Processing KODAK Color Print Films, Module 10. Effects of Mechanical & Chemical Variations in Processes ECP-2D and ECP- 2E

Transcription

1 Processing KODAK Color Print ilms, Module 1 Effects of Mechanical & Chemical Variations in Processes ECP-2D and ECP- 2E Eastman Kodak Company, 26

2 Table of Contents Effects of Mechanical & Chemical Variations in Process ECP-2D / ECP-2E 1-3 POCESS CONTOL Mechanical Control Chemical Control Photographic and Sensitometric Control Correlation of Mechanical, Chemical, and Sensitometric Data Effects of Mechanical and Chemical Variations Effects of Time and Temperature Variations Effects of ph and CD-2 Variations Effects of Nar and Na 2 CO 3 Variations Effects of Na 2 SO 3 Variations Effects of A-9 and P-2 Prebath Contamination Effects of CD-3 for CD-2 and Stop ath Contamination Effects of Persulfate Accelerator and Hydroxylamine Sulfate Contamination Effects of -35 ixer and NaCl Contamination Effects of KI Contamination and Water Dilution Effects of acterial Na 2 S and Na 2 SO 4 Contamination Effects of Under- and Over-eplenishment DIASTIC SCHEMES Color Print ilm Diagnostic Charts Verification Process Problem Sorting Low Developer Activity High Developer Activity High D-min (reen Only) Sound Track Process Analysis etained Silver (erricyanide or UL leach) etained Silver (Persulfate leach) etained Silver Halide SPECIAL TESTS Verification Tests Solution y-pass Test Process Omitting Prebath Test ixed-out Strip Test Process Omitting irst ixer Test POCESSED ILM POLEMS The information contained herein is furnished by Eastman Kodak Company without any warranty or guarantee whatsoever. While Kodak is unaware of any valid domestic patents of others which would be infringed by the methods, formulas or apparatus described herein, the furnishing of this information is not to be considered as any license for inducement of, or recommendation for any action by any party any such action being a matter for independent investigation and decision by such party. -2 Effects of Mechanical & Chemical Variations in Processes ECP-2D and ECP-2E

3 1 Effects of Mechanical & Chemical Variations in Process ECP-2D and ECP-2E POCESS CONTOL The successful processing of KODAK VISION Color Print ilm / 2383, KODAK VISION Premier Color Print ilm / 2393, and KODAK VISION Color Teleprint ilm / 2395 / 3395 requires a good process control system. The essential phases of such a control system include mechanical, chemical, and photographic control, plus correlation and interpretation of results. The philosophy and a recommended system of process control are given in Module 1, Process Control. The following sections are specific for Processes ECP-2D and ECP-2E. Mechanical Control Mechanical control includes items basic to any chemical reaction, such as temperature, agitation, and time of reaction. The developer temperature should be maintained tightly within specifications. The temperatures of other solutions, while not quite so critical, must nevertheless be carefully controlled. ecirculation and replenishment rates must be regulated to maintain the required chemical activity of the various solutions. Turbulated solutions should be piped through devices that indicate the rates of flow and pressures so that the jet-agitation action of the solution at the film surface can be controlled. A method for calibrating and measuring flow rates is given in Module 2, Equipment and Procedures. The operating speed of the processing machine should be checked frequently. All such factors, whether regulated automatically or manually, constitute the physical or mechanical aspects of control. A checklist for daily operation of a processor is given in Table 1-2, Checklist or Daily Operation. Chemical Control Maintaining the proper composition of the processing solutions is one of the most important elements of control. Maintain the chemical composition of the solutions within the published tolerances to achieve satisfactory process control. Do not compensate for chemical imbalances by altering mechanical parameters. This action is not good process control procedure and is not recommended. Use the Analytical Methods recommended in Module 3, Analytical Procedures, to determine the chemical composition of each processing solution. Some of the methods require the use of a ph meter to accurately measure solution acidity or alkalinity. An automatic titrator or ph meter is required for potentiometric titrations. A spectrophotometer is required to measure constituents in some processing solutions. With these three instruments plus chemical reagents and the assorted glassware (pipets, burets, hydrometers, beakers, etc,) usually found in analytical laboratories, all of the solutions used in the process can be analyzed. Table 1-1, Critical Chemical Analyses shows the method number for each analysis that is performed on each process solution. Only the basic method number is listed in Table 1-1. Since the methods are constantly being improved and reissued with a new suffix, be sure to use the latest version of the basic method. or example, if the current basic method for measuring sulfite in color developer is number 135C, the next revision of the method will be 135D. When the technology or chemistry of the method is changed, a totally new number will be assigned to the new method as was done when the ph method changed from 81 to ULM Table 1-1 Critical Chemical Analyses Solution Analyses Tank Developer ph Specific ravity Total Alkalinity CD-2 romide Sulfite * Process ECP-2D only Alternate leach D, T, T, T, T, T, Analyses eplenisher Method Number ULM ULM-2/1 ECP-1/1 ECP-3/1 ECP-926C ECP-2-135C Stop ph D, ULM irst ixer * ph D, ULM Specific ravity W, ULM-2/1 Hypo Index W, ECP-2/1 Thiosulfate W, ECP-2/1 Sulfite W, ECP-2/1 Accelerator (Persulfate leach) leach Persulfate leach erricyanide Sound Track Developer* Second ixer ph Specific ravity Metabisulfite uffer Capacity PA-1 ph Specific ravity Persulfate Chloride uffer Capacity ph Specific ravity erricyanide romide Hydroquinone Viscosity ph Specific ravity Hypo Index Thiosulfate Sulfite D, W, W, W, W, D, W, W, W, W, D, W, W, W, D, W, W, W, W, D=Daily T=Twice Weekly W=Weekly M=Monthly =Each resh Mix ULM ULM-2/1 ECP-25/1 ECP-2-1 ECP-27-1 ULM ULM-2/1 ECP-26/1 ECP-9/1 ECP-19-1 ULM ULM-2/1 ULM-21/1 ULM-4/1 ECP-2-47 ECP-2-99 ULM ULM-2/1 ECP-2/1 ECP-2/1 ECP-2/1 Effects of Mechanical & Chemical Variations in Processes ECP-2D and ECP-2E 1-3

4 Table 1-2 Checklist or Daily Operation Steps Spec. Mon Tues Wed Thurs ri Sat Sun 1.Was shutdown strip in control? 2.Turn on power, air and water supplies, and the exhaust system. 3.Check solution levels * in machine tanks. 4.Check replenisher supply tanks and make Developer fresh replenishment solutions (if necessary). Stop ixer Accelerator leach Sound Track Developer ixer inal inse. 5.Turn on recirculation pumps. 6.Adjust wash-water flow-meters to proper setting. 7.Turn on and check air supply to squeegees. 8.Turn on temperature controls systems. 9.Turn on replenishers. Use leader rates until film is being processed. 1.Turn on dryer fan motor and heater. 11.Start machine and check machine speed. 12.Check final squeegee for cleanliness and adjustment. Make corrections if necessary. 13.Check leader for twists. 14.Check solution time. Developer 15.Use KODAK Process Thermometer, Type 3. Developer Check solution temperature. Accelerator 16.Check recirculation rate. Developer Stop ixer Accelerator leach ixer inal inse 17.un control strips. 18.Proceed to production if in control. 19.Check replenisher flow rate. Developer Stop Wash Accelerator leach Wash Sound Track Developer Spray inse ixer inal Wash inal inse * Solution levels must be high enough in the weir boxes to prevent air from being drawn into the recirculation systems when recirculator pumps are turned on. Process ECP-2D only. Start-up and every two hours. 1-4 Effects of Mechanical & Chemical Variations in Processes ECP-2D and ECP-2E

5 Analyze all fresh chemical mixes, as the first defense against mixing errors. The tank solutions should be checked on a regular basis to monitor any changes in the chemical composition. The most useful analysis is ph. It is relatively easy to measure and must be done on a daily basis. A drift in developer ph is usually the first warning of a process about to go out of control. When such drifts are observed, it is important to try to find the cause, rather than to blindly adjust the ph and continue processing. In most cases, this will require a complete developer analysis. Table 1-2, Checklist or Daily Operation, indicates a starting point for the frequency of analysis. The schedule of analysis can be customized by a particular installation to keep its process in chemical control. The customized frequency will depend on the amount of film being processed, and the historical stability of the process. Photographic and Sensitometric Control The chemical reactions involved in processing color films are so complex that it is impossible to evaluate and control the process completely on the basis of mechanical and chemical data alone. The end results are photographic and include the characteristics of the sensitized material and the chemicals of the process. Actual picture tests demonstrate how the process behaves photographically. It is possible, although cumbersome, to use such tests for photographic control. Apart from rigorous photographic control, however, viewing printed picture work off a process is important because it is an indication of the overall photographic condition of the process, both sensitometric and physical. The best process control methods furnish quantitative information about the process. Sensitometric control strips provide a rapid, accurate and greatly simplified means of evaluating the process photographically. Introduce strips into the process with regular production footage every one or two hours. Evaluate visually, or more precisely, by densitometric methods. Examine the strips immediately after processing and plot the results on the same charts where the mechanical and chemical data are recorded. This information gives an hour-to-hour check on whether accidents have occurred causing the process to drift away from the process aim. See the Typical Control Chart in Module 1, Process Control, for examples. or your convenience, sensitometrically exposed control strips in 16 and 35 mm are available from Eastman Kodak Company. KODAK VISION Color Print Control Strips, Process ECP-2D are packaged in 3.5 metre (1-foot) rolls containing at least 12 exposures and a processed reference strip. The exposures on the roll are spaced at 24 mm (9.5-inch) intervals. Each exposure has 21 gray-scale steps at log H increments. The reference strip is exposed exactly as the control strips and is subsequently processed under well-controlled conditions. The instruction sheet contains correction factors that are required to establish your process aims. A four-digit code number appears on the carton, can, control strips, reference strip, and instruction sheet, identifying each production batch of strips. The procedures for using control strips are found in Module 1, Process Control. Correlation of Mechanical, Chemical, and Sensitometric Data ecord and interpret all mechanical, chemical, and photographic results, to monitor whether the process is in or out of control. If the process drifts out of control, your control records should indicate what corrective action was taken to reestablish control. As your experience increases with Process ECP-2D / ECP-2E, you will accumulate mechanical, chemical, and sensitometric data under many conditions. This reference will indicate what photographic results to expect when various mechanical and chemical changes occur. Until experience is gained with your process, it is important to know generally what photographic effects to expect as a result of chemical or mechanical variations, and approximately what magnitude of change produces a noticeable photographic effect. This information helps diagnose a photographically off-balance condition. Effects of Mechanical and Chemical Variations Diagnostic Charts The control plots in this section illustrate some of the major photographic effects of mechanical and chemical variations on KODAK VISION Color Print ilm / Each plot shows the effect of a change in a process parameter (horizontal axis), on the dye density of the processed film (vertical axis). The specifications for the various parameters are represented by the letter S along the horizontal axis. A plot at for the red density indicates the parameter change caused the red density to increase by densitometric units (looks cyan) above the process aim. The magnitude of the changes shown in these plots should not be considered to be process control limits. Also, the data presented are qualitative, not quantitative. The plots were derived from experiments using small laboratory machines in which all constituents were held constant except the variable being studied. Hence, the figures should be used only as trend charts and guides. If two or more process parameters are varied, the resulting photographic effect is not predictable because all effects are not additive. Interactions can occur that produce effects other than those predicted by addition. The plots in this publication are representative only; they do not contain all possible solution problems. Most of the important photographic effects take place in the developer. The Color Print ilm Diagnostic Charts are diagnostic schemes for the process and highlight the importance of not only the developer, but also the stop, bleach and fixer. Effects of Mechanical & Chemical Variations in Processes ECP-2D and ECP-2E 1-5

6 Developer Mechanical Variations igure 1-1 Effects of Time and Temperature Variations 2383 ilm in Process ECP-2D / ECP-2E Developer AIM VALUES EEENCE STIP CODE. HD.2 Time Temperature ED EEN LUE /W.2 MD.2 ED EEN LUE /W LD ED EEN LUE /W D-Min.2 ED EEN LUE /W HD-MD ED EEN LUE /W _17EC sec 1-6 Effects of Mechanical & Chemical Variations in Processes ECP-2D and ECP-2E

7 Developer Chemical Variations igure 1-2 Effects of ph and CD-2 Variations 2383 ilm in Process ECP-2D / ECP-2E Developer AIM VALUES EEENCE STIP CODE. HD ED EEN.2 ph CD-2 LUE /W.2.2 MD ED EEN LUE /W LD.2 ED EEN LUE /W D-Min ED EEN LUE /W HD-MD ED EEN LUE /W _171EC ph g/l Effects of Mechanical & Chemical Variations in Processes ECP-2D and ECP-2E 1-7

8 Developer Chemical Variations igure 1-3 Effects of Nar and Na 2 CO 3 Variations 2383 ilm in Process ECP-2D / ECP-2E Developer AIM VALUES EEENCE STIP CODE. HD.2 Nar Na 2 CO3 ED EEN LUE /W.2.2 MD ED EEN LUE /W LD ED EEN LUE /W D-Min.2 ED EEN LUE /W HD-MD ED EEN LUE /W _172EC g/l g/l 1-8 Effects of Mechanical & Chemical Variations in Processes ECP-2D and ECP-2E

9 Developer Chemical Variations igure 1-4 Effects of Na 2 SO 3 Variations 2383 ilm in Process ECP-2D / ECP-2E Developer AIM VALUES EEENCE STIP CODE. HD.2 Na 2 SO3 ED EEN LUE /W.2.2 MD ED EEN LUE /W LD.2 ED EEN LUE /W D-Min ED EEN LUE /W HD-MD ED EEN LUE /W _173EC g/l Effects of Mechanical & Chemical Variations in Processes ECP-2D and ECP-2E 1-9

10 Developer Chemical Variations igure 1-5 Effects of A-9 and P-2 Prebath Contamination 2383 ilm in Process ECP-2D / ECP-2E Developer AIM VALUES EEENCE STIP CODE. HD.2 A-9 P-2 Prebath ED EEN LUE /W.2.2 MD ED EEN LUE /W LD.2 ED EEN LUE /W D-Min ED EEN LUE /W HD-MD ED EEN LUE /W _174EC g/l g/l 1-1 Effects of Mechanical & Chemical Variations in Processes ECP-2D and ECP-2E

11 Developer Chemical Variations igure 1-6 Effects of CD-3 for CD-2 and Stop ath Contamination 2383 ilm in Process ECP-2D / ECP-2E Developer AIM VALUES EEENCE STIP CODE. HD ED EEN LUE /W.2 Substitute CD-3 for CD-2 Stop ath.2.2 MD ED EEN LUE /W LD.2 ED EEN LUE /W D-Min ED EEN LUE /W HD-MD ED EEN LUE /W 2_175EC % CD ml/l 1. Effects of Mechanical & Chemical Variations in Processes ECP-2D and ECP-2E 1-11

12 Developer Chemical Variations igure 1-7 Effects of Persulfate Accelerator and Hydroxylamine Sulfate Contamination 2383 ilm in Process ECP-2D / ECP-2E Developer AIM VALUES EEENCE STIP CODE. HD.2 Persulfate Accelerator Hydroxylamine Sulfate ED EEN LUE /W.2.2 MD ED EEN LUE /W LD.2 ED EEN LUE /W D-Min ED EEN LUE /W HD-MD ED EEN LUE /W _176EC ml/l g/l 1-12 Effects of Mechanical & Chemical Variations in Processes ECP-2D and ECP-2E

13 Developer Chemical Variations igure 1-8 Effects of -35 ixer and NaCl Contamination 2383 ilm in Process ECP-2D / ECP-2E Developer AIM VALUES EEENCE STIP CODE. HD.2-35 ixer NaCl ED EEN LUE /W.2 MD.2 ED EEN LUE /W LD ED EEN LUE /W D-Min.2 ED EEN LUE /W HD-MD ED EEN LUE /W ml/l g/l Effects of Mechanical & Chemical Variations in Processes ECP-2D and ECP-2E 1-13

14 Developer Chemical Variations igure 1-9 Effects of KI Contamination and Water Dilution 2383 ilm in Process ECP-2D / ECP-2E Developer AIM VALUES EEENCE STIP CODE. HD.2 Kl Water Dilution ED EEN LUE /W.2 MD ED EEN LUE /W.2 LD ED EEN LUE /W D-Min.2 ED EEN LUE /W HD-MD ED EEN LUE /W _178EC mg/l ml/l 1-14 Effects of Mechanical & Chemical Variations in Processes ECP-2D and ECP-2E

15 Developer Chemical Variations igure 1-1 Effects of acterial Na 2 S and Na 2 SO 4 Contamination 2383 ilm in Process ECP-2D / ECP-2E Developer AIM VALUES EEENCE STIP CODE. HD ED EEN.2 Na 2 S Na 2 SO4 LUE /W.2 MD ED EEN LUE /W.2 LD ED EEN LUE /W D-Min ED EEN LUE /W HD-MD.2 ED EEN LUE /W _179EC g/l g/l Effects of Mechanical & Chemical Variations in Processes ECP-2D and ECP-2E 1-15

16 Developer Chemical Variations igure 1-11 Effects of Under- and Over-eplenishment 2383 ilm in Process ECP-2D / ECP-2E Developer AIM VALUES EEENCE STIP CODE. HD ED EEN LUE /W Under and Over eplenishment MD ED EEN LUE /W LD.2 ED EEN LUE /W D-Min ED EEN LUE /W HD-MD ED EEN LUE /W 2_18EC No epl. = -18% Stand. epl. 2X epl. = 18% 1-16 Effects of Mechanical & Chemical Variations in Processes ECP-2D and ECP-2E

17 DIASTIC SCHEMES Color Print ilm Diagnostic Charts The flow chart procedures illustrated in this section will aid in determining the source of an out-of-control process. There are nine major schemes: Verification Process, igure 1-12 Problem Sorting, igure 1-13 Low Developer Activity, igure 1-14 High Developer Activity, igure 1-15 High D-min (reen Only), igure 1-16 Sound Track Process Analysis, igure 1-17 etained Silver (erricyanide or UL leach), igure 1-18 etained Silver (Persulfate leach), igure 1-19 etained Silver Halide, igure 1-2 ollowing igure 1-2 there are instructions on how to run the three special tests mentioned at various places in the Diagnostic Charts. Effects of Mechanical & Chemical Variations in Processes ECP-2D and ECP-2E 1-17

18 igure 1-12 Verification Process Check for fog, fingerprint, cinch mark, scratch, etc. Control Strip Damage Light leak Storage Confirm; un crossover test with another batch of control strips Control Strips Show Apparent Process Problem Do Pictures Agree with Process Control Strips? eread previously processed control strip. Process Another Control Strip Do Densitometered eadings Continue to Show Deviation? Does Deviation Continue to Show? Process Another Densitometer Control Strip Problem Verify Densitometric eadings "efore" and "After" Does Deviation Continue to Show? Calibration error Wrong status filters Plotting error Dirty ilters Densitometer malfunction Variable Control Strips Process Problem Verified Exposure variability Storage Confirm; Process 2 strips at the same time to check for consistency o to appropriate Process Troubleshooting Diagram Continue to process control strips until a decision can be made 2_91EC 1-18 Effects of Mechanical & Chemical Variations in Processes ECP-2D and ECP-2E

19 igure 1-13 Problem Sorting Process Problem Verified Determine Sensitometric Deviation from Process Control Aim Higher Densities Lower Densities High D-min (reen Only) Is it etained Silver Halide? Check Strip for Opaque Streaks/efix Strip to Verify Problem See the etained Silver Halide Test. Is it etained Silver? Check I Density and/or ebleach Strip to Verify Problem See the etained Silver Test. etained Silver Halide etained Silver Developer High Activity Developer High D-min Low Activity (reen Only) See ig. 1-2 See ig See ig See ig Persulfate See ig erricyanide & UL See ig _918EC Effects of Mechanical & Chemical Variations in Processes ECP-2D and ECP-2E 1-19

20 igure 1-14 Low Developer Activity Temperature Control Malfunctioning or Set Too Low Time Too Short Check and Adjust Parameter if Necessary Are the Chemical Analyses of Developer Tank Off Specs? Are the Developer Physical Measurements Off Specs? Are the Chemical Analyses of Developer eplenisher Off Specs? Low Agitation Developer Contamination eplenisher Mix Error eplenisher ate Too Low Check ars/nozzles for Plugging; Check ecirculation Compare with resh Developer; un y-pass Test Check Mixing Procedure Check and Adjust epl. ate if Necessary Eliminate Source of Contamination (incl. recirculation & replenisher lines) Adjust eplenisher Mix Mix resh Solution Large Volume of ilm Stock (low probability) Check Exposure Level on ilm Stock Increase epl. ate 2_911EC 1-2 Effects of Mechanical & Chemical Variations in Processes ECP-2D and ECP-2E

21 igure 1-15 High Developer Activity Are the Chemical Analyses of Developer Tank Off Specs.? Also see igs. 1-15, 1-16 and 1-17 Are the Developer Physical Measurements Off Specs? Are the Chemical Analyses of Developer eplenisher Off Specs? Temperature Control Malfunctioning or Set Too High High Stop ath ph Developer Contamination epl. Mix Error epl. ate Too High Dilution from Excessive Carry-in Check ph Compare with good Developer: run by-pass test mix fresh dev. Check Mixing Procedure Check & Adjust epl. ate Check & Adjust em-jet Wash uffer/squeegee if necessary Time too long Eliminate Source of Contamination (incl. recirculation & repl. lines) Adjust epl. Solution Check & Adjust Parameter if necessary Adjust Stop epl. Conc. & epl. ate to Maintain Stable Tank Chemistry; Check Operation of Crossover Squeegee Mix a resh Solution Aeration/ Oxidation of Solution (low sulfite only) Check for Air leaks/foaming Eliminate Source of Oxidation Low Exposure Level on Print Stock (low probability) Check Exposure Level on Print Stock Decrease epl. ate 2_919EC Effects of Mechanical & Chemical Variations in Processes ECP-2D and ECP-2E 1-21

22 igure 1-16 High D-min (reen Only) High D-min (reen Only) Is it Development-elated or Secondary Solution ated? Development-elated un ixed-out Strip Test Secondary Solution-elated Prebath or Developer Contamination? Which Secondary Solution? un Process Omitting Prebath Test reen D-min disappears un Process Omitting 1st ixer Test Prebath Contamination Developer Contamination This Symptom can be the esult of Any One or Multiple Combination of the ollowing Causes: iological rowth Other Viscose ayon Other ilters Used Inadequate Stop Wash High Stop ph High CD-2 in ix (>g/l) High ix ph (>5.8) Compare with ood Prebath: un y-pass Mix resh Prebath or Developer Time too short/ ate too low epl. ph too High/ epl. rate too low High CD-2 in stop Inadequate Stop Wash Low ix epl. ate In-Line Silver ecovery unit malfuctioning/ ix epl. ph and/or ate Too High Eliminate Source of Contamination Improve Stop Wash Adjust ph/ate Improve Stop epl. ate Improve Stop Wash Increase ix epl. ate Adjust ecovery Unit/ix epl. Mix a resh Tank Solution Mix a resh Tank Solution reen D-min persists eview Data epeat Tests High erri leach ph epl. ph/ ate too high Adjust epl. uffering Agent Added to erri leach Possible Soln. Contam. following first fix Omit uffering Agent 2_921EC 1-22 Effects of Mechanical & Chemical Variations in Processes ECP-2D and ECP-2E

23 igure 1-17 Sound Track Process Analysis Contamination See chart on Low Developer Activity Mix Error in Sound Developer See ig Process Problem Verified Determine Sensitometric Deviation from Process Control Aim Lower I Densities Is there low activity in the Picture Process? Check Mixing Procedure leach Contamination of irst ixer Sound Developer Contamination Compare with resh irst ixer Compare with resh Developer Make resh Mix High D-min (reen Only) Is there High D-min (green only) in the Picture Process? Is it Developement elated? Sound Dev. Too Old/Excessive Oxidation of Solution See chart on High D-min (reen only) See ig _923EC Higher I Densities Is there high activity in the Picture Process? Incomplete ixing in irst ixer See chart on High Developer Activity See ig etained Silver Halide See ig. 1-2 Effects of Mechanical & Chemical Variations in Processes ECP-2D and ECP-2E 1-23

24 igure 1-18 etained Silver (erricyanide or UL leach) Low Agitation Check ars/nozzles for Plugging; Check ecirculation etained Silver Are the Chemical Analyses of leach Off Specs? Are the leach Physical Measurements Off Specs? Are the Chemical Analyses of leach eplenisher Off Specs? Temp. Control Malfunctioning or Set Too Low Time too Short leach Contamination Mix/ egeneration Error Sulfate uildup Too High in erricyanide leach (regeneration) epl. ate Too Low un y-pass Test Check Mixing/ egeneration Procedure Check Specific ravity Check epl. & Adjust ate if Necessary Check & Adjust Parameter if Necessary Eliminate Source of Contamination (incl. repl. & recirculation) Adjust eplenisher Mix Discard a Small Portion of epl. & Adjust Chemical Levels Mix a resh Solution 2_991EC 1-24 Effects of Mechanical & Chemical Variations in Processes ECP-2D and ECP-2E

25 igure 1-19 etained Silver (Persulfate leach) Mix econstitution Error Old Accel Mix and/or Tank Check Mixing Instructions Keep mixing and storage records Mix a resh Solution etained Silver ixer Contam. of Accel. Check 1st ixer and 1st ixer Wash Squeegees 2_922EC Are the Chemical Analyses of Accelerator Tank and epl. Off Specifications? Excessive Aeration of Accel. Low eplenishment ate leach or Accel. Sulfate uildup in leach Are the leach Tank's Physical Measurements off Specifications? Are the Accelerator Tank's Physical Measurements off Specifications? econstitution Check for air leaks and excessive Accel. Accel. agitation Check & Adjust if necessary Check Sp r Temp. too low Time too short leach Contam. Temp. too high Time too short Accel. Contam. (Hypo) Discard part of replenisher; Adjust solution Check & Adjust parameter if necessary Check & Adjust parameter if necessary un y-pass Test Eliminate Source of Contam. Confirmed, Mix a resh Tank Solution Effects of Mechanical & Chemical Variations in Processes ECP-2D and ECP-2E 1-25

26 igure 1-2 etained Silver Halide Low Agitation Check ars/ Nozzles for Plugging Check ecirculation etained Silver Halide Are the Chemical Analyses of ixer Tank Off Specifications? Are the ixer Physical Measurements Off Specs? Are the Chemical Analyses of ixer eplenisher Off Specs? Temp. Control Malfunctioning or Set Too Low Time Too Short Persulfate leach Accelerator PA-1 Level Too High Time Too Long in leach Accel. ixer Contam. Mix/ econstitution Error Sulfate uildup Too High (excessive aeration) epl. ate Too Low Check and Adjust Parameter if Necessary un y-pass Test Check Mixing/ econstitution Procedure Check Specific ravity Check epl. ate Eliminate Source of Contam. Eliminate Air Leaks in ecirculation System Increase epl. ate Mix a resh Solution Silver ecovery Unit Malfunctioning Check Unit Correct Malfunction 2_916EC 1-26 Effects of Mechanical & Chemical Variations in Processes ECP-2D and ECP-2E

27 SPECIAL TESTS In support of the diagnostic procedures, the following five special tests are required: Verification Tests Solution y-pass Test Process Omitting Prebath Test ixed-out Strip Test Process Omitting irst ixer Test Verification Tests There are two verification tests for suspected problems retained silver and retained silver halide. etained Silver etained silver is the result of ineffective bleaching. The symptoms are: Increased density in the high-density areas of the film, particularly D-max, with no changes in lower densities (such as D-min). It may be seen as increased contrast. The infrared density of the D-max patch increases. Normally, an infrared density (at 1, nm) of less than.7 is acceptable, between.7 and.14 is marginal, and greater than.14 is unacceptable. A sound track densitometer is a suitable instrument for this measurement. Verification Test: 1. Prepare a small volume of fresh ferricyanide bleach, or use a known good solution of ferricyanide bleach replenisher. 2. Immerse the processed film with suspected silver retention in the bleach for 1 to 2 minutes. Agitate by moving the film strip manually. Wash the film for 3 to 4 seconds under running water. 3. ix the strip for 1-2 minutes in a small volume of a good fixer solution, again agitating manually. Wash the film for 3 to 4 seconds. 4. Dry the film and reread the infrared density. An infrared density within the acceptable region (which had formerly been marginal or unacceptable) confirms silver retention. Lower optical densities also confirm retained silver. etained Silver Halide etained silver halide is the result of ineffective fixing. The symptoms are: There are large increases in density (i.e., greater than,, and ) in both the D-min and D-max steps of the control strip. The overall contrast is only slightly increased. The infrared density of the D-max patch is normal. Normally, an infrared density (at 1, nm) of less than.7 is acceptable, between.7 and.14 is marginal, and greater than.14 is unacceptable. A sound track densitometer is a suitable instrument for this measurement. Opaque streaks are generally visible when the strip is viewed with reflected light. Verification Test: 1. e-fix the processed control strip for 1 to 2 minutes in a small volume of a fresh fixer replenisher solution or known good fixer replenisher. Agitate by moving the film manually. Wash the film for 3 to 4 seconds under running water. 2. Dry the film and reread the densities. If the D-min and D-max readings are down to normal control levels after refixing and/or the opaque streaks disappear, the problem can be attributed to retained silver halide. Effects of Mechanical & Chemical Variations in Processes ECP-2D and ECP-2E 1-27

28 Solution y-pass Test Use this test to check out any processing solution when it is suspected of causing a photographic deviation. It is particularly useful in avoiding unnecessary dumping of a suspected processing solution. Although the test is often used with secondary solutions, it can also be used to check out prebath and developer problems if an adequate sinkline process (i.e., with a controlled temperature bath) is available. 1. Obtain a sample of the suspected solution. 2. Mix a fresh sample of the solution in question or use a known good solution of the same type, i.e., from another processing machine. 3. In a sink-line process, run one set of control strips through the suspected solution, and the other set through the known good solution. Use normal processing times and temperatures. If possible, process both sets together at the same time. Use the same solutions for both sets of strips for all other processing steps. Note: or secondary solutions, strips can often be processed in the machine up to the point in question. After cutting out the strip at the crossover, proceed as described above in a sink-line process. The strips may be spliced onto machine leader at the exit of the suspected solution and processed together for the remaining steps. 4. Compare the photographic results from the suspected solution and the known good solution. If the set of strips processed in the suspected solution deviates in the same direction as the actual photographic deviation, the suspected solution is causing the photographic effect. If the results between the two solutions are similar, repeat the test to check the other processing solutions, one at a time. Note: Since sink-line tests may not give exactly the same results as machine runs, it is important to look at the difference between the sets of strips, even if they do not exactly match normal control strips. ixed-out Strip Test Use this test to help distinguish development-related sources of high green D-mins from those caused by secondary solutions. 1. ix out a strip of KODAK Color Print ilm for 1 to 2 minutes in a fresh fixer or replenisher solution. Wash and dry. 2. Process the above fixed-out strip along with a strip of unexposed print film (D-min). 3. Measure the red, green, and blue (D-min) densities of both strips and compare the readings. 4. esults/action: a. If high green D-mins disappear in the fixed-out strip, the stain is development related. b. If high green D-mins persist, a secondary solution problem is implicated. Process Omitting irst ixer Test (ECP-2D only) Use this test to help isolate the source of high green D-mins caused by secondary solutions. 1. Process a strip of KODAK Color Print ilm omitting the first fixer. This can be done right on the film processor by skipping the first fixer racks. 2. ead the red, green, and blue densities of this strip and compare the results with the D-min of a normally processed strip of print film. 3. esults/action: a. If high green D-mins disappear in the print film strip when omitting the first fixer, the first fixer is most likely the solution causing the stain. Proceed with checking fixer ph levels and CD-2 contamination. Also, check ferricyanide bleach ph and/or any buffering agents that may have been added (a nonstandard addition). Note: High green D-mins can also disappear in this test if the stop or stop wash is inadequate. b. If high green D-mins persist, check for a contaminated solution after the first fix Effects of Mechanical & Chemical Variations in Processes ECP-2D and ECP-2E

29 POCESSED ILM POLEMS Problem Appearance Possible Source of Problem Suggestion Corrective Action lack lines and comets Dirt particles Dots equally spaced apart, repeating Short, black lines and comets on emulsion surface. Shiny in reflected light. Dark spots and marks. Easiest to see under high-intensity specular lighting. Yellow particles on surface. Showers of dots on emulsion. Emulsion skivings Small particles of emulsion sheared from the film edges and deposited on the film surface. errotyping ungus or algae deposits Magenta fingerprints Newton s rings Irregular, shiny areas on the emulsion surface. Light irregular smears, streaks, and spots. Under certain conditions, the electrolytic silver cell in the fixer recirculation systems produces small, flocculent silver flakes. These flakes get into the fixer tank, attach to the emulsion, and then go through the fixer squeegee, where each one is smeared into a line or comet. Dirt may consist of dust, cloth filaments, hair, skin flakes, chemical crystals, scum, etc. Such dirt can come from machine operators, air-conditioning units, incorrect construction materials, lack of solution or dryer air filters, water hardness, poor housekeeping, etc. Low fixer ph causes the formation of sulfur particles in the fixer. Soft touch tire pressing on the emulsion during processing. Spools improperly aligned, or with burrs. Wet or tacky emulsion at windup. High windup tension on unprocessed films. Unwinding and rewinding unprocessed cold film without allowing it to reach room temperature. ungi and algae tend to form on the inside walls of the wash tanks. Their presence is indicated by a slippery and slimy feel to the tank walls. Touching the emulsion surface prior to processing. Use a 1- to 15-micron filter in the fixer return line from the cell, or correct operation of the cell. Establish and follow good laboratory cleanliness procedures. or more information on laboratory cleanliness, refer to Module 2, Equipment and Procedures. Maintain the fixer ph within specifications. e certain the emulsion does not ride on spools with soft-touch tires. Check the machine spools. Adjust the dryer to provide adequate film drying. educe the windup tension. Always allow adequate time for film to come to room temperature before using. A 5 1/4 percent solution of sodium hypochlorite, available as household liquid bleach (e.g., Clorox), can be used to clean the tank in order to control the formation of fungi and algae. See Control of iological rowths in Module 2. The film should be handled with lint-free nylon or Dacron gloves. uzzy, erratic, faintly High or uneven printer gate pressure. Adjust printer. colored lines. Low relative humidity in printing room. aise relative humidity to 6 percent. Preprint film was dried too fast or overdried. Adjust drying conditions of preprint film. Cyan stain Contamination of Developer by hypo or A-1. Discard developer. Pink stain Magenta color balance in low density areas. High level of CD-2 in stop or first fixer (ECP-2D only). See igure 1-16, High D-min (reen Only). eticulation Scalloped or fluted edges ough emulsion surface. High solution temperatures. Dryer temperature too high or relative humidity too low. Excessive tension on the film strand. Adjust to specifications. Adjust to specifications. Check the processing machine for excessive tension in the film loops caused by a high rack or improper machine drive. Check for improper threading. ectify either condition. Effects of Mechanical & Chemical Variations in Processes ECP-2D and ECP-2E 1-29

30 Problem Appearance Possible Source of Problem Suggestion Corrective Action Scratches Shoreline Static marks Light lines parallel to the film edges. Deposits on rem-jet buffer. Old, hard, worn, crystal-laden, or maladjusted wiperblade squeegees. Cinching a roll of film before or after processing. Improper loading of processing machine. Machine spools that are not rotating freely or are out of line. Chemical crystals or other foreign material on spools. Improper machine threading (a twist in the film) or improper splices. uzzy contour lines Nonuniform drying of the film emulsion. near the edges of the film. Magenta and/or apid rewinding or transporting film in low relative yellow spots and dots. humidity. Emulsion contact with flat electrophoretic rollers before processing. Install a buffer-cleaning nozzle, and replace the buffer roller regularly. Water from the cleaning nozzle must not run onto unsprayed rem jet. KODAK Anti-Calcium, No. 4, or equivalent, in the prebath prevents the precipitation of calcium or magnesium salts. Use spring-loaded wiper blade squeegees of 4-durometer hardness or less. Keep them clean, and replace them when worn. e certain that the machine take-up does not jerk the film roll. Train film handlers in proper film rewinding techniques. Always handle film with care. Examine equipment for sharp edges, burrs, etc, and eliminate them. Check spools regularly, and replace bearings when necessary. Spools and racks should be cleaned regularly according to the procedures in the machine maintenance section of this manual. These problems should be corrected according to normal processing procedures. educe the temperature, or increase the relative humidity of the air in the drying cabinet. Unprocessed film should not be rewound at high speed. The relative humidity in the rewinding area should be 5 percent or greater. Only undercut rollers should come in contact with the emulsion surface. Use conductive materials on the rewind, load accumulator, etc, and ground them. Tacky film Inadequate final film squeegee action. Check the air flow, alignment and cleanliness of the final squeegee. Inadequate drying conditions. Check the temperature, relative humidity, and flow rate of the air in the dryer cabinet. The heaters or the fan may not be functioning properly, or the air filters may be plugged with dirt. If the dryer uses recirculated air, be sure it is mixed properly with incoming air. Also check the humidity control of recirculated air. If the film is still tacky after all possible normal corrective measures have been taken, as a temporary measure, increase the temperature of the dryer air. ecause increased air temperature can be injurious to the film, such action requires close attention to the physical appearance of the film. Water spots Irregular areas on emulsion surface best seen in specular reflected light. Lines, drops, or puddles of water allowed to enter the dryer on the film. The final squeegee in the process must be very efficient and must remove virtually all water from the emulsion surface. 1-3 Effects of Mechanical & Chemical Variations in Processes ECP-2D and ECP-2E

31 Problem Appearance Possible Source of Problem Suggestion Corrective Action ingering (ECP- 2D only) The edge of the sound track looks like tiny fingers reaching into the picture area High surfactant level. Low thickener level. Application too heavy. ilm insufficiently dry. ends or turns in the development path. Check viscosity of sound track developer, if low, replace. Increase distance between applicator wheel and film. Set-up or adjust pretreatment sqeegees and hot air treatments. or higher transport speeds less tolerance exists for film movement in the Z axis direction. Effects of Mechanical & Chemical Variations in Processes ECP-2D and ECP-2E 1-31

32 Processing KODAK Color Print ilms, Module 1 Effects of Mechanical & Chemical Variations in Processes ECP-2D and ECP-2E MOE IMATION or more information on motion picture products, call or write to the Entertainment Imaging office nearest you. Or access Kodak s home page on the Internet, web site address Click on either Photography or Customer Solutions, then choose the Entertainment Imaging area. You may want to bookmark our location so you can find us more easily. Entertainment Imaging Processing KODAK Color Print ilms, Module 1, Effects of Mechanical & Chemical Variations in Processes ECP-2D and ECP-2E Kodak, Vision, 2383, 2393, 2395, and 3395 are trademarks. Minor evision 7/6 Printed in U.S.A.