Glass Passivated Single-Phase Bridge Rectifier

Transcription

1 ,,, Glass Passivated Single-Phase Bridge Rectifier GBPC-W GBPC FEATURES UL recognition file number E5424 Universal 3-way terminals: snap-on, wire wrap-around, or PCB mounting Typical R less than.3 μa High surge current capability Low thermal resistance Solder dip 275 C max. s, per JESD 22-B6 Material categorization: For definitions of compliance please see PRMARY CHARACTERSTCS Package GBPC, GBPC-W F(AV) 2 A, 5 A, 25 A, 35 A V RRM 5 V to V FSM A, 3 A, 3 A, 4 A R 5 μa V F at F. V T J max. 5 C Diode variations Quad TYPCAL APPLCATONS General purpose use in AC/DC bridge full wave rectification for power supply, home appliances, office equipment, industrial automation applications. MECHANCAL DATA Case: GBPC, GBPC-W Molding compound meets UL 94 V- flammability rating Base P/N-E4 - RoHS-compliant, commercial grade Terminals: Nickel plated on faston lugs or silver plated on wire leads, solderable per J-STD-2 and JESD22-B2. Suffix letter W added to indicate wire leads (e.g. 5W). Polarity: As marked, positive lead by belevled corner Mounting Torque: inches-lbs. max. MAXMUM RATNGS (T A = 25 C unless otherwise noted), 5, 25, UNT Maximum repetitive peak reverse voltage V RRM V Maximum RMS voltage V RMS V Maximum DC blocking voltage V DC V 2 Maximum average forward rectified 5 output current (Fig. ) F (AV) 25 A 35 Peak forward surge current single 3 sine-wave superimposed on rated load FSM 3 A 4 6 Rating (non-repetitive, for t greater than 375 ms and less than 8.3 ms) for fusing t 375 A 2 s 66 RMS isolation voltage from case to leads V SO 25 V Operating junction storage temperature range T J, T STG - 55 to + 5 C Revision: 2-Feb-4 Document Number: 8862 ARE SUBJECT TO SPECFC DSCLAMERS, SET FORTH AT

2 ,,, ELECTRCAL CHARACTERSTCS (T A = 25 C unless otherwise noted) Maximum instantaneous forward drop per diode TEST CONDTONS F = 6. A F = 7.5 A F = 2.5 A F = 7.5 A, 5, 25, V F. V Maximum reverse DC current at rated T A = 25 C 5. DC blocking voltage per diode R μa T A = 25 C 5 Typical junction capacitance per diode 4 V, MHz C J 3 pf UNT THERMAL CHARACTERSTCS (T A = 25 C unless otherwise noted), 5, 25, to.9 Typical thermal resistance R () JC.4 UNT C/W Notes () With heatsink (2) Bolt down on heatsink with silicone thermal compound between bridge and mounting surface for maximum heat transfer with # screw ORDERNG NFORMATON (Example) PREFERRED P/N UNT WEGHT (g) PREFERRED PACKAGE CODE BASE QUANTTY DELVERY MODE 6-E4/ Paper box 6-E4/ Paper box 6-E4/ Paper box 6-E4/ Paper box 6W-E4/ Paper box 6W-E4/ Paper box 6W-E4/ Paper box 6W-E4/ Paper box Revision: 2-Feb-4 2 Document Number: 8862 ARE SUBJECT TO SPECFC DSCLAMERS, SET FORTH AT

3 Average Forward Current (A) Average Forward Current (A) RATNGS AND CHARACTERSTCS CURVES (T A = 25 C unless otherwise noted) Hz nductive Load Bridges Mounted on 9.5 x 3.5 x 4.6" (22.9 x 8.9 x.7 cm) 5 x 6 x 4.9" 5 x 4 x 3" 6 x 2.2 x 2.2" Case Temperature ( C) Peak Forward Surge Current (A). Cycle T J = T J Max..5 ms Single Sine-Wave Number of Cycles at 6 Hz Fig. - Maximum Output Rectified Current Fig. 4 - Maximum Non-Repetitive Peak Forward Surge Current Per Diode R thsa =.5 C/W R thsa =.5 C/W R thsa =. C/W R thsa =. C/W 6 Hz nductive Load nstantaneous Forward Current (A) T A = C T A = 25 C T A = 5 C T A = 25 C Ambient Temperature ( C) nstantaneous Forward Voltage (V) Fig. 2 - Maximum Output Rectified Current Fig. 5 - Typical nstantaneous Forward Characteristics Per Diode Average Power Dissipation of Bridge (W) Capacitive Load T J = T J Max. nductive Load 3 4 Average Output Current (A) Fig. 3 - Maximum Power Dissipation nstantaneous Reverse Leakage Current (µa) T A = 5 C T A = 25 C T A = C T A = 25 C Percent of Rated Peak Reverse Voltage (%) Fig. 6 - Typical Reverse Leakage Characteristics Per Diode Revision: 2-Feb-4 3 Document Number: 8862 ARE SUBJECT TO SPECFC DSCLAMERS, SET FORTH AT

4 Junction Capacitance (pf) Transient Thermal mpedance ( C/W) T J = 25 C f =. MHz V sig = 5 mvp-p T J = 25 C f =. MHz V sig = 5 mvp-p Reverse Voltage (V).. t - Heating Time (s) Fig. 7 - Typical Junction Capacitance Per Diode Fig. 8 - Typical Transient Thermal mpedance Per Diode PACKAGE OUTLNE DMENSONS in inches (millimeters) GBPC-W GBPC Hole for # Screw.5 (28.3).2 (5.59). (5.8) DA..732 (8.6).24 (6.).692 (7.6).8 (4.6) Hole for # Screw.2 (5.59). (5.8) DA..5 (28.3).672 (7.).632 (6.) AC.5 (28.3).732 (8.6).692 (7.6).672 (7.).632 (6.).5 (28.3).582 (4.8).542 (3.8).24 (6.).8 (4.6).42 (.7).38 (.97) DA..3 (7.87).29 (7.36).47 (.9).43 (.9).5 (2.7).44 (.7).25 (3.8) MN..34 (.86).3 (.76).94 (2.4) DA..34 (.86).3 (.76).3 (7.87).29 (7.36).732 (8.6).692 (7.6).25 (6.35).84 (2.3).74 (8.8) Revision: 2-Feb-4 4 Document Number: 8862 ARE SUBJECT TO SPECFC DSCLAMERS, SET FORTH AT

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