Recent developments on. Micro-Pattern Gaseous Detectors

Transcription

1 Recent developments on 0.18 mm CMOS VLSI Micro-Pattern Gaseous Detectors CMOS high density readout electronics Ions 40 % 60 % Electrons Micromegas GEM THGEM MHSP Ingrid Matteo Alfonsi (CERN)

2 Outline Introduction on MPGD GEM and MicroMegas Latest developments Large Area detectors RD51 collaboration IFAE - Bari 16/04/2009 M. Alfonsi (CERN) 2

3 Limitations on MWPC Space charge build-up at high particle rate, due to slow motion of ions, results in a deformation of the field, leading to e.g. a reduction of gain or a distortion of the drift paths. GAIN DROP ABOVE ~ 10 4 mm -2 s -1 SPACE CHARGE: DRIFT DISTORTIONS From F. Sauli presentation at TIPP09 IFAE - Bari 16/04/2009 M. Alfonsi (CERN) 3

4 Micro Strip Gas Chambers (1) A.Oed, Nucl. Instr. and Meth. A263(1988)351 Small pitch (~100 µm between anodic and cathodic strips): fast ion collection on cathodic strips resolution ~ 50 µm, two-track resolution ~ 500 µm high rate capability ~ 10 6 mm -2 s -1 DRIFT ELECTRODE ANODE STRIP Standard photolitographic production process > 10 6 /mm 2 s ~100 μm INSULATING SUBSTRATE CATHODE STRIPS R. Bouclier et al, Nucl. Instr. and Meth. A323(1992)240 IFAE - Bari 16/04/2009 M. Alfonsi (CERN) 4

5 Micro Strip Gas Chambers (2) MSGC can discharge in hostile environment, due to the higher field present at the strip edges close to the interface with the insulating substrate discharges can heavily damage the strips special modifications, such as resistive substrate or passivation of the edges, can solve the problem (see R. Bellazzini et al., Nucl. Instr. and Meth. A 457 (2001) 22. ) CERN-GDD IFAE - Bari 16/04/2009 M. Alfonsi (CERN) 5

6 Micro-Pattern Gaseous Detectors MICRO-PIXEL CHAMBER Produced with standard photolitographic process Ochi et al NIMA471(2001)264 From F. Sauli presentation at RD51 collaboration meeting at NIKHEF MICRO-PIN ARRAY (MIPA) IFAE - Bari 16/04/2009 P. Rehak et al TNS NS47(2000)1426 M. Alfonsi (CERN) 6

7 Full freedom on readout layout! Gas Electron Multiplier 70 µm 140 µm 50 µm Produced by standard PCB-like photolitographic process In a Gas Electron Multiplier (GEM), holes act as multiplication channels for gaseous detectors. Cu 5 µm Kapton 50 µm Cu 5 µm Cartesian Compass, LHCb Small angle GEM foils can be cascaded: a Triple-GEM detector is built by inserting three GEM foils between two planar electrodes, which act as the drift cathode and the readout anode. Conversion & Drift Hexaboard, pads MICE Mixed Totem IFAE - Bari 16/04/2009 M. Alfonsi (CERN) 7

8 GEM: rate capability, discharges studies S. Bachmann et al, Nucl. Instr. and Meth. A479(2002)294 GAIN RATE CAPABILITY No gain loss up to ~3 MHz mm -2 DISCHARGE PROBABILITY ON Hz mm -2 Q~10 7 Q~10 8 Q~10 9 J. Benlloch et al, IEEE NS-45(1998)234 IFAE - Bari 16/04/2009 M. Alfonsi (CERN) 8

9 MICRO MEsh GAseous Structure A thin mesh very close ( μm) to the anode defines the multiplication gap. Insulating pillars substain the mesh Y. Giomataris et al, Nucl. Instr. and Meth. A376(1996)239 few mm ~ 100μm IFAE - Bari 16/04/2009 M. Alfonsi (CERN) 9

10 MICROMEGAS performance Excellent energy and spatial resolution can be obtained with the suitable gas mixture and proper geometry IFAE - Bari 16/04/2009 M. Alfonsi (CERN) 10

11 Current and future trends on MPGD COMPASS NA48 / KABES CAST (CERN Axial Solar Telescope) ntof (neutron beam profiles) Laser MegaJoule DEMIN (inertial confinement fusion) Picollo (in-core neutron measurement) T2K Time Projection Chamber Linear Collider TPC (?) ATLAS Muon System Upgrade (?) COMPASS LHCb Muon Detector TOTEM Telescope HBD (Hadron Blind Detector) Cascade neutron detection NA49 - upgrade X-Ray Polarimeter (XEUS) GEM TPC for LEGs, BoNuS Linear Collider TPC (?) KLOE2 vertex detector (?) IFAE - Bari 16/04/2009 M. Alfonsi (CERN) 11

12 Latest developments

13 Cylindrical GEM detectors L. Ropelewski, Vienna Instr. Conf G. Bencivenni, RD51 Workshop (Paris Oct. 2009) IFAE - Bari 16/04/2009 M. Alfonsi (CERN) 13

14 Bulk-Micromegas Micromegas is produced together with the readout board Bulk-Micromegas for T2K TPC (A. Delbart at TIPP09) ENERGY RESOLUTION ON 55 Fe: Frame Read-out board Laminated Photoimageable coverlay Stretched mesh on frame Laminated Photoimageable coverlay Exposure Development + cure GAIN UNIFORMITY: ~ 2% RMS IFAE - Bari 16/04/2009 M. Alfonsi (CERN) 14

15 ANODE CURRENT PHOTOCURRENT (pa) Current on th CsI THGEM (pa) Photodetection with THGEM Thicker version of GEM, realized on standard PCB, usually by mechanical perforation CsI deposited on top electrode Closed geometry photo-detector: Suppression of photon feedback Reduction of ion feedback CH 4 Ar-CO 2 E (V/cm) CH /20 Ar/CH Ar/CO 24, 70/30 66/ /23 Ne/CH CH 4 4, 62/38 Ar/CO 2, 70/30 Atmosheric pressure; flushing; Leszek's chamber E/p (V/cm/bar) See E. Rocco s talk DRIFT FIELD (kv/cm) IFAE - Bari 16/04/2009 M. Alfonsi (CERN) 15

16 MPGD with resistive electrodes RESISTIVE ANODE: CHARGE DISPERSION READOUT RETGEM: RESISTIVE ELECTRODE THICK GEM mesh resistive foil glue pads PCB M. Dixit et. al, Nucl. Instr. and Meth. A581, 254 (2007) copper oxide layer GAIN OF RETGEM IN VARIOUS GASES: POSITION ACCURACY ~ 50μm A. Di Mauro et al, Nucl. Instr. and Meth. A581(2007)225 IFAE - Bari 16/04/2009 M. Alfonsi (CERN) 16

17 Integration MPGD + electronics MPGD built directly over the silicon pixel readout chip. Single electron detection due to high gain and small pixel size. A resistive silicon layer over the active chip protects for discharges induced by α particles. SINGLE MICROMEGAS ELECTRON TRACKS FROM 90 Sr IN MAGNETIC FIELD (0.2 T): TWO-STAGES (INGRID) H. Van der Graaf, IEEE Nucl. Sci. Symp. Conf. Rec. (Dresden, October 2008) IFAE - Bari 16/04/2009 M. Alfonsi (CERN) 17

18 Large Area detectors

19 Single mask GEM tecnique No masks alignment problem (as in double mask technique): Maximum size: 450mm (due to raw material) x 100 meters! Holes profiles are conical On-going effort for the quality improvement On-going studies on the effects of conicality w.r.t. a cylindral shape Raw material Single side copper patterning Chemical polyimide etching Chemical copper reduction IFAE - Bari 16/04/2009 M. Alfonsi (CERN) 19

20 Single mask technique & foil splicing: first prototype The limit in width (~45 cm) due to the available material is overcome splicing together two foils, with a ~3 mm wide local efficiency loss TWO-SECTORS TRIPLE-GEM PROTOTYPE FOR TOTEM T1 UPGRADE (60x60 cm 2 ) 60 cm S. Duarte Pinto et al, IEEE Nucl. Sci. Symp. Conf. Rec. (Dresden, Oct. 2008) IFAE - Bari 16/04/2009 M. Alfonsi (CERN) 20

21 Large THGEM, Large Micromegas 600x600mm 2 THGEM@ INFN Trieste 2000x1000mm 2 stretched mesh For ATLAS Muon system upgrade For COMPASS RICH upgrade R. De Oliveira, RD51 Meeting (Jan. 2009) IFAE - Bari 16/04/2009 M. Alfonsi (CERN) 21

22 Summary and.. MPGD are nowadays well-established technologies New structures are under developments, as well as new studies to increase the maximum size of such detectors Such R&D projects can take advantages by the sharing of the resourses and the infrastructures, and many groups joined in an international collaboration... IFAE - Bari 16/04/2009 M. Alfonsi (CERN) 22

23 RD51: development of MPGD technologies Collaboration of ~60 institutes worldwide. Approved by CERN s Research Board December 5, 2008 Collaboration Board Chair: Silvia Dalla Torre Spokesman: Leszek Ropelewski, Maxim Titov RD51 aims at facilitating the development of advanced gas-avalanche detector technologies and associated electronic-readout systems, for applications in basic and applied research. Workshops: Amsterdam April 16-18, Paris, October 13-15, Crete (Greece), June 12-16, IFAE - Bari 16/04/2009 M. Alfonsi (CERN) 23

24 RD51 organization IFAE - Bari 16/04/2009 M. Alfonsi (CERN) 24

25 Backup slides

26 MPGD in HEP now Micromegas and triple-gem detectors in COMPASS experiment at CERN are taking data since several years without change of performance Two LHC experiments, LHCb and TOTEM, include triple-gem detectors in the apparatus 2.9ns r.m.s. TOTEM T2 telescope Time resolution of a LHCb GEM station, composed by two triple-gem chambers in OR, used by level-0 trigger IFAE - Bari 16/04/2009 M. Alfonsi (CERN) 26

27 MSGC: STRIP EDGE FIELDS The electric field at the edge of the strips is strongly affected by the resistivity of the support: J.J. Florent et al, Nucl. Instr. And Meth. A329(1993)125 =10 15 cm R. Bouclier et al, Nucl. Instr. ad Meth. A365(1995)65 =10 9 cm Very large signal observed in the charge spectrum, due to ionization very close to cathodic strips edges IFAE - Bari 16/04/2009 M. Alfonsi (CERN) 27