MHz 900MHz 1900MHz 400MHz SRF RDC IDC olerance min. max. max. (nh) A=±0.05nH, B=±0.1nH, (min) (yp) (yp) (yp) (yp) (MHz) ( ) (ma) C=±0.nH, D=±0.5nH 0.56 ± 0.05nH, ± 0.1nH ± 0.05nH, ± 0.1nH ± 0.05nH, ± 0.1nH ± 0.05nH, ± 0.1nH ± 0.05nH, ± 0.1nH, ± 0.nH ± 0.05nH, ± 0.1nH, ± 0.nH ± 0.05nH, ± 0.1nH, ± 0.nH ± 0.05nH, ± 0.1nH, ± 0.nH ± 0.05nH, ± 0.1nH, ± 0.nH ± 0.1nH, ± 0.nH, ± 0.5nH ± 0.1nH, ± 0.nH, ± 0.5nH ± 0.1nH, ± 0.nH, ± 0.5nH ± 0.1nH, ± 0.nH, ± 0.5nH ± 0.1nH, ± 0.nH, ± 0.5nH Please contact factory for intermediate inductance values within the indicated range. 35

6 Accu- SMD High- RF Inductor 10 nh Inductor (op View) ACCU- ECHNOOGY he Accu- SMD Inductor is based on thin-film mul ti lay er technology. his technology provides a level of control on the elec tri cal and physical characteristics of the com po nent which gives consistent characteristics within a lot and lot-to-lot. he original design provides small size, excellent highfrequency performance and rugged construction for re li able automatic assembly. he Accu- inductor is particularly suited for the tele com - mu ni ca tions industry where there is a continuing trend towards miniaturization and in creas ing frequencies. he Accu- inductor meets both the per for mance and tolerance requirements of present cellular frequencies 450MHz and 900MHz and of future fre quen cies, such as 1700MHz, 1900MHz and 400MHz. FEAURES High RF Power Capability High SRF ow DC Resistance Ultra-ight olerance on Inductance Standard 0603 and 0805 Chip Size ow Profile Rugged Construction aped and Reeled APPICAIONS Mobile Communications Satellite V Receivers GPS Vehicle ocations Systems Filters Matching Networks DIMENSIONS: millimeters (inches) ± ±0.10 (0.063±0.004) (0.083±0.004) 0.81± ±0.10 W (0.03±0.004) (0.059±0.004) 0.61± ±0.13 (0.04±0.004) (0.036±0.005) top: / ±0.15 ( ) (0.010±0.006) B bottom: 0.35±0.0 (0.014±0.008) B W Operating/Storage emp. Range: -55 C to +15 C 36

7 Accu and 0805 SMD High- RF Inductor HOW O ORDER R7 D E S R Product Inductor Not RoHS Compliant EAD-FREE COMPAIBE COMPONEN Size For RoHS compliant products, please select correct termination style. Inductance Expressed in nh ( significant digits + number of zeros) for values <10nH, letter R denotes decimal point. Example: nh = 0 4.7nH = 4R7 olerance for 4.7nH, B = ±0.1nH C = ±0.nH D = ±0.5nH 4.7nH<<10nH, C = ±0.nH D = ±0.5nH 10nH, G = ±% J = ±5% Specification Code E = Accu technology G = Accu technology EECRICA SPECIFICAIONS ABE FOR ACCU ermination Code W = Nickel/ solder coated (Sn 63, Pb 37) **S = Nickel/ ead Free Solder coated (Sn100) Packaging Code R = ape and Reel (3,000/reel) **RoHS compliant Engineering Kits Available see pages MHz 900 MHz 1900 MHz 400 MHz IDC max est Frequency est Frequency est Frequency est Frequency SRF min RDC max (ma) Inductance Available (MHz) (Ω) Inductance olerance ypical ypical ypical ypical (1) 1. ±0.1, ±0.nH ±0.1, ±0.nH ±0.1, ±0.nH ±0.1, ±0.nH ±0.1, ±0.nH ±0.1, ±0., ±0.5nH ±0.1, ±0., ±0.5nH ±0.1, ±0., ±0.5nH ±0., ±0.5nH ±0., ±0.5nH ±0., ±0.5nH ±%, ±5% ±%, ±5% ±%, ±5% (1) I DC measured for 15 C rise at 5 C ambient temperature when soldered to FR-4 board. Inductance and measured on Agilent 491B / 487 using the 16196A test fixture. EECRICA SPECIFICAIONS ABE FOR ACCU MHz 900 MHz 1700 MHz 400 MHz IDC max est Frequency est Frequency est Frequency est Frequency SRF min RDC max (ma) Inductance Available (MHz) (Ω) Δ = 15 C Δ = 70 C Inductance olerance ypical ypical ypical ypical (1) () 1. ±0.1nH, ±0.nH, ±0.5nH ±0.1nH, ±0.nH, ±0.5nH ±0.1nH, ±0.nH, ±0.5nH ±0.1nH, ±0.nH, ±0.5nH ±0.1nH, ±0.nH, ±0.5nH ±0.1nH, ±0.nH, ±0.5nH ±0.1nH, ±0.nH, ±0.5nH ±0.1nH, ±0.nH, ±0.5nH ±0.5nH ±0.5nH ±0.5nH ±%, ±5% ±%, ±5% ±%, ±5% ±%, ±5% ±%, ±5% (1) I DC measured for 15 C rise at 5 C ambient temperature () I DC measured for 70 C rise at 5 C ambient temperature,, SRF measured on HP 491A, Boonton 34A and Wiltron 360 Vector Analyzer, R DC measured on Keithley 580 micro-ohmmeter. 37

8 Accu and 0805 SMD High- RF Inductor 0603 ypical vs. Frequency Frequency (GHz) 1.nH 1.5nH 5.6nH 8.nH 15nH ypical Inductance vs. Frequency nH 8.nH nH 4.7nH 3.3nH.nH 1.8nH 1.nH Frequency (GHz) Measured on AGIEN 491B/487 using the 16196A test fixture Measured on AGIEN 491B/487 using the 16196A test fixture 0805 ypical vs. Frequency 0805 ypical Inductance vs. Frequency nH nH 1.8nH 5.6nH 10nH Inductance (nh) 10 nh 15nH 10nH 5.6nH 15nH 0 nh 1.8nH Frequency (GHz) Measured on HP491A and Boonton 34A Coaxial ine Frequency (GHz) Measured on HP491A and Wiltron 360 Vector Analyzer Maximum emperature Rise at 5 C ambient temperature (on FR-4) nH 10nH 6.8nH 4.7nH.7nH Δ ( C) Current (A) emperature rise will typically be no higher than shown by the graph 38

9 Accu and 0805 SMD High- RF Inductor FINA UAIY INSPECION Finished parts are tested for electrical parameters and visual/ mechanical characteristics. Parts are 100% tested for inductance at 450MHz. Parts are 100% tested for R DC. Each pro duc tion lot is eval u at ed on a sample basis for: at test frequency Static Humidity Resistance: 85 C, 85% RH, 160 hours Endurance: 15 C, I R, 4 hours ENVIRONMENA CHARACERISICS ES CONDIIONS REUIREMEN Solderability Components completely immersed in a solder bath at 35 ± 5 C for secs. erminations to be well tinned. No visible damage. each Resistance Components completely immersed in Dissolution of termination faces a solder bath at 60 ±5 C for 60 secs. 15% of area. Dissolution of termination edges 5% of length. Storage 1 months minimum with components stored in as received packaging. Good solderability Shear Components mounted to a substrate. No visible damage A force of 5N applied normal to the line joining the terminations and in a line parallel to the substrate. Rapid Change of emperature Components mounted to a substrate. 5 cycles -55 C to +15 C. No visible damage ested as shown in diagram Bend Strength No visible damage 1mm deflection 45mm emperature Component placed in +0 to +15 ppm/ C Coefficient of environmental chamber (typical) C = Inductance -55 C to +15 C. (C) 1 = 5 C 1 ( - 1 ) 45mm 39

10 Accu- Application Notes HANDING SMD chips should be handled with care to avoid dam age or contamination from perspiration and skin oils. he use of plastic tipped tweezers or vacuum pick-ups is strongly recommended for individual components. Bulk handling should ensure that abrasion and mechanical shock are minimized. For automatic equipment, taped and reeled product is the ideal medium for direct presentation to the placement machine. CIRCUI BOARD YPE All flexible types of circuit boards may be used (e.g. FR-4, G-10) and also alumina. For other circuit board materials, please consult factory. COMPONEN PAD DESIGN Component pads must be designed to achieve good joints and minimize component movement during sol der ing. Pad designs are given below for both wave and reflow soldering. he basis of these designs is: a. Pad width equal to component width. It is per mis si ble to decrease this to as low as 85% of component width but it is not advisable to go be low this. b. Pad overlap about 0.3mm. c. Pad extension about 0.3mm for reflow. Pad ex ten sion about 0.8mm for wave soldering. REFOW SODERING DIMENSIONS: millimeters (inches) 001 Accu (0.031) (0.013) 040 Accu- 0.6 (0.04) 1.6 (0.063) 0.4 (0.015) 0.6 (0.04) 0.7 (0.08).3 (0.091) 0603 Accu- PREHEA & SODERING he rate of preheat in production should not exceed 4 C/second. It is recommended not to exceed C/sec ond. emperature differential from preheat to soldering should not exceed 150 C. For further specific application or process advice, please consult AVX (0.035) 0.50 (0.00) 0.90 (0.035) 0.8 (0.031).8 (0.110) 0805 Accu- 0.7 (0.08) 1.4 (0.055) 0.7 (0.08) 1.5 (0.059) HAND SODERING & REWORK Hand soldering is permissible. Preheat of the PCB to 100 C is required. he most preferable technique is to use hot air soldering tools. Where a soldering iron is used, a tem per a - ture controlled model not exceeding 30 watts should be used and set to not more than 60 C. Max i mum al lowed time at temperature is 1 minute. When hand sol der ing, the base side (white side) must be sol dered to the board. COOING After soldering, the assembly should preferably be al lowed to cool naturally. In the event of assisted cool ing, similar conditions to those rec om mend ed for pre heat ing should be used. CEANING RECOMMENDAIONS Care should be taken to ensure that the devices are thor - ough ly cleaned of flux residues, especially the space be neath the device. Such residues may otherwise be come conductive and effectively offer a lossy bypass to the de vice. Various recommended cleaning conditions (which must be optimized for the flux system being used) are as follows: Cleaning liquids i-propanol, ethanol, acetylacetone, water, and other standard PCB cleaning liquids. Ultrasonic conditions.. power 0w/liter max. frequency 0kHz to 45kHz. emperature C maximum (if not oth er wise limited by chosen sol vent system). ime minutes max. SORAGE CONDIIONS Recommended storage conditions for Accu- prior to use are as follows: emperature C to 35 C Humidity % Air Pressure mbar to 1060mbar RECOMMENDED SODERING PROFIE For recommended soldering profile see page 9 40

10 nh Inductor (Top View)

10 nh Inductor (Top View) SMD High- RF Inductor nh Inductor (Top View) ACCU- TECHNOOGY The SMD Inductor is based on thin-film mul ti lay er technology. This technology provides a level of control on the elec tri cal and physical