MU20 Series. Features. Recommended Applications. Single Color / Light Bar Module. Light emitting surface (Outer size) 5 x 9 mm (6 x 10 mm) (L x W)

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1 Features Light emitting surface (Outer size) Product features 5 x 9 mm (6 x 0 mm) (L x W) Single Color (Green, Yellow Green, Orange or Red) Lead free soldering compatible RoHS compliant Peak wavelength Green Yellow Green Orange Red : 555 nm : 570 nm : 605 nm : 660 nm Die materials Green, Yellow Green : GaP Orange : GaAsP Red : GaAlAs Soldering methods Soldering methods Packing TTW (Through The Wave) soldering and manual soldering More than 2kV(HBM) Plastic bag Recommended Applications Electric Household Appliances, OA/FA, Other General Applications Page

2 Color and Luminous Intensity L uminous Inte nsity Part No. Material Emitted Color Resin Color Iv (mcd) MIN. T YP. I F MU20-50 Ga P Green Green MU Ga P Milky White MU20-40 Ga P Yellow Yellow Green MU Ga P Milky White MU20-30 Ga AsP Ora nge Ora nge MU Ga AsP Milky White MU20-20 Ga AlAs Red Red MU Ga AlAs Milky White Numbe r of Chips Abs olute Maximum R atings (Ta=25 ) Item Power Dissipation Forward Current Pulse Forward Current De ra ting (Ta=25 or higher) Reverse Voltage Operating Temperature Storage Temperature Symbol P d I F I FRM I FRM Measurement condition : Pulse Width 2ms, Duty /5 Absolute Maximum Ratings Unit mw ma ma I F ma/ I FRM ma/ V R V T opr -40~ +85 T stg -40~ Electro-Optical Characteristics (Ta=25 ) Item Characteristics Symbol Conditions Unit Forward Voltage I F =20mA V F TYP MAX V Reverse Current V R =4V I R MAX μa Peak Wavelength I F =20mA λp TYP nm Spectral Line Half Width I F =20mA λ TYP nm Page 2

3 Technical Data(50/505) Forward Voltage vs. Forward Current Ambient Temperature vs. Forward Voltage Forward Current vs. Ambient Temperature vs. Condition : I F =20mA Page 3

4 Technical Data(50/505) Derating Ambient Temperature vs. Maximum Forward Current Repetition Frequency : f 00Hz Power Dissipation vs. Ambient Temperature Power Dissipation : Pd (mw) Pulse Width vs. Maximum Tolerable Peak Current Dynamic Drive Rating Duty cycle vs. Maximum Forward Current I F peak Max./I F DC MAX. Pulse Width : tw (μs) Duty (%) Page 4

5 Technical Data(40/405) Forward Voltage vs. Forward Current Ambient Temperature vs. Forward Voltage Forward Current vs. Ambient Temperature vs. Condition : I F =20mA Page 5

6 Technical Data(40/405) Derating Ambient Temperature vs. Maximum Forward Current Repetition Frequency : f 00Hz Power Dissipation vs. Ambient Temperature Power Dissipation : Pd (mw) Pulse Width vs. Maximum Tolerable Peak Current Dynamic Drive Rating Duty cycle vs. Maximum Forward Current I F peak Max./I F DC MAX. Pulse Width : tw (μs) Duty (%) Page 6

7 Technical Data(30/305) Forward Voltage vs. Forward Current Ambient Temperature vs. Forward Voltage Forward Current vs. Ambient Temperature vs. Condition : I F =20mA Page 7

8 Technical Data(30/305) Derating Ambient Temperature vs. Maximum Forward Current Repetition Frequency : f 00Hz Power Dissipation vs. Ambient Temperature Power Dissipation : Pd (mw) Pulse Width vs. Maximum Tolerable Peak Current Dynamic Drive Rating Duty cycle vs. Maximum Forward Current I F peak Max./I F DC MAX. Pulse Width : tw (μs) Duty (%) Page 8

9 Technical Data(20/205) Forward Voltage vs. Forward Current Ambient Temperature vs. Forward Voltage Forward Current vs. Ambient Temperature vs. Condition : I F =20mA Page 9

10 Technical Data(20/205) Derating Ambient Temperature vs. Maximum Forward Current Repetition Frequency : f 00Hz Power Dissipation vs. Ambient Temperature Power Dissipation : Pd (mw) Pulse Width vs. Maximum Tolerable Peak Current Dynamic Drive Rating Duty cycle vs. Maximum Forward Current I F peak Max./I F DC MAX. Pulse Width : tw (μs) Duty (%) Page 0

11 Package Dimensions (Unit: mm) (Tolerance:±0.25 mm) mark : The measure of lead root Page

12 TTW (Through The Wave) soldering Conditions Pre-heating Solder Bath Temp. Dipping Time s s (MAX.) Resin surface temperature (MAX.) (MAX.) (MAX.) Position At least 3.0 mm away from the root of lead ) The dip soldering process shall be 2 times maximum. 2) The product shall be cooled to normal temperature before the second dipping process. Manual Soldering Conditions Iron tip temp. 360 (MAX.) Soldering time and frequency Position 3 s 2 times (MAX.) (MAX.) At least 3.0 mm away from the root of lead Page 2

13 Reliability Testing Result Reliability Testing Result Applicable Standard Testing Conditions Duration Failure Room Temp. Operating Life Resistance to Soldering Heat Temperature Cycling Wet High Temp. Storage Life High Temp. Storage Life Low Temp. Storage Life Lead Tension Vibration, Variable Frequency Lead Bend Shock 470/00(0) 470/300(302) 470/00(05) 470/00(03) 470/200(20) 470/200(202) 470/400(40) 470/400(403) 470/400(40) JIS C 720 A-8 Ta = 25, IF = Maxium Rated Current,000 h 0/0 260±5, 3mm from package base 0s 0/0 Minimum Rated Storage Temperature(30min) ~Normal Temperature(5min) ~Maximum Rated Storage Temperature(30min) ~Normal Temperature(5min) 5 cycles 0/0 Ta = 60±2, RH = 90±5%,000 h 0/0 Ta = Maximum Rated Storage Temperature,000 h 0/0 Ta = Minimum Rated Storage Temperature,000 h 0/0 5N,time 0s 0/0 98.m/s 2 (0G), 00 ~ 2KHz sweep for 20min., XYZ each direction 2 h 0/0 2.5N, 0 90 Twice 0/0 It falls on wood engraving from height of 75cm. 3 times 0/0 Failure Criteria Items Symbols Conditions Failure criteria Luminous Intensity Iv I F=20mA Testing Min. Value < Spec. Min. Value x 0.5 Forward Voltage VF I F=20mA Testing Max. Value Spec. Max. Value x.2 Reverse Current IR V R=4V Testing Max. Value Spec. Max. Value x 2.5 Cosmetic Appearance - - Occurrence of notable decoloration, deformation and cracking Page 3

14 Special Notice to Customers Using the Products and Technical Information Shown in This Data Sheet ) The technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. It does not constitute the warranting of industrial property nor the granting of any license. 2) For the purpose of product improvement, the specifications, characteristics and technical data described in the data sheets are subject to change without prior notice. Therefore it is recommended that the most updated specifications be used in your design. 3) When using the products described in the data sheets, please adhere to the maximum ratings for operating voltage, heat dissipation characteristics, and other precautions for use. We are not responsible for any damage which may occur if these specifications are exceeded. 4) The products that have been described to this catalog are manufactured so that they will be used for the electrical instrument of the benchmark (OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument). The application of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. needs a high reliability and safety, and the breakdown and the wrong operation might influence the life or the human body. Please consult us beforehand if you plan to use our product for the usages of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. except OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument. 5) In order to export the products or technologies described in this data sheet which are under the Foreign Exchange and Foreign Trade Control Law, it is necessary to first obtain an export permit from the Japanese government. 6) No part of this data sheet may be reprinted or reproduced without prior written permission from Stanley Electric Co., Ltd. 7) The most updated edition of this data sheet can be obtained from the address below: Page 4