Product Specifications AN7522N. Silicon Monolithic Bipolar IC. Low Frequency Amplifier

Transcription

1 ANN A Structure Silicon Monolithic Bipolar IC Appearance Application Function SIL Pin Plastic Package (Power Type with Fin) Low Frequency Amplifier BTL.0W x ch Power Amplifier with Standby Function and Volume Function A Absolute Maximum Ratings No. Item Symbol Ratings Unit Note Storage Temperature Tstg ~ 0 C Operating Ambient Temperature Topr ~ 0 C Operating Ambient Pressure Operating Constant Acceleration Operating Shock Popr Gopr Sopr.0x0 ±0.x0 (.0±0.),80 (000),00 (00) Pa (atm) m/s (G) m/s (G) Supply Voltage Vcc. V Supply Current Icc.0 A 8 Power Dissipation P D. W Ta=0 C Operating Supply Voltage Range Vcc.V ~.V Note ) ) The temperature of all items shall be Ta= C except storage temperature and operating ambient temperature. At no signal input. APR000 JUL000 FMSCPSDA000

2 ANN B B No Item Electrical Characteristics Quiescent Circuit Current Symbol Test Circuit ICQ (Unless otherwise specified, the ambient temperature is C± C, Vcc=8.0V, frequency=khz and RL=8Ω.) Conditions Vin=0V, Vol=0V min Limits typ max 00 Unit ma Note Standby Current ISTB Vin=0V, Vol=0V 0 µa Output Noise Voltage VNO Rg=0kΩ, Vol=0V mvrms Voltage Gain GV Po=0.W, Vol=.V Total Harmonic Distortion THD Po=0.W, Vol=.V % Maximum Power Output PO THD=0%, Vol=.V..0 W Maximum Power Output PO Vcc=V THD=0%, Vol=.V.0.0 W 8 Ripple Rejection Ratio RR Rg=0kΩ, Vol=0V Vr=0.Vrms, fr=0hz 0 0 Output Offset Voltage Voff Rg=0kΩ, Vol=0V mv 0 Volume Attenuation Ratio Att Po=0.W, Vol=0V 0 8 Channel Balance CB Po=0.W, Vol=.V 0 Channel Balance CB Po=0.W, Vol=0.V 0 Middle Voltage Gain GVm Po=0.W, Vol=0.V 0... Channel Crosstalk CT Po=0.W, Vol=.V 0 Note ) For this measurement, use the BPF = Hz ~ 0kHz (/OCT). APR000 JUL000 FMSCPSDA000

3 (Reference Data for Design) ANN B B No Item Electrical Characteristics Standby pin current Symbol Test Circuit ISTB (Unless otherwise specified, the ambient temperature is C± C, Vcc=8.0V, frequency=khz and RL=8Ω.) Conditions min Vin=0V, VSTB=V Limits typ max Unit µa Note Volume pin current IVOL Vin=0V, Vol=0V µa Input Impedance Zi Vin=±0.VDC 0 kω Note) The above characteristics are reference values determined for IC design, but not guaranteed values for shipping inspection. If problems were to occur, counter measures will be sincerely discussed. APR000 JUL000 FMSCPSDA000

4 (Description of test circuit and test method) Test Circuit ANN C ANN 8 0µ.0µ 0µ 0k OUT 8Ω 8k 0k.0µ 0k 0 OUT 8Ω Vcc V Vin Vin.V 0V Standby 0V Volume Note) If the standby pin is open or 0V, the IC is on standby state. The IC is in the state of volume minimum if the Volume pin is ground. The IC is in the state of volume maximum if the Volume pin is open. APR000 JUL000 FMSCPSDA000

5 Prepared ANN D Circuit Function Block Diagram 8 Vcc Output GND Input GND 0 Output GND Pin Descriptions Pin No. Description Vcc Ch. Output () GND (Ch. Output) Ch. Output () Standby Ch. Input Pin No. Description GND (Input) 8 Ch. Input Volume 0 Ch. Output () GND (Ch. Output) Ch. Output () APR000 JUL000 FMSCPSDA000

6 ANN E Package Name FPS Unit : mm.. ± 0.. ± 0..8 ± 0.. ± ± 0.. ± ± ±0. R ± 0.. ± 0. Company insignia Name of item Date Code APR000 JUL000 FMSCPSDA000

7 ANN F (Structure Description) Chip surface passivation SiN, PSG, Lead frame material Fe group, Cu group,, Inner lead surface process Ag plating, Au plating, Outer lead surface process Solder plating, Solder dip, Chip mounting method Ag paste, AuSi alloy, Solder, Wire bonding method Thermalsonic bonding, Wire material, Diameter Au, Diameter 8 µm Mold material Epoxy, Molding method Transfer mold, Multiplunger mold, Fin material Cu Group Package FPS APR000 JUL000 FMSCPSDA000

8 (Technical Data) ANN G 8 ( Rth(jc) = C/W ) Rth(ja) =. C/W FPS Package Power Dissipation PD Ta C/W heat sink 0 Power Dissipation, PD (W) 8 0 C/W heat sink 0 C/W heat sink Single Package Without heat sink Rthja=. C/W Ambient Temperature, Ta ( C) APR000 JUL000 FMSCPSDA000

9 (Technical Data) ANN G (Precautions for use) ) Make sure that the IC is free of any pin shortcircuiting, ground short, and load shortcircuiting. ) Ground the radiation fin so that there will be no difference in electric potential between the radiation fin and ground. ) The thermal protection circuit operates at a Tj of approximately 0 C. The thermal protection circuit is reset automatically when the temperature drops. ) Make sure that the heat radiation design is effective enough if the Vcc is comparatively high or the IC operates high output power. ) Connect only ground pin for signal sources to the signal GND pin of the amplifier on the previous stage. ) The electric surge voltage for this IC low, therefore be extra careful when using the following pin (at 00pF): Pin =0V, Pin =0V, Pin =0V, Pin 8=0V APR000 JUL000 FMSCPSDA000