NXL0840 SCR logic level Rev February 2008 Product data sheet Product profile 1.1 General description 1.2 Features 1.
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1 Rev. 6 February 8 Product data sheet. Product profile. General description Passivated sensitive gate Silicon-Controlled Rectifier (SCR) in a SOT54 plastic package. Features Direct interfacing to logic level ICs Direct interfacing to low-power gate drive circuits For operation on DC and rectified AC supplies.3 Applications Christmas lights control Protection and safety shutdown circuits e.g. lighting ballasts.4 Quick reference data V DRM 4 V I TSM 8A (t=ms) I T(RMS).8 A I T(AV).5 A. Pinning information Table. Pinning Pin Description Simplified outline Graphic symbol anode (A) gate (G) A K 3 cathode (K) G sym37 3 SOT54 (TO-9)
2 3. Ordering information Table. Ordering information Type number Package Name Description Version TO-9 plastic single-ended leaded (through hole) package; 3 leads SOT54 4. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 634). Symbol Parameter Conditions Min Max Unit V DRM repetitive peak off-state voltage - 4 V I T(AV) average on-state current half sine wave; T lead 83 C; -.5 A see Figure I T(RMS) RMS on-state current all conduction angles; -.8 A see Figure 4 and 5 I TSM non-repetitive peak on-state current half sine wave; T j =5 C prior to surge; see Figure and 3 t = ms - 8 A t = 8.3 ms - 9 A I t I t for fusing t p = ms -.3 A s di T /dt rate of rise of on-state current I TM = A; I G = ma; - 5 A/µs di G /dt = ma/µs I GM peak gate current - A V GM peak gate voltage - 5 V V RGM peak reverse gate voltage - 5 V P GM peak gate power - W P G(AV) average gate power over any ms period -. W T stg storage temperature 4 +5 C T j junction temperature - 5 C _ Product data sheet Rev. 6 February 8 of
3 .8 P tot (W).6..9 a =.57 aab T lead(max) ( C) conduction angle (degrees) α I T(AV) (A) form factor a Fig. α = conduction angle Total power dissipation as a function of average on-state current; maximum values aab499 I TSM (A) I T ITSM t p t T j(init) = 5 C max 3 number of cycles Fig. f = 5 Hz Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum values _ Product data sheet Rev. 6 February 8 3 of
4 3 aab497 I TSM (A) I T ITSM t p t T j(init) = 5 C max t p (s) Fig 3. t p ms Non-repetitive peak on-state current as a function of pulse width; maximum values aab449 aab45 I T(RMS) (A).5 I T(RMS) (A).8 () surge duration (s) T lead ( C) f = 5 Hz T lead = 83 C () T lead = 83 C Fig 4. RMS on-state current as a function of surge duration; maximum values Fig 5. RMS on-state current as a function of lead temperature; maximum values _ Product data sheet Rev. 6 February 8 4 of
5 5. Thermal characteristics Table 4. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit R th(j-lead) thermal resistance from junction to see Figure K/W lead R th(j-a) thermal resistance from junction to ambient printed circuit board mounted; lead length 4 mm K/W aab45 Z th(j-lead) (K/W) P t p δ = T t p t T t p (s) Fig 6. Transient thermal impedance from junction to lead as a function of pulse width _ Product data sheet Rev. 6 February 8 5 of
6 6. Characteristics Table 5. Characteristics T j =5 C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Static characteristics I GT gate trigger current V D = V; I T = ma; see Figure 8-5 µa I L latching current V D = V; I G =.5 ma; R GK =kω; - 6 ma see Figure I H holding current V D = V; I G =.5 ma; R GK =kω; - 5 ma see Figure V T on-state voltage I T =. A; see Figure V V GT gate trigger voltage I T = ma; see Figure 7 V D = V V V D =V DRM(max) ; T j = 5 C..3 - V I D off-state current V D =V DRM(max) ; T j = 5 C; R GK =kω -.5. ma Dynamic characteristics dv D /dt rate of rise of off-state voltage V DM =.67 V DRM(max) ; T j = 5 C; exponential waveform; see Figure R GK =kω 6 - V/µs gate open circuit - 5 V/µs.6 aab5 3 aab5 V GT I GT V GT(5 C) I GT(5 C) T j ( C) T j ( C) Fig 7. Normalized gate trigger voltage as a function of junction temperature Fig 8. Normalized gate trigger current as a function of junction temperature _ Product data sheet Rev. 6 February 8 6 of
7 5 aab454 3 aab53 I T (A) 4 I L I L(5 C) 3 () () (3).4..8 V T (V) T j ( C) Fig 9. V o =.67 V R s =.87 Ω () T j = 5 C; typical values () T j = 5 C; maximum values (3) T j = 5 C; maximum values On-state current as a function of on-state voltage Fig. R GK =kω Normalized latching current as a function of junction temperature 3 aab54 4 3aac3 I H I H(5 C) dv D /dt (V/µs) 3 () () T j ( C) 5 5 T j ( C) Fig. R GK =kω () R GK =kω () Gate open-circuit Normalized holding current as a function of junction temperature Fig. Critical rate of rise of off-state voltage as a function of junction temperature; typical values _ Product data sheet Rev. 6 February 8 7 of
8 7. Package outline Plastic single-ended leaded (through hole) package; 3 leads SOT54 c E d A L b D e e 3 b L.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A b b c D d E e e L L () max. mm Note. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities. OUTLINE VERSION REFERENCES IEC JEDEC JEITA SOT54 TO-9 SC-43A EUROPEAN PROJECTION ISSUE DATE Fig 3. Package outline SOT54 (TO-9) _ Product data sheet Rev. 6 February 8 8 of
9 8. Revision history Table 6. Revision history Document ID Release date Data sheet status Change notice Supersedes _ 86 Product data sheet - - _ Product data sheet Rev. 6 February 8 9 of
10 9. Legal information 9. Data sheet status Document status [][] Product status [3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [] Please consult the most recently issued document before initiating or completing a design. [] The term short data sheet is explained in section Definitions. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL 9. Definitions Draft The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 9.3 Disclaimers General Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer s own risk. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 634) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Quick reference data The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 9.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.. Contact information For more information, please visit: For sales office addresses, please send an to: salesaddresses@nxp.com _ Product data sheet Rev. 6 February 8 of
11 . Contents Product profile General description Features Applications Quick reference data Pinning information Ordering information Limiting values Thermal characteristics Characteristics Package outline Revision history Legal information Data sheet status Definitions Disclaimers Trademarks Contact information Contents Please be aware that important notices concerning this document and the product(s) described herein, have been included in section Legal information. For more information, please visit: For sales office addresses, please send an to: salesaddresses@nxp.com Date of release: 6 February 8 Document identifier: _
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