5334S Series. Features. Recommended Applications. Single Color φ5 Round Shape Type

Size: px

Start display at page:

Download "5334S Series. Features. Recommended Applications. Single Color φ5 Round Shape Type"

Justina Rice
5 years ago
Views:

Features Package φ5 Round shape type, EBG/BG,EPG/PG : Green Diffused epoxy EPY/PY,EAY/AY : Yellow Diffused epoxy EAA/AA : Orange Diffused epoxy EVR/VR,EBR/BR,PR : Red Diffused epoxy Product features

Storage Temperature :-30 ~100 Operating Temperature :-30 ~85 Lead free soldering compatible RoHS compliant Dominant wavelength Green : 558nm (EBG/BG), 567nm(EPG/PG) Yellow Green : 572nm (EPY/PY)

1 Features Package φ5 Round shape type, EBG/BG,EPG/PG : Green Diffused epoxy EPY/PY,EAY/AY : Yellow Diffused epoxy EAA/AA : Orange Diffused epoxy EVR/VR,EBR/BR,PR : Red Diffused epoxy Product features Outer Dimension φ5 Round shape type Operation temperature range. Storage Temperature :-30 ~100 Operating Temperature :-30 ~85 Lead free soldering compatible RoHS compliant Dominant wavelength Green : 558nm (EBG/BG), 567nm(EPG/PG) Yellow Green : 572nm (EPY/PY) Yellow : 590nm (EAY/AY) Orange : 606nm (EAA/AA) Red : 624nm (EVRVR) 647nm (EBR/BR) 630nm (PR) Half Intensity Angle EBG/BG,EPG/PG,EPY/PY,EAY/AY,EAA/AA,EVR/VR,PR : 28 deg. EBR/BR : 30 deg. Die materials Rank grouping parameter Soldering methods EBG/BG,EPG/PG, EPY/PY,PR : GaP EAY/AY,EAA/AA,EVR/VR : GaAsP EBR/BR : GaAlAs Sorted by luminous intensity per rank taping TTW (Through The Wave) soldering and manual soldering ESD Packing More than 2kV(HBM) Bulk : 200pcs(MIN.) Recommended Applications Amusement Equipment, Electric Household Appliances, OA/FA, Other General Applications Page 1

2 Color and Luminous Intensity (Ta=25 ) Part No. Material Emitted Color Lens Color Dominant Wavelength λd (nm) Luminous Intensity Iv (mcd) TYP. I F MIN. TYP. I F EBG/BG5334S GaP /5 15/10 20 Green Green EPG/PG5334S GaP /12 36/24 20 EPY/PY5334S GaP Yellow Green /15 45/30 20 Yellow EAY/AY5334S GaAsP Yellow /8 24/16 20 Diffused EAA/AA5334S GaAsP Orange Orange /8 24/16 20 EVR/VR5334S GaAsP /8 24/16 20 EBR/BR5334S GaAlAs Red Red /10 30/20 20 PR5334S GaP Page 2

3 Absolute Maximum Ratings (Ta=25 ) Absolute Maximum Ratings Item Symbol Unit EBG/BG EPG/PG EPY/PY EAY/AY EAA/AA EVR/VR EBR/BR PR Power Dissipation P d mw Continuous Forward Current I F ma Repetitive Peak Forward Current 1 I FRM ma Derating (Ta=25 or higher) I F ma/ Reverse Voltage V R V Operating Temperature T opr -30~+85 Storage Temperature T stg -30~ I FRM Measurement condition : Pulse Width 1ms., Duty 1/20. Page 3

4 Electro-Optical Characteristics(EBG/BG,EPG/PG,EPY/PY,EAY/AY,EAA/AA,EVR/VR,EBR/BR) (Ta=25 ) Characteristics Item Symbol Unit Conditions EBG/BG EPG/PG EPY/PY EAY/AY EAA/AA EVR/VR EBR/BR TYP Forward Voltage I F =20mA V F V MAX Reverse Current V R =4V I R MAX μa Peak Wavelength I F =20mA λ p TYP nm Dominant Wavelength Spectral Line Half Width Half Intensity Angle I F =20mA λ d TYP nm I F =20mA λ TYP nm I F =20mA 2θ1/2 TYP deg. Electro-Optical Characteristics(PR) (Ta=25 ) Characteristics Item Conditions Symbol PR Unit TYP. 2.1 Forward Voltage I F =10mA V F V MAX. 2.5 Reverse Current V R =4V I R MAX. 100 μa Peak Wavelength I F =10mA λ p TYP. 700 nm Dominant Wavelength Spectral Line Half Width Half Intensity Angle I F =10mA λ d TYP. 630 nm I F =10mA λ TYP. 100 nm I F =10mA 2θ1/2 TYP. 30 deg. Page 4

5 Luminous Intensity Rank (Ta=25 ) Rank BG PG PY AY AA VR BR I F =20mA I F =20mA I F =20mA I F =20mA I F =20mA I F =20mA I F =20mA MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX. A B C D E Please contact our sales staff concerning rank designation. I V (mcd) PR I F =10mA I V (mcd) Rank EBG EPG EPY EAY EAA EVR EBR I F =20mA I F =20mA I F =20mA I F =20mA I F =20mA I F =20mA I F =20mA MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX. C D E Page 5

6 Technical Data(EBG/BG) Spectral Distribution vs. Wavelength, I F = 20mA Spatial Distribution Example Wavelength [nm] Forward Voltage vs. Forward Current Forward Current vs. Forward Current I F (ma) Forward Voltage V F (V) Forward Current I F (ma) Page 6

7 Technical Data(EBG/BG) Derating Ambient Temperature vs. Maximum Forward Current Repetition Frequency : f 50Hz Ambient Temperature vs. Condition : I F =20mA Maximum Forward Current : I F MAX. (ma) Ambient Temperature vs. Forward Voltage Power Dissipation vs. Ambient Temperature Forward Voltage V F (V) Power Dissipation : Pd (mw) Page 7

8 Technical Data(EBG/BG) Dynamic Drive Rating Duty cycle vs. Maximum Forward Current Pulse Width vs. Maximum Tolerable Peak Current Maximum Forward Current : I F MAX. (ma) I F peak Max./I F DC MAX. Duty (%) Pulse Width : tw (μs) Page 8

9 Technical Data(EPG/PG) Spectral Distribution vs. Wavelength, I F = 20mA Spatial Distribution Example Wavelength [nm] Forward Voltage vs. Forward Current Forward Current vs. Forward Current I F (ma) Forward Voltage V F (V) Forward Current I F (ma) Page 9

10 Technical Data(EPG/PG) Derating Ambient Temperature vs. Maximum Forward Current Repetition Frequency : f 50Hz Ambient Temperature vs. Condition : I F =20mA Maximum Forward Current : I F MAX. (ma) Ambient Temperature vs. Forward Voltage Power Dissipation vs. Ambient Temperature Forward Voltage V F (V) Power Dissipation : Pd (mw) Page 10

11 Technical Data(EPG/PG) Dynamic Drive Rating Duty cycle vs. Maximum Forward Current Pulse Width vs. Maximum Tolerable Peak Current Maximum Forward Current : I F MAX. (ma) I F peak Max./I F DC MAX. Duty (%) Pulse Width : tw (μs) Page 11

12 Technical Data(EPY/PY) Spectral Distribution vs. Wavelength, I F = 20mA Spatial Distribution Example Wavelength [nm] Forward Voltage vs. Forward Current Forward Current vs. Forward Current I F (ma) Forward Voltage V F (V) Forward Current I F (ma) Page 12

Condition : I F =20mA Maximum Forward Current : I F MAX. (ma) Ambient Temperature vs.

13 Technical Data(EPY/PY) Derating Ambient Temperature vs. Maximum Forward Current Repetition Frequency : f 50Hz Ambient Temperature vs. Condition : I F =20mA Maximum Forward Current : I F MAX. (ma) Ambient Temperature vs. Forward Voltage Power Dissipation vs. Ambient Temperature Forward Voltage V F (V) Power Dissipation : Pd (mw) Page 13

14 Technical Data(EPY/PY) Dynamic Drive Rating Duty cycle vs. Maximum Forward Current Pulse Width vs. Maximum Tolerable Peak Current Maximum Forward Current : I F MAX. (ma) I F peak Max./I F DC MAX. Duty (%) Pulse Width : tw (μs) Page 14

15 Technical Data(EAY/AY) Spectral Distribution vs. Wavelength, I F = 20mA Spatial Distribution Example Wavelength [nm] Forward Voltage vs. Forward Current Forward Current vs. Forward Current I F (ma) Forward Voltage V F (V) Forward Current I F (ma) Page 15

16 Technical Data(EAY/AY) Derating Ambient Temperature vs. Maximum Forward Current Repetition Frequency : f 50Hz Ambient Temperature vs. Condition : I F =20mA Maximum Forward Current : I F MAX. (ma) Ambient Temperature vs. Forward Voltage Power Dissipation vs. Ambient Temperature Forward Voltage V F (V) Power Dissipation : Pd (mw) Page 16

17 Technical Data(EAY/AY) Dynamic Drive Rating Duty cycle vs. Maximum Forward Current Pulse Width vs. Maximum Tolerable Peak Current Maximum Forward Current : I F MAX. (ma) I F peak Max./I F DC MAX. Duty (%) Pulse Width : tw (μs) Page 17

18 Technical Data(EAA/AA) Spectral Distribution vs. Wavelength, I F = 20mA Spatial Distribution Example Wavelength [nm] Forward Voltage vs. Forward Current Forward Current vs. Forward Current I F (ma) Forward Voltage V F (V) Forward Current I F (ma) Page 18

19 Technical Data(EAA/AA) Derating Ambient Temperature vs. Maximum Forward Current Repetition Frequency : f 50Hz Ambient Temperature vs. Condition : I F =20mA Maximum Forward Current : I F MAX. (ma) Ambient Temperature vs. Forward Voltage Power Dissipation vs. Ambient Temperature Forward Voltage V F (V) Power Dissipation : Pd (mw) Page 19

20 Technical Data(EAA/AA) Dynamic Drive Rating Duty cycle vs. Maximum Forward Current Pulse Width vs. Maximum Tolerable Peak Current Maximum Forward Current : I F MAX. (ma) I F peak Max./I F DC MAX. Duty (%) Pulse Width : tw (μs) Page 20

21 Technical Data(EVR/VR) Spectral Distribution vs. Wavelength, I F = 20mA Spatial Distribution Example Wavelength [nm] Forward Voltage vs. Forward Current Forward Current vs. Forward Current I F (ma) Forward Voltage V F (V) Forward Current I F (ma) Page 21

22 Technical Data(EVR/VR) Derating Ambient Temperature vs. Maximum Forward Current Repetition Frequency : f 50Hz Ambient Temperature vs. Condition : I F =20mA Maximum Forward Current : I F MAX. (ma) Ambient Temperature vs. Forward Voltage Power Dissipation vs. Ambient Temperature Forward Voltage V F (V) Power Dissipation : Pd (mw) Page 22

23 Technical Data(EVR/VR) Dynamic Drive Rating Duty cycle vs. Maximum Forward Current Pulse Width vs. Maximum Tolerable Peak Current Maximum Forward Current : I F MAX. (ma) I F peak Max./I F DC MAX. Duty (%) Pulse Width : tw (μs) Page 23

24 Technical Data(EBR/BR) Spectral Distribution vs. Wavelength, I F = 20mA Spatial Distribution Example Wavelength [nm] Forward Voltage vs. Forward Current Forward Current vs. Forward Current I F (ma) Forward Voltage V F (V) Forward Current I F (ma) Page 24

25 Technical Data(EBR/BR) Derating Ambient Temperature vs. Maximum Forward Current Repetition Frequency : f 50Hz Ambient Temperature vs. Condition : I F =20mA Maximum Forward Current : I F MAX. (ma) Ambient Temperature vs. Forward Voltage Power Dissipation vs. Ambient Temperature Forward Voltage V F (V) Power Dissipation : Pd (mw) Page 25

26 Technical Data(EBR/BR) Dynamic Drive Rating Duty cycle vs. Maximum Forward Current Pulse Width vs. Maximum Tolerable Peak Current Maximum Forward Current : I F MAX. (ma) I F peak Max./I F DC MAX. Duty (%) Pulse Width : tw (μs) Page 26

27 Technical Data(PR) Spectral Distribution vs. Wavelength, I F = 10mA Spatial Distribution Example Wavelength [nm] Forward Voltage vs. Forward Current Forward Current vs. Forward Current I F (ma) Forward Voltage V F (V) Forward Current I F (ma) Page 27

Condition : I F =10mA Maximum Forward Current : I F MAX.

28 Technical Data(PR) Derating Ambient Temperature vs. Maximum Forward Current Repetition Frequency : f 50Hz Ambient Temperature vs. Condition : I F =10mA Maximum Forward Current : I F MAX. (ma) Ambient Temperature vs. Forward Voltage Power Dissipation vs. Ambient Temperature Forward Voltage V F (V) Power Dissipation : Pd (mw) Page 28

29 Technical Data(PR) Dynamic Drive Rating Duty cycle vs. Maximum Forward Current Pulse Width vs. Maximum Tolerable Peak Current Maximum Forward Current : I F MAX. (ma) I F peak Max./I F DC MAX. Duty (%) Pulse Width : tw (μs) Page 29

30 Package Dimensions (Unit: mm) Weight : (0.34)g (1) Page 30

31 TTW (Through The Wave) soldering Conditions Pre-heating 100 (MAX.) Solder Bath Temp. Dipping Time s (MAX.) (MAX.) 1) The dip soldering process shall be 2 times maximum. 2) The product shall be cooled to room temp. before the second dipping process. The detail is described to LED and Photodetector handling precautions of home page: "Mounting through-hole Type Devices and "Soldering", and use it after the confirmation, please. Manual Soldering Conditions Iron tip temp. 360 (MAX.) Soldering time and frequency 3 s 2 times (MAX.) (MAX.) The detail is described to LED and Photodetector handling precautions of home page: "Mounting through-hole Type Devices and "Soldering", and use it after the confirmation, please. Page 31

32 Reliability Testing Result Reliability Testing Result Room Temp. Operating Life Resistance to Soldering Heat Temperature Cycling Wet High Temp. Storage Life High Temp. Storage Life Low Temp. Storage Life Lead Tension Vibration, Variable Frequency Applicable Standard Testing Conditions Duration Failure EIAJ ED- 4701/100(101) EIAJ ED- 4701/300(302) EIAJ ED- 4701/100(105) EIAJ ED- 4701/100(103) EIAJ ED- 4701/200(201) EIAJ ED- 4701/200(202) EIAJ ED- 4701/400(401) EIAJ ED- 4701/400(403) Ta = 25, IF = Maxium Rated Current 1,000 h 0/25 260±5, 3mm from package base 10s 0/25 Minimum Rated Storage Temperature(30min) ~Normal Temperature(15min) ~Maximum Rated Storage Temperature(30min) ~Normal Temperature(15min) 5 cycles 0/25 Ta = 60±2, RH = 90±5% 1,000 h 0/25 Ta = Maximum Rated Storage Temperature 1,000 h 0/25 Ta = Minimum Rated Storage Temperature 1,000 h 0/25 10N,1time ( 0.4 and Flat Package : 5N) 10s 0/ m/s 2 (10G), 100 ~ 2KHz sweep for 20min., XYZ each direction 2 h 0/10 Failure Criteria Items Symbols Conditions Failure criteria Luminous Intensity Forward Voltage Reverse Current Iv VF IF Value of each product Luminous Intensity IF Value of each product Forward Voltage VR = Maximum Rated Reverse Voltage V Cosmetic Appearance - - IR Testing Min. Value < Spec. Min. Value x 0.5 Testing Max. Value Spec. Max. Value x 1.2 Testing Max. Value Spec. Max. Value x 2.5 Occurrence of notable decoloration, deformation and cracking Page 32

33 Special Notice to Customers Using the Products and Technical Information Shown in This Data Sheet 1) The technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. It does not constitute the warranting of industrial property nor the granting of any license. 2) For the purpose of product improvement, the specifications, characteristics and technical data described in the data sheets are subject to change without prior notice. Therefore it is recommended that the most updated specifications be used in your design. 3) When using the products described in the data sheets, please adhere to the maximum ratings for operating voltage, heat dissipation characteristics, and other precautions for use. We are not responsible for any damage which may occur if these specifications are exceeded. 4) The products that have been described to this catalog are manufactured so that they will be used for the electrical instrument of the benchmark (OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument). The application of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. needs a high reliability and safety, and the breakdown and the wrong operation might influence the life or the human body. Please consult us beforehand if you plan to use our product for the usages of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. except OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument. 5) In order to export the products or technologies described in this data sheet which are under the Foreign Exchange and Foreign Trade Control Law, it is necessary to first obtain an export permit from the Japanese government. 6) No part of this data sheet may be reprinted or reproduced without prior written permission from Stanley Electric Co., Ltd. 7) The most updated edition of this data sheet can be obtained from the address below: Page 33

KR3804X. Features. Recommended Applications. Single Color φ3 Flush Mount Round Shape Type. φ3 Round shape type, Water Clear epoxy.

KR3804X. Features. Recommended Applications. Single Color φ3 Flush Mount Round Shape Type. φ3 Round shape type, Water Clear epoxy. Features Package φ3 Round shape type, Water Clear epoxy Product features Outer Dimension φ3 Round shape type Operation temperature range. Storage Temperature :-30 ~100 Operating Temperature :-30 ~85 Lead